• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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• pp.214-217
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• 2009

본 논문에서는 고출력 LED 투광등의 방열 기술 동향을 살펴본다. 이를 위해 LED 방열에 사용되는 대표적 기술로서 LED 패키지 방열 기술, 공랭식 방열 기술, 수냉식 방열 기술, 열전 소자 방열 기술에 대한 기술적 특징을 분석하고 각각의 국내외 관련 기술 개발 현황을 제시한다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.324-329
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• 2008

The liquid cooling effect of a natural convection type radiator by using the PCM has been investigated experimentally. The radiator size is $423{\times}295{\times}83$ mm and PCM container size is $398{\times}270{\times}26$ mm. The objective is elapsed time higher than maximum time to reach for maximum operating temperature of a general liquid cooling radiator. This study, in order to study on the effects of the phase-change phenomenon, carried out the various mass flow rate, input electric power, ambient and melting point of three type PCM. For the above experimental parameter, the melting time was performed about 180/250/560 min at input power 150 W and ambient $30^{\circ}C$ from using the three type PCM(PCM_S1/S2/S3) respectively. Furthermore, the effects of the thermal dissipation was decreased higher input power than lower input power at heating block and melting time of PCM. However, the effects of mass flow rate did not nearly affect of the thermal performance especially.

• 설비공학논문집
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• 제18권6호
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2012년도 제45회 KOSCO SYMPOSIUM 초록집
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• pp.49-51
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• 2012

In this paper, the integration issue, such as an air-side integration design between the gas turbine and air separation unit, is described and analyzed by the exergy and energy balance of the combined-cycle power block in an IGCC power plant. The results showed that the net power of the system was almost same, but that of the gas turbine was decreased as the integration degree increased. The highest exergy loss was occurred in the combustor of gas turbine, which was affected by the chemical reaction, heat conduction, mass diffusion, and viscous dissipation.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• 대한기계학회논문집
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• 제14권3호
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• pp.676-684
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• 1990

본 연구에서는 다공성 매질을 이용하여 예혼합기체를 맥동연소시킬 때의 진동 특성, 열적특성 및 연소특성에 관한 것이다. 먼저, 맥동의 모우드형상 및 발생조건 을 열전달과 음향이론을 바탕으로하여 예측하고 실험을 통하여 검토하였다. 또한 맥 동에 의한 화염형상의 변화를 가시화하여 관측하고, 온도분포 및 배기가스의 조성등을 측정하여 맥동 연소와 비맥동 연소를 비교 고찰하였다.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.35-41
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• 2016

고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.

• Journal of Power Electronics
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• 제13권5호
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• pp.779-786
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• 2013

A highly efficient sustaining driver is proposed for plasma display panels (PDPs). When the PDP is charged and discharged, the proposed sustaining driver employs an address voltage source used in an addressing period. A voltage source is used for fully charging the panel to the sustaining voltage, and an initial inductor current helps the panel discharge to 0 V. The resonance between the panel and an inductor is made by shifting the voltage and current bias level when charging and discharging the panel. As a result, the proposed circuit can reduce power consumption, switching loss, heat dissipation, and production cost. Experimental results of a 42-inch PDP are provided to verify the operation and features of the proposed circuit.

• 유공압시스템학회논문집
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• 제6권4호
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• pp.24-32
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• 2009

For a design of on/off solenoid actuator for valve actuating, designer must have the experimental knowledge as well as general electromagnetic formulas to design object. It is possible for theoretical knowledge to do the out-line design, but it is impossible to optimal design without experimental knowledge which only can be achieved through many repeated experiments. In addition, in present on/off type solenoid actuator field, the smaller, lightening, lower consumption power, high response time are effected as the most important design factor. So, experimental knowledge is more needed for optimal design of solenoid actuator. In this study, we derived the governing equations for optimal design of on/off solenoid actuator for valve actuating and developed a design program composed electromagnetic theories and experimental parameter values for inexperienced designers. And we proved the propriety of this program by experiments.