• Journal of the Korea Institute of Military Science and Technology
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• v.22 no.2
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• pp.249-254
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• 2019

A Digital Transmitter/Receiver Module(DTRM), which is an essential part in active phased-array radar systems, generates a high heat density, and needs to be properly cooled for stable operation. A tile-type DTRM that is a stacking structure of multi-layer components was modeled with simplification and heat dissipation characteristics of the DTRM model were studied using computational fluid dynamics(CFD) simulations. Most of the heat was dissipated by the heat conduction through the cold plate, but the heat transfer by the forced convection on top of the DTRM also was found to play an important role in the thermal management. Under the given conjugated heat transfer environment, the DTRM was confirmed to secure a stable operating temperature range.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.8
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• pp.686-691
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• 2016

This paper employs numerical tools to obtain an optimal thermal design of a heat exchanger with plain-fins. This heat exchanger is located at the condensing section of a crevice-type heat pipe. The plain-fins in the heat exchanger are radically mounted to two tubes in the condensing section. To obtain the optimal design parameters, a computational fluid dynamics technique is introduced and applied to different placement configurations in a system module. Owing to its effects on the heat pipe performance, the temperature difference between the tube surfaces and ambient air is investigated in detail. A greater heat dissipation rate occurs when the plain-fin offsets change from 2 to 3 mm. When this temperature difference is ${\Delta}T=70^{\circ}C$, the upper part of the plain-fins undergoes an accumulation of heat. At below $70^{\circ}C$, the dissipation of heat is accepted. A rectangular plain-fin geometry with varying widths and heights does not have a significant impact on the heat dissipation through-out the overall system. In addition, the temperature distributions between different plain-fin pitches show an equal profile even with different fin pitches.

• Progress in Superconductivity and Cryogenics
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• v.19 no.4
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• pp.18-21
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• 2017

We report a method for improving heat exchange between cryo-cooled large-power-dissipation devices and liquid cryogen. Micro-machined monolithic heat sinks were fabricated on a high integration density superconducting Josephson device, and studied for their effect on cooling the device. The monolithic heat sink showed a significant enhancement of cooling capability, which markedly improved the device operation under large dc- and microwave power dissipation. The detailed mechanism of the enhancement still needs further modeling and experiments in order to optimize the design of the heat sink.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Proceedings of the KIPE Conference
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• 2003.07a
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• pp.10-14
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• 2003

This paper deals with the design of heat dissipation system using the forced air cooling method. It suggests the method of appropriately dividing the whole thermodynamic system into analytical subsystems and also presents the correspondent analytic or experimental equations to subsystems. The experimental results on the designed thermodynamic system for 400kw 1GBT inverter show the validity of the proposed design method in the steady state.

• Design & Manufacturing
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• v.13 no.3
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• pp.24-28
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• 2019

In this study, a study was carried out that could effectively produce a heat dissipation effect on plastic materials. Using carbon nanotube (CNT), aluminum powder and plastic, the material properties were tested in 2 cases of compounding ratio. The test sample mold was designed and constructed prior to the experiment. The experiments include tensile strength, elongation rate, flexural strength, flexural elasticity rate, eye-jaw impact strength, gravity and thermal conductivity. Results from 60% and 70% mixture of aluminium to plastic were tested, and a 10% less combined result was a relatively good property. For research purposes, the heat dissipation effect and light weighting obtained a good measure when the combined amount of Al was 60%.

• Design & Manufacturing
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• v.13 no.3
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• pp.6-10
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• 2019

In this study, a study was carried out that could effectively produce a heat dissipation effect on plastic materials. Using carbon nanotube (CNT), aluminum powder and plastic, the material properties were tested in 2 cases of compounding ratio. The test sample mold was designed and constructed prior to the experiment. The experiments include tensile strength, elongation rate, flexural strength, flexural elasticity rate, eye-jaw impact strength, gravity and thermal conductivity. Results from 60% and 70% mixture of aluminium to plastic were tested, and a 10% less combined result was a relatively good property. For research purposes, the heat dissipation effect and light weighting obtained a good measure when the combined amount of Al was 60%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.195-196
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• 2008

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.