• Fire Science and Engineering
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• v.24 no.6
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• pp.28-33
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• 2010

The present study develops a numerical model based on the computational fluid dynamics technique to analyse the thermal flow characteristics of large scale fire calorimeter and examine the characteristics of primary parameters affecting on the uncertainty of heat release rate measurement. ANSYS CFX version 12.1 which is a commercial CFD package is used to solve the governing equations of the thermal flow field and the eddy dissipation combustion model and P-1 radiation model are applied to simulate the fire driven flow. The numerical results shows that the horizontal duct system with $90^{\circ}$ bend duct was shown relatively high deviated asymmetric flow profiles at the sampling location and the deviation of the velocity field was higher than that of the temperature and species quantities. The present study shows that the computational model can be applicable to optimize the design process and operating condition of the large scale fire calorimeter based on the understanding of the detail flow field.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.7
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• pp.310-316
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• 2019

In automotive application, customers are demanding high efficiency and various functions for convenience. The demand for these automotive applications is steadily increasing. In this study, it has been studied the analysis of heat flow to improve the PCB(printed circuit board) heating performance of WPC (wireless power charger) recently developed for convenience. The charging performance of the wireless charger has been reduced due to power dissipation and thermal resistance of PCB. Therefore, it has been proposed optimal PCB design, layout and position of electronic parts through the simulation of heat flow analysis and PCB design was analyzed and decided at each design stage. Then, the experimental test is performed to verify the consistency of the analysis results under actual environmental conditions. In this paper, The PCB modeling and heat flow simulation in transient response were performed using HyperLynx Thermal and FloTHERM. In addition, the measurement was performed using infrared thermal imaging camera and used to verify the analysis results. In the final comparison, the error between analysis and experiment was found to be less than 10 % and the heating performance of PCB was also improved.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.5
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• pp.474-480
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• 2011

Space Imaging Sensor operated on LEO is affected from the Earth IR and Albedo as well as the Sun Radiation. The Imaging Sensor exposed to extreme environment needs thermal control subsystem to be maintained in operating/non-operating allowable temperature. Generally, units are periodically dissipated on spacecraft panel, which is designed as radiator. Because thermal design of the imaging sensor inside a spacecraft is isolated, heat pipes connected to radiators on the panel efficiently transfer dissipation of the units. First of all, preliminary thermal design of radiating area and heater power is performed through steady energy balance equation. Based on preliminary thermal design, on-orbit thermal analysis is calculated by SINDA, so calculation for thermal design could be easy and rapid. Radiators are designed to rib-type in order to maintain radiating performance and reduce mass. After on-orbit thermal analysis, thermal requirements for Space Imaging Sensor are verified.

• Bulletin of the Korean Space Science Society
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• 2005.04a
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• pp.129-132
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• 2005

This paper describes BAUSAT-2 orbital thermal analysis and preliminary design of thermal control subsystem. To design thermal control subsystem of HAUSAT-2, we have considered active & passive thermal control method based on basic theory and themal equilibrium equation. Using this result, suitable thermal control method and material have been selected. We have designed thermal control subsystem based on analysis of HAUSAT-2's thermal environments on sun synchronous orbit with altitude 650km, inclination $98^{\circ}$ and thermal distribution and range expectation of each HAUSAT-2's surface. Thermal analysis consists of system level, box level and board level analysis. We have completed system level and box level analysis. Till now, board level analysis of main heat dissipation board in progress. Thermal control subsystem has designed according to thermal analysis result. This design is to maintain all of the HAUSAT-2 components within the allowable temperature limits. In future, STM

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Transactions of The Korea Fluid Power Systems Society
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• v.5 no.4
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• pp.17-25
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• 2008

This study presents an analytical model of the pneumatic circuit of an air suspension system to analyze the characteristics of vehicle height control. The analytical model was developed through the co-simulation of Simulink(air spring) and HyPneu(pneumatic circuit). Variant effective area of air spring and flow coefficients of pneumatic valves were estimated experimentally prior to the system test, and utilized in simulation. One-comer test apparatus was established using the components of commercial air suspension products. The results of simulation and experiment were so close that the proposed analytical model in this study was validated. However the frictional loss of conduit and heat dissipation which were ignored in this study need to be considered in future study. As an application example of proposed analytical model, an alternative pneumatic circuit of air suspension to conventional WABCO circuit was evaluated. The comparison of simulation results of WABCO circuit and alternative circuit show that proposed analytical model of co-simulation in this study is useful for the study of pneumatic system of automotive air suspension.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.5
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• pp.99-103
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• 2022

Millimeter-wave tracking radars operate in various environmental restrictions, thus they demand stable power sources with low noise level under high fluctuation of input voltage. This paper presents the design and implementation of the compact power supply with max power of 727 W for Ka-band tracking radar applications. To meet requirements of voltage accuracy and system efficiency for transceiver circuits, upper plates of buck converters are attached on the covers of power supply for efficient heat dissipation. The proposed power supply achieves system efficiency of 88.4 %, output voltage accuracy of ±2 % and noise level of <1% under full load conditions.

• Journal of IKEEE
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• v.26 no.4
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• pp.537-544
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• 2022

This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

• Journal of Internet of Things and Convergence
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• v.10 no.2
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• pp.125-130
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• 2024

With the rapid growth of mobility technology, the industrial sector is demanding storage devices that can reliably process data from various equipment and sensors in vehicles. NAND flash memory is being utilized as a storage device in mobility environments because it has the advantages of low power and fast data processing speed as well as strong external shock resistance. However, flash memory is characterized by data corruption due to long-term exposure to high temperatures. Therefore, a dedicated system for temperature management is required in mobility environments where high temperature exposure due to weather or external heat sources such as solar radiation is frequent. This paper designs a dedicated temperature management system for managing storage device temperature in a mobility environment. The designed temperature management system is a hybrid of traditional air cooling and water cooling technologies. The cooling method is designed to operate adaptively according to the temperature of the storage device, and it is designed not to operate when the temperature step is low to improve energy efficiency. Finally, experiments were conducted to analyze the temperature difference between each cooling method and different heat dissipation materials, proving that the temperature management policy is effective in maintaining performance.