• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.409-414
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• 2017

The aim of this study is to understand the phonon transfer characteristics of a silicon thin film transistor. For this purpose, the Joule heating mechanism was considered through the electron-phonon interaction model whose validation has been done. The phonon transport characteristics were investigated in terms of phonon mean free path for the variations in the device power and silicon layer thickness from 41 nm to 177 nm. The results may be used for developing the thermal design strategy for achieving reliability and efficiency of the silicon-on-insulator (SOI) transistor, further, they will increase the understanding of heat conduction in SOI systems, which are very important in the semiconductor industry and the nano-fabrication technology.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.3
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• pp.199-207
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• 2021

This study aimed to improve the performance of the KTX (Korea Train Express) brake system. To develop a braking disc-hub for the high-speed rail, the model performance was analyzed by finite element analysis, and the analysis results were verified using the braking test results. In addition, heat transfer analysis, thermal stress analysis, natural frequency analysis, and static analysis were conducted to examine the mechanical performance of the braking system. By deriving the design factors and conducting parametric analyses according to the shape of the hub, this study derived the optimal specifications that could improve heat dissipation and reduce weight. The cooling efficiency and structural performance of the optimization model were improved during braking compared to the existing model. It is expected that the design verification will be carried out through analyses of the optimal specifications so that it can be used in the development of brakes in railway vehicles and motor vehicles.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.693-698
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• 2002

For the evaluation of the plasma display panel (PDP)'s noise, vibration and sound characteristics of fanless PDP are measured and investigated. PDP is a type of two-electrode vacuum tube which operates on the same principle as a household fluorescent light. An inert gas such as argon or neon is injected between two glass plates on which transparent electrodes have been formed, and the glass is illuminated by generating discharge. For this discharge, both high voltage and currents are needed and cause an acoustic noise. We investigated the noise characteristics connected with both a electromagnetic elements from SMPS to panel through X, Y and logic board, and a mechanical elements form panel to case through transfer path which related with vibration and heat. To reduce the noise of PDP, a discharge pulse memory design related with both higher brightness and lower power consumption is important and mechanical characteristics connected with dissipation process of both heat and vibration generated by panel discharge must be investigated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1874-1881
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• 2002

Heat dissipation technology using the flow resonant phenomenon is a kind of a new concept in the heat transfer area. A vibration exciter is needed to enhance air flow mixing which has the natural shedding frequency of thermal system. A mechanical vibrating device for the air flow oscillation is introduced, which is driven by a moving coil actuator with a displacement estimator using strain gage. An analytical dynamic model for this mechanical vibration exciter is presented and its validity is checked by the comparison with experimental data. Values of some unknown system parameters in the analytic model are estimated through the system identification approach. Based on this mathematical model, the vibration exciter using strain displacement estimator is developed. During the experimental verification phase, it turns out the high modal resonant characteristics of a vibrating plate are a major barrier against obtaining a high bandwidth vibration exciter.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Progress in Superconductivity and Cryogenics
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• v.3 no.1
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• pp.35-39
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• 2001

The optimum cross-sectional area profile of gas-cooled high-temperature superconductor(HTS) current lead is analyzed to have minimum helium boil-off rate. The conventional constant area HTS lead has much higher helium consumption than the optimum HTS lead considered in this study. The optimum HTS lead has variable cross-sectional area to have constant satiety factor. An analytical formula of optimum shape of lead and temperature profile are obtained. For multi-stacking HTS current leads, the optimum tape lengths and minimum heat dissipation rate are also formulated. The developed formulations are applied to the Bi-2223 material, and the differences between constant area, constant safety-factor, and multi-stacking current leads are discussed.

• Proceedings of the KWS Conference
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• v.43
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• pp.213-215
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• 2004

Water jet propulsion system has high efficiency on middle to high speed, and it provides better safety than conventional screw propeller because it has not projected propeller and rudder. So many leisure boat and high-speed ferries use this propulsion system. We developed water-jet propulsion unit for small planning boat, and launched that in the boat, after that we tested water-jet unit in the lake. As a result, we certify heat dissipation at the bearing housing and reverse duct's shape for neutral position are important at the design, and alignment water-jet unit and keel line are important at the launching, and ship's resistance performance and jet's propulsion performance also are needed to consideration.

• Proceedings of the KIPE Conference
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• 2011.07a
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• pp.485-486
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• 2011

대용량 전력변환기에서 대부분의 열은 IGBT 소자에서 발생한다. 따라서 소자의 방열을 위한 방열시스템은 전력변환기의 구동 뿐 아니라 각 장치들에 대한 소형, 경량화의 추세에 있어서도 중요한 부분을 차지한다. 본 논문에서는 소자의 냉각을 위해 수냉식 방법을 선정하였으며, 배관 구조에 따른 방열판의 방열특성을 비교하여 최적의 배관 구조를 가진 수냉식 방열판을 제안하였다.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2001.02a
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• pp.84-88
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• 2001

The optimum cross-sectional area Profile of gas-cooled high-temperature superconductor (HTS) current lead is analyzed to have minimum helium boil-off rate. The conventional constant area HTS lead has much higher helium consumption than the optimum HTS lead considered in this study. The optimum HTS lead has variable cross-sectional area to have constant safety factor. An analytical formula of optimum shape of lead and temperature profile are obtained. For multi-step HTS current leads, the optimum tape lengths and minimum heat dissipation rate are also formulated. The developed formulations are applied to the Bi-2223 material, and the differences between constant area, constant safety-factor, and multi-step current leads are discussed.