• Journal of IKEEE
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• v.23 no.4
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• pp.1473-1476
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• 2019

Accurate material information is very important in PCB (Printed Circuit Board) design. In an integrated mast of a battleship, heat reduction is essential for stealth functionality. So heat dissipation from internal control equipments should be reduced as much as possible. Control equipments mostly consist of PCBs, but it often suffers from impedance mismatching due to imprecise Dk (Dielectric Constant), which significantly increases heat dissipation. In this paper, measurement methods of Dk is investigated. Also, effects on impedance mismatch by Dk variation with operating frequency is investigated.

• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.185-192
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• 2012

p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.

• Journal of computational fluids engineering
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• v.11 no.3 s.34
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• pp.8-13
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• 2006

The north panel of a geostationary satellite is used as one of the main radiators, on which communication equipment or bus equipment are installed. The thermal control of panel is designed by using embedded heat pipes and surface heat pipes (or external heat pipes) to spread out heat dissipated from equipment all over the radiator evenly and finally to reject the heat to the space through the radiator efficiently. This panel is also divided by several areas based on the operating temperature and dissipation of equipment in order to increase heat rejection capability of radiator. The thermal analysis is carried out for the hot case, Winter Solsitce EOL (End Of Life), in order to validate thermal design of the panel utilized 6 surface heat pipes and 8 embedded heat pipes. The sensitivity studies for the heat pipe failure case and no heat pipe case are performed and compared to its normal state. The heat transport capability of heat pipe is also obtained from these calculations.

• Proceedings of the Korean Society of Rheology Conference
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• 2003.05a
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• pp.93-98
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• 2003

In this paper, the main emphasis and focus will be to study and illuminate the nature of Plastic Energy Dissipation (PED) in variety of polymers. This PED term represents the heat generated during the irreversible deformation of a polymer solid. A series of experiments for various polymers have been conducted in direct measurement method and indirect evaluation method - the incremental strain stress relaxation ((ISSR) method. The experimental evidence to relate the stress relaxation and the sensible temperature rise were revealed by the series of direct method experiments.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1870-1875
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• 2007

The microchannel heat sink is promising heat dissipation method for high heat flux source. Contrary to conventional circular channel, MEMS based microchannel had rectangular or trapezoidal cross-sectional shape. In our study, we conducted three dimensional conjugate heat transfer calculation for rectangular shape microchannel. First, we simulated that channel was completely drained with known heating power. As a result we obtained calibration line, which indicates heat loss was function of temperature. Second, we simulated single phase heat transfer with various mass flux, 100-400 $kg/m^2s$. In conclusion, the single phase test verified that the present heat loss evaluation method is applicable to micro scale heat transfer devices. Heat fluxes from each side wall shows difference due to non-uniform heating. However those ratios were correlated with supplied total heat. Finally, we proposed effective area correction factor to evaluate appropriate heat flux.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.311-318
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• 2001

A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing, Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.

• Proceedings of the KIEE Conference
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• 1991.11a
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• pp.115-118
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• 1991

The temperature distribution on the superconducting thin-film is analyzed as moving constant field is applied above upper critical field. The distribution of magnetic field is derived in the normal spot. Governing equation is obtained with the help of the equation of conservation of energy. The temperature distribution and the heat dissipation are obtained through computer simulation by the method of numerical analysis. Maximum temperature is occured in the most right side inside normal spot. The temperature is increased abruptly inside the normal spot, and decreased more gradually outside normal spot in the direction of moving field as velocity is increased. Increasing the velocity rather than increasing magnitude of the normal spot and the applied field makes maximum temperature larger. Heat dissipation is affected by the velocity rather than the magnitude of normal spot and the applied field.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.335-338
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• 2009

In this study, in order to investigate the thermal and electrical properties of ZnO arrester block against 60[Hz] AC voltage, the changes in leakage current were measured. The temperature distribution appearing on the ZnO arrester blocks was observed using a forward looking infrared camera. In particular, the correlation between the thermal and electrical properties of a ZnO arrester block was analyzed experimentally. From this analysis, the thermal phenomena resulting from the heat generation and dissipation of the ZnO arrester block were interpreted. The degradation and thermal runaway phenomena of ZnO arrester block are closely related to the temperature limit of the ZnO arrester block. The installation of an additional metal electrode has resulted in the decrease of the leakage current due to the heat dissipation.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.10
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• pp.1-8
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• 2014

Heat dissipation of the high power LED is a critical issue. To estimate the junction temperature of the LED chip is most important in characterizing the heat dissipation, but it is impossible to directly measure it. In this study, surface temperatures of the 12.8W LED bulb was measured for 5 points using a data logger and compared with the simulated results using a thermal simulator based on FVM (finite volume method) to secure a reliability of the simulation. Effects of some factors such as lens, emissivity and air inlet were investigated using simulation works and then the results were analysed.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1026-1029
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• 2008

Temperature increase during OLED operation can significantly degrade the device lifetime. By using top-emission OLEDs fabricated on glass and silicon substrates that have different thermal conductivities, we found that efficient heat dissipation and corresponding lifetime improvement can be obtained by making a direct contact between the OLED anode and the high thermally-conductive silicon substrate. We describe substrate-dependent OLED heat dissipation behavior and OLED lifetime improvement by using infrared camera images and constant current stress test methods.