• 제목/요약/키워드: HEAT SINK

검색결과 561건 처리시간 0.032초

나노유체를 이용한 열사이폰 히트싱크 (Development of Nanofluidic Thermosyphon Heat Sink)

  • 이석호;신동륜;임택규;이충구;박기호;이욱현
    • 설비공학논문집
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    • 제18권10호
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    • pp.826-834
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    • 2006
  • A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

유한요소법을 이용한 방열판 설계를 위한 열해석 (Heat Analysis for Heat Sink Design Using Finite Element Method)

  • 장현석;이준성;박동근
    • 한국산학기술학회논문지
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    • 제14권3호
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    • pp.1027-1032
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    • 2013
  • LED는 저탄소 그린에너지 시대의 등기구로서 각광을 받고 있다. 다른 조명용 광원에 비해 친환경적이고 높은 에너지 효율을 가지고 있고 수명이 길다는 장점을 가지고 있지만, 공급전력 중 80%이상이 열에너지로 전환되며, 이에 따른 온도상승이 불가피 하여 높은 온도가 단점으로 꼽히고 있다. 온도상승은 LED소자의 수명에 영향을 미치기 때문에 방열시스템이 중요하게 자리 잡고 있다. 따라서 본 논문에서는 방열성능 향상을 위하여 LED 전구의 heat sink의 형상에 대한 열해석을 통하여 방열 시스템의 효용성을 분석하였다.

천공과 유동 가이드를 활용한 방사형 히트싱크의 자연대류 열전달 향상에 관한 연구 (Study on the Natural Convection Heat-Transfer Enhancement in Radial Heat Sink Using the Perforation and Flow Guide)

  • 전소라;이빈;변찬
    • 대한기계학회논문집B
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    • 제40권5호
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    • pp.339-345
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    • 2016
  • 본 연구에서는 천공과 유동 가이드를 활용한 방사형 히트싱크의 자연대류 열전달 향상에 관해 수치적으로 탐구하였다. 천공과 침니 기반의 유동 가이드를 활용한 개선된 형상의 방사형 히트싱크의 성능을 평가하고, 기존의 방사형 히트싱크와 열 성능을 비교하였다. 연구 결과, 천공형 히트싱크는 연구범위 내에서 천공의 개수와 직경이 클수록 열 성능이 좋아짐을 알 수 있었다. 침니 기반의 유동 가이드를 활용한 히트싱크에 대해서는, 핀의 개수, 침니와 바닥면 사이의 거리의 영향을 분석하였다. 그 결과 핀의 개수와 침니와 바닥면 사이의 거리에 최적화된 값이 있다는 것을 확인할 수 있었다. 또한 히트싱크의 방향이 상 방향($0^{\circ}$)에서 최고의 열 성능을, 측 방향($90^{\circ}$)일 때 최악의 열 성능이 나타나는 것을 알 수 있었다. 천공형 히트싱크와 최적의 구조를 갖는 유동 가이드를 갖는 히트싱크는 기존의 방사형 히트싱크와 비교하였을 때, 각각 최대 17%, 20% 개선된 열 성능을 가짐을 알 수 있었다. 본 논문은 공학과 관련한 획기적인 아이디어를 제시함으로써 창업기술개발, 벤처 및 기업가정신 함양에도 중요한 의미를 지닐 수 있다.

열전도성 고분자 복합소재/금속 소재 하이브리드 구조의 방열기구 설계 및 방열특성에 관한 연구 (A study on the design and cooling of the heat sink with hybrid structure of conductive polymer composite and metal)

  • 유영은;김덕종;윤재성;박시환
    • Design & Manufacturing
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    • 제10권3호
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    • pp.14-19
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    • 2016
  • Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

경량화 열전도성 플라스틱 Heat Sink기반 20 W급 LED Module의 열 특성: 다이캐스팅합금 (ADC-12)과 비교 연구 (Thermal Characteristics of 20 W LED Module on Light Thermal Conductive Plastic Heat Sink: Comparison with that on Aluminum Die Casting Alloy (ADC-12))

  • 여정규;허인성;이승민;최희락;유영문
    • 한국전기전자재료학회논문지
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    • 제29권6호
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    • pp.380-385
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    • 2016
  • Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

히트싱크 및 히트 스프레더를 이용한 고밀도 발열 전자부품의 방열 구조에 관한 연구 (A Study on Cooling for High Thermal Density Electronics Using Heat Sink and Heat Spreader)

  • 강성욱;김호용;김진천
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2286-2291
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    • 2008
  • Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

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순차적 근사최적화 기법을 이용한 방열판 최적설계 (Optimal Design of a Heat Sink using the Sequential Approximate Optimization Algorithm)

  • 박경우;최동훈
    • 설비공학논문집
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    • 제16권12호
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    • pp.1156-1166
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    • 2004
  • The shape of plate-fin type heat sink is numerically optimized to acquire the minimum pressure drop under the required temperature rise. In constrained nonlinear optimization problems of thermal/fluid systems, three fundamental difficulties such as high computational cost for function evaluations (i.e., pressure drop and thermal resistance), the absence of design sensitivity information, and the occurrence of numerical noise are commonly confronted. Thus, a sequential approximate optimization (SAO) algorithm has been introduced because it is very hard to obtain the optimal solutions of fluid/thermal systems by means of gradient-based optimization techniques. In this study, the progressive quadratic response surface method (PQRSM) based on the trust region algorithm, which is one of sequential approximate optimization algorithms, is used for optimization and the heat sink is optimized by combining it with the computational fluid dynamics (CFD).