• Pediatric Gastroenterology, Hepatology & Nutrition
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• 제9권2호
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• pp.139-146
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• 2006

목 적: Human astrovirus (HAstV)는 전세계적으로 영아 연령에서 중요한 위장관염의 중요 병원체로 알려지고 있지만 국내에서 HAtV 감염의 유병률에 대한 연구는 드문 편이다. 이에 저자들은 분자 유전학적 방법을 이용하여 위장관염으로 입원한 5세 이하의 소아에서 HAstV의 유병률과 유전형을 알아보기 위하여 본 연구를 시행하였다. 방 법: 2004년 2월부터 2005년 1월까지 12개월간 인제의대 상계백병원 소아과에 급성 위장관염으로 입원한 5세 이하의 소아에게서 수집된 대변 검체 812건을 대상으로 하였다. 대변 검체에 대해서 enzymeimmunoassay(EIA) 또는 RT-PCR을 이용하여 rotavirus, enteric adenovirus와 norovirus 감염여부를 진단하였다. HAstV 특이적인 시발체를 이용하여 RTPCR을 시행한 다음 염기서열 분석을 시행하였다. 결 과: 총 812건의 검체에서 rotavirus 양성률은 16.9% (138/812), norovirus 양성률은 11.5% (94/812), adenovirus 양성률은 4.0% (33/812)였다. HAstV의 유병률은 RT-PCR 방법에 의해 4.0% (33/812)였다. HAstV 양성인 환아의 연령은 생후 12개월 미만 82.0%, 1~2세 미만 6.0%, 2~3세 미만 6.0%, 3~5세 이하가 6.0%였다. HAstV의 월별 분포는 각각 4월 3건, 5월 5건, 6월 4건, 8월 12건, 9월 4건, 10월 2건, 11월 2건, 12월 1건으로 8월에 가장 높은 발생률을 보였다. 염기서열 분석이 가능하였던 HAstV 양성 검체 22건 중에서 유전형-1이 20건, 유전형-8이 2건이었다. 결 론: 2004년 2월부터 2005년 1월까지 12개월간 급성 위장관염으로 입원한 소아에서 HAstV 감염 유병률은 4.0%였으며, 영아기 연령에서 주로 발생하였다. 국내 HAstV 감염의 정확한 역학적 특성을 파악하기 위해서는 장기간에 걸친 추가 연구가 필요할 것으로 생각된다.

• Clinical and Experimental Pediatrics
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• 제55권3호
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• pp.77-82
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• 2012

Human astrovirus (HAstV) is a major cause of acute diarrhea among children, resulting in outbreaks of diarrhea and occasionally hospitalization. Improved surveillance and application of sensitive molecular diagnostics have further defined the impact of HAstV infections in children. These studies have shown that HAstV infections are clinically milder (diarrhea, vomiting, fever) than infections with other enteric agents. Among the 8 serotypes of HAstV identified, serotype 1 is the predominant strain worldwide. In addition to serotype 1, the detection rate of HAstV types 2 to 8 has increased by using newly developed assays. HAstV is less common compared with other major gastroenteritis viruses, including norovirus and rotavirus; however, it is a potentially important viral etiological agent with a significant role in acute gastroenteritis. A better understanding of the molecular epidemiology and characteristics of HAstV strains may be valuable to develop specific prevention strategies.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.43-49
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• 2015

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 반도체 칩뿐만 아니라 유기 기판도 고집적화가 요구되고 있다. 본 연구는 인쇄회로기판의 미세 피치 회로에 대한 고온고습 전압인가 시험을 실시하여 불량 메커니즘을 연구하였다. $130^{\circ}C/85%RH/3.3V$와 $135^{\circ}C/90%RH/3.3V$ 시험조건에서 고온고습 전압시험(Biased HAST)의 가속 계수는 2.079로 계산되었다. 불량 메커니즘 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. (+)전극에서는 콜로이드 형태의 $Cu_xO$와 $Cu(OH)_2$가 형성되었으며, (-)전극에서는 수지형태의 Cu가 관찰되었다. 이를 통해 $Cu^{2+}$ 이온과 전자($e^-$)가 결합한 수지상 Cu에 의해 절연파괴가 일어난다는 것을 확인하였다.

• Electronic Materials Letters
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• 제14권6호
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• Journal of Welding and Joining
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• 제35권3호
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• pp.7-14
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• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• 한국신뢰성학회지:신뢰성응용연구
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• 제5권2호
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• 한국철도학회논문집
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• 제9권6호
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• pp.732-738
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• 2006

This research provides a scheme for Highly Accelerated Stress Test that is necessary to demonstrate reliability prediction of Korean Rapid Transit Railway Train Control System sub-equipment, which is calculated by a relevant standard for failure rate prediction of electronic products. Although determining failure information generated in the process of trial running by statistic analysis is widely accepted as a measure of confirmation for reliability prediction, this research suggests the modeling for System Life Test determined by accelerating stress factors as a measure of confirmation for reliability prediction of sub-equipment unit that is generated ahead of a trial running in System Life Cycle. Consequently, the research demonstrates sub-equipment unit reliability test, which is based on the model derived from Accelerated Stress Test, according to accuracy level and the number of samples, and conducts an official experiment by making out a reliability test procedure sheet based on test time as well.

• 한국정보처리학회논문지
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• 제2권3호
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• pp.406-416
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• 1995

본 논문은 이동 호스트(mobile hast)를 수용하는 컴퓨터 네트워크상에 있어 이동 호스트간의 경제성 있는 통신을 지원하는 메세지 루팅 프로토콜에 관한 것이다. 제안 된 루팅 프로토콜은 이동 호스트의 위치 이동에 따른 위치 정보의 등록을 담당하는 위치 등록 프로토콜과 이동 호스트로의 신뢰성있는 메세지 전달을 수행하는 메세지 전 달 프로토콜로 구성된다. 제안 프로토콜은 주요 특성과 동작 절차를 제안 하고, 기존 의 대표적인 프로토콜들과의 비교를 통해 제안된 프로토콜이 기능적인 측면에서는 물 론 메세지 루팅시 수반되는 통신 비용(메세지 수)에 있어서도 개선되었음을 보였다.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.393-404
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Journal of Trauma and Injury
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• 제35권3호
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• pp.145-150
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• 2022

This paper aims to summarize why I write, how to find a motif, and how to polish and finish a manuscript. For William Carlos Williams, practicing medicine and writing poetry were two parts of a single whole, not each of the other. The two complemented each other. Medicine stimulated Williams to become a poet, while poetry was also the driving force behind his role as a doctor. Alexander Pope, the 18th century English poet, wrote a poem entitled "The Epistle to Dr. Arbuthnot" that was dedicated to a friend who was both a poet and a physician. In this poem, we receive an answer to the questions of "Why do you write? Why do you publish?" Pope writes, "Happy my studies, when by these approv'd! / Happier their author, when by these belov'd! / From these the world will judge of men and books." When I write, I first reflect on whether I only want to write something for its own sake, like "a dog chasing its own tail," instead of making a more worthwhile contribution. When my colleagues ask me, "Why do you write essays as well as scientific papers?" I usually answer, "Writing is a process of healing for me-I cannot bear myself unless I write." When the time comes to sit down and put pen to paper, I remind myself of the saying, festina lente (in German, Ohne Hast, aber ohne Rast, corresponding to the English proverb "more haste, less speed"). If I am utterly exhausted when I finish writing, then I know that I have had my vision.