• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.3 s.96
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• pp.341-345
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• 2005

Structural Dynamics Modification (SDM) is a very effective technique to improve structure's dynamic characteristics by adding or removing auxiliary structures, changing material properties and shape of structure. Among those of SDM technique, the method to change shape of structure has been mostly relied on engineer's experience and trial-and-error process which are very time consuming. In order to develop a systematic method to change structure shape, surface grooving technique is studied. In this work, the shape of base structure was modified to improve its dynamic characteristics such as natural frequencies via surface grooving technique. Grooving shape was formed by mergingthe neighboring small embossing elements after analyzing frequency increment sensitivities of all the neighboring emboss elements. For this process, Criterion Factor was introduced and the initial grooving was started from the element having highest strain energy and the grooving is expanded into neighboring element. The range of targeting grooving area to check its frequency variations restricted to their neighboring area to reduce the computation effort. This surface grooving technique was successfully applied to a hard disk drives (HDD) cover model to raise its natural frequency by giving some groove on its surface.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.167-172
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• 2002

Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.4
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• pp.23-28
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• 2003

This paper describes the machining characteristics of a developed micro grooving machine. Experiments have been conducted on the various grooving condition such as spindle revolution speed, feed rate and depth of groove. V and U-shaped blade tool and STD11 workpiece was used in this study. To evaluate the developed micro grooving machine, AE signal obtained from each experimental condition was analyzed, and cutting stability was compared with the surface state. As a result this study presented the process to optimize grooving condition and possibility of application of AE technique in groove machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.542-546
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• 2003

This paper describes the machining characteristics of a developed micro grooving machine. Experiments have been conducted on the various grooving condition such as spindle revolution speed, feed rates and depth of groove. V and U-shaped blade tool and STD11 workpiece was used in this study. Evaluating the machining conditions, RMS and frequency spectrum analysis of AE(acoustic emission) signals according to each conditions were applied. As a result, this study presented the process to optimize micro grooving condition and possibility of application of AE technique in groove machining.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.3
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• pp.34-40
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• 2003

This paper describes evaluation and monitoring methods of machining characteristics for developed micro grooving machine. Experiments were conducted under various process conditions such as spindle revolution speed, feed rates and depth of groove V and U shape of blade and STD11 were used in this experiment. The status of grooving was evaluated through analysis of the Acoustic emission (AE) signal resulted in each process condition. Based on the analysis, this paper examined the possibility of monitoring adapting fuzzy logic. In conclusion, this paper presented the possibility of monitoring in process adapting AE technology and appropriate micro grooving condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.332-335
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• 1997

With the advance of precision technique, the optical system is more precise and complex and the machining method of optical element which is composed of micro-grooves is developed. Especially, the method of micro-grooving using diamond tool is used widely owing to many merit, but has problems of damage of surface roughness due to tool wear and tool fracture. This paper deals with state monitoring using AE RMS in the micro-grooving. The change of AE RMS is very small with increment of cutting velocity and depth of cut. In spite of constance magnitude of principal force in machining using diamond tool of tool wear and tool fracture, AE RMS is highly fluctuated. Because changing of cutting state has relevance to surface roughness profile, surface toughness profile is expected using AE RMS.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.10
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• Journal of Welding and Joining
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• v.22 no.5
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• pp.58-64
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• 2004

Although leakage at a low carbon steel pipe made by electrical resistance welding (ERW) was reported due to grooving corrosion, the cause for the corrosion has not yet been cleared. In order to clarify the main cause, failure analysis on the leaked pipe was carried out, followed by metallographic investigation and corrosion test for the various ERW pipe made with different welding heat input. The microstructure, particularly inclusion content, of the weldment is dependant on the welding heat input applied. For an improper low heat input, the amount of inclusion at the weld was high. High inclusion content accelerated grooving corrosion at the weld. It is therefore that welding heat input should be controlled based on the carbon content of the pipe in order to improve the corrosion resistance of the ERW pipe.

• Journal of Power System Engineering
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• v.11 no.3
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• pp.41-46
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• 2007

The microstructure and electrochemical analysis of welds of electric resistance welding(ERW) pipe were investigated. The direction of metal flow line in HAZ of ERW pipe shifted to the inner(or outer) surface of pipe by plastic deformation during welding. The lowest heat input welds of ERW pipe was showed crack by liquid penetrant testing. Accelerated corrosion test by constant current density of 20mA/$cm^{2}$ developed groove at the welds of ERW pipe and the measured grooving factors were about $1.2{\sim}1.5$. Corrosion potential of base metal obtained by cyclic polarization in artificial sea water(3.5wt.% NaCl solution) was 100mV higher than that of weld metal of ERW pipe.