• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1996.05a
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• pp.36-40
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• 1996

A numerical analysis is performed about the static and dynamic characteristics of the oil-lubricated herringbone-grooved journal bearing which has circular groove profile. Some tests of jitter and W/F measurements are carried out to verify the performance of the newly designed drum assembly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.38-39
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• 2005

We have investigated the effect of the pad surface characteristics such as roughness, groove density and wear of pad on within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). We found that WIWNU increases as pad surface roughness($R_{pk}$; Reduced peak height) increases in an early stage of polishing. But after polishing time goes to a certain extent, WIWNU decreases as uniformity of pad surface roughness. Also, groove of pad has effect on relative pad stiffness although original mechanical properties of pad are unchanged by grooving. WIWNU decreases as relative pad stiffness decreases. In addition, conditioning process causes non-uniform wear of pad during in CMP. The profile of pad wear has a significant effect on WIWNU.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.42
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• pp.19.1-19.4
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• 2020

Background: The tongue in groove technique (TIG) is a useful technique for the correction of the nasal tip projection and the nasolabial angle. The purpose of this study was to determine the utility of this technique for nasal tip rotation and projection correction in the Iranian society. Methods: This is a retrospective clinical trial study of 20 patients undergoing open septo-rhinoplasty using TIG technique from January 2017 to August 2019 at the oral and maxillofacial unit of Bu Ali Hospital and private sector. Preoperative and postoperative profile view photographs were compared to assess the changes in tip projection and rotation. Results: Fifteen patients (75%) had normal angular size, and 5 of them (25%) were not within the normal range after the surgery. The Fisher exact test showed that this success was statistically significant (P = 0.006). Ten patients (50%) had normal projection size, postoperatively. The Fisher exact test showed that this effect was statistically significant (P < 0.01) Conclusion: The study demonstrated the benefit of TIG on the correction of nasal tip projection and rotation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.623-624
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• 2005

Micro injection molding is a branch of micro system technology and has been under development for the mass manufacture of micro parts. Enhanced technological products like micro optical devices are entering the market. This paper presents fundamental research on the injection molding technique in micro fabrication. In order to successful manufacturing of micro plastic parts, it is necessary to research for development of micro-injection machine, machining of micro mold, decision of optimum injection conditions and the research for polymer material. Therefore in this study, in order to machining of micro mold, a mold core with microscopic V-shaped groove was tooled by ultra-precise tooling machine. The transcription experiments with a polymer, PMMA resin on the surface of core with Ni plating were carried out and surface profile of injected parts was measured with AFM.

• Tribology and Lubricants
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• v.23 no.3
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• pp.83-88
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• 2007

This paper presents measurement processes of rotational accuracy and comparison of theoretical values in the main bearing of scroll compressor. The main bearing is a type of oil journal bearing, but it has an axial or helical groove. The generalized coordinate system method, which can handle this groove, is applied to calculate the pressure profile in the journal bearing. The orbits of journal shaft are calculated corresponding to the compressed gas forces and bearing reaction forces. Then, the orbits are measured using three-point method. The results are compared to that from analyses.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.309-313
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• 2006

Pad surface characteristics such as roughness, groove and wear rate of pad have a effect on the within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). Although WIWNU increases as the uniformity of roughness(Rpk: Reduced peak height) becomes worse in an early stage of polishing time, WIWNU decreases as non-uniformity of the Rpk value. Also, WIWNU decreases with the reduction of the pad stiffness, though original mechanical properties of pad are unchanged by the grooving process. In addition, conditioning process causes the inequality of pad wear during in CMP. The profile of pad wear generated by the conditioning process has a significant effect on the WIWNU. These experiments results could help to understand the effect of pad surface characteristics in CMP.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.9
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• pp.174-180
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• 2000

A reliable analytic model that determines the cross sectional shape of a workpiece(material) in round-oval(or oval-round) pass sequence has been developed. the cross sectional shape of an outgoing workpiece is predicted by using the linear interpolation of the radius of curvature of an incoming workpiece and that of roll groove to the roll axis direction. The requirements we placed on the choice of the weighting function were to ensure boundary conditions specified. The validity of the analytic model has been examined by hot rod rolling experiment with the roll gap and specimen size changed. The cross sectional shape and area of a workpiece predicted by the proposed analytic model were good agreement with those obtained experimentally. It was found that the analytic model has not only simplicity and accuracy for practical usage but also save a large amount of computational time compared with finite element method.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.671-674
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• 2008

We investigate the slippage effect in a micro-channel depending on the surface characteristics; hydrophilic, hydrophobic, and super-hydrophobic wettabilities. The micro-scale grooves are fabricated on the vertical wall to make the super-hydrophobic surfaces, which enable us visualize the flow fields near walls and directly measure the slip length. Velocity profiles are measured using micro-particle image velocimetry (Micro-PIV) and compared those in the hydrophilic glass, hydrophobic PDMS, and super-hydrophobic PDMS micro-channels. To directly measure the velocity in the super-hydrophobic micro-channel, the transverse groove structures are fabricated on the vertical wall in the micro-channel. The velocity profile near the wall shows larger slip length and, if the groove structure is high and wide, the liquid meniscus forms curves into the valley so that the wavy flow is created after the grooves.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.6_2
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• pp.1051-1058
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• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.186-195
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• 2002

The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.