• 한국정밀공학회지
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• 제7권4호
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• pp.23-28
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• 1990

This study is to investigate the magnitude, direction and distribution of residual stresses in surface ground plate according to working conditions. The specimens were made of structural carbon steel and were machined in various grinding conditions. These were divided in two groups; heat-treated materials and non-heat-treated materials. In each working condition, let the ground specimen generate displacements using deflection-etching techniques. At the same time, these displacements were precisely measured with electronic micrometer. Through the relation formula between the plane stress and strain, which was derived using these measured data, the values of residual stress are calculated, and the results are analyzed. These results are as follows : 1. According to the working conditions in this experiment, it can be seen that the distribution of residual stress generally had same trend and the maximum residual stress remained in 20~30 ((${\mu}m$) beneath the surface. 2. It is observed that compressive residual stress changes into tensile stress in 5~20 (${\mu}m$) beneath the surface. It is suggested that such phenomenon is originated from the friction effect in grinding process. 3. As the hardness increases by the heat treatment, residual stress increases. 4. As the fatigue strength increases by the compressive residual stress, it is desirable that the dowm feed and table feed reduce. 5. It can be seen that the more great the down feed and table feed increase, the more close the changing point, where the stress changed from compressive to tensile, is colse to the surface. This is due to the resultant effects of the grinding temperature and resistence are larger than the effect of the friction.

• 한국정밀공학회지
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• 제19권6호
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• pp.145-154
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• 2002

CMP (Chemical mechanical polishing) process was used to control the fine grinding process induced mechanical damage of Cz Silicon wafer. Characterization of mechanical damage was carried out using Nomarski microscope, magic mirror and also using angle lapping and lifetime scanner evaluation after heat treatment. Magic mirror and lifetime scanner were very useful for the residual damage pattern characterization and CMP process was effective on the reduction of fine grinding induced mechanical damage.

• 한국공작기계학회논문집
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• 제16권3호
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• pp.103-108
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• 2007

The number of parts made of ceramic materials has gradually been increasing in field of from mechanical engineering to electronics engineering and, mechanical engineering ceramics have spread because of three very favourable characteristic features of their application, namely, heat, wear, and corrosion resistance. therefore, the elaboration of suitable grinding technologies is Important. grinding is problematic because crack-free ceramics are difficult to process owing to their particular micro structure. In this paper we report on the application of advanced precision grinding process, elaborating continuous wheel dressing. The removal rate can be increased significantly and surface roughness is improved. Various problems(roughness, ground surface etc)encountered in grinding of ceramics are also discussed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.57-60
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• 2002

The high precision spindle is essential fer mass and low cost production of aspherical glass lens. Especially, in the grinding process of micro glass lens the performance of the spindle determine the machined surface quality. For the aspheric micro glass lens grinding, we design and make a high precision spindle. We use air bearings for high speed and low motion errors of the spindle. And the driving mechanism is an air turbine to remove heat generation. In this study, we make basic performance requirements of the spindle through benchmarking. And we confirm the requirements by basic machining test. We test air consumption, static stiffness, run-out and vibration of the spindle.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1993년도 추계학술강연 및 발표대회강연 및 발표논문 초록집
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• pp.37-37
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• 1993

• 산업식품공학
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• 제21권4호
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• pp.391-402
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• 2017

본 연구에서는 건조조건과 분쇄조건을 달리하거나 추출한 식물류의 영양성분 함량과 영양성분의 보존율을 비교분석하였다. 동결분쇄한 식물류는 일반분쇄 하거나 추출한 식물류에 비하여 영양성분의 보존율이 높은 것으로 나타났다. 인공생체막에서 영양성분의 투과도를 분석한 결과 동결분쇄한 식물류의 영양성분이 잘 투과하였다. 분쇄과정에서 열발생을 최소화하고 입도를 작게 하는 동결분쇄 기술이 식물류 원료를 우수한 식물소재로 가공할 수 있는 기술임을 확인하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.793-797
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• 2000

The environmental problems by using coolant demanded the new cooling methods. As one of them the studies on the dry grinding with compressed cold air have been done. The cooling method using compressed cold air was effdve thmugh going down the temperature of compressed air supplied below $-25^{\circ}C$ and inneasing the amount of mmpresd cold air, but had not enough cooling effect due to the low performance of lubrication. Therefore, the cooling methods using MQL(Minimum Quantity Lubrication) or mist newly were suggested. These two methods can satisfy both cooling effect and lubrication with only small amount of coolant, also has the benefit in the point of decreasing the envimnmental pollution. This paper focused on analyzing the grindmg characteristics of the cooling method using mid. The generated heat and grinding force of the cooling method using mist were compared with them of coolant and compressed cold air. And them grinding test according to the temperature of compressed cold air, mist spray amount and mist supply direction were done.

• 대한치과기공학회지
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• 제14권1호
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• pp.45-54
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• 1992

The purpose of this study was to observe the change of marginal distortion related to heat treatment and surface treatment in. Thirty copings were made on the self-curing resin dies and twenty coping among them were treated by heat and surface grinding. All copings were adapted on the respective dies and then were invested into the plastic boxes with tray resin. Both copiong and die invested in tray resin were cut through labio-lingually by a separating disc. This cross-cutting surface was ground and polished. Specimens were mounted on a light microscope and photographed. Marginal discrepancies were measured on photographes by a scale. The obtained results could be summarized in the followings : 1. In all metal copings, the distortion of cervical margin was shown after heat treatment and surface treatment. 2. There were no statistically significant differences in marginal fitness between shoulder and deep chamfer. 3. There were no statistically significant differences in marginal fitness between labial margin and lingual margin in one die. 4. In case of the copings which were not treated with preheating and were treated with surface grinding, the marginal distortion shows a tendency to increase.

• 한국공작기계학회논문집
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• 제11권6호
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• pp.10-16
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• 2002

Titanium alloys have the characteristics of lightness, high strength and good corrosion resistant and are broadly used in manufacturing parts for military and aerospace industries. These alloys are also recognized for organism materials comparatively and used as fixing ones in human body. Nevertheless titanium alloys have excellent properties, it is difficult to machine by traditional methods because of high hardness and chemically activated property. So higher tool wear is expected when cutting by conventional tools, so it is required nontraditional machining process. Finally, the mechanical characteristics such as surface roughness, shape and hardness on studied for wire electrical discharge machined and pound surfaces of titanium alloys for different heat-tested conditions.

• 한국분말재료학회지
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• 제13권5호
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• pp.313-320
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• 2006

The present study is to analyze the thermoelectric properties of $Bi_{0.4}Sb_{1.6}Te_3$ thermoelectric materials fabricated by the mechanical grinding process. The $Bi_{0.4}Sb_{1.6}Te_3$ powders were prepared by the combination of mechanical milling and reduction treating methods using simply crushed pre-alloyed $Bi_{0.4}Sb_{1.6}Te_3$ powder. The mechanical milling was carried out using the tumbler-ball mill and planetary ball mill. The tumbler-ball milling had an effect on the carrier mobility rather than the carrier concentration, whereas, the latter on the carrier concentration. The specific electric resistivity and Seebeck coefficient decreased with increasing the reduction-heat-treatment time. The thermal conductivity continuously increased with increasing the reduction-heat-treatment time. The figure of merit of the $Bi_{0.4}Sb_{1.6}Te_3$ sintered body prepared by the mechanical grinding process showed higher value than one of the sintered body of the simply crushed powder.