• 한국기계가공학회지
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• 제16권2호
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• pp.102-107
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• 2017

This study focuses on the effect of the elasticity modulus of jig material on blade edge shape in the grinding process of a sapphire medical knife. The ELID grinding process was applied as the edge-grinding method for sapphire material. Carbon steel and copper have been selected as the hard and soft jig materials, respectively. The blade edge created by ELID grinding was measured by a surface roughness tester and optical microscope. The shape of the ground edge and surface roughness were compared using the measurement results. As a result, it was found that chipping in the blade edge of the sapphire knife occurred more than in the case of jig material with a high-elasticity modulus because of the high normal force in the grinding process. Moreover, the maximum height surface roughness, $R_{max}$,of the ground surface was higher in the case of the jig material with a high-elasticity modulus due to the difference in elasticelongation. It was considered to lead to chipping from the notch effect.

• 한국기계가공학회지
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• 제3권2호
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• pp.10-17
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• 2004

A real depth of cut in deformed zone has larger than an ideal depth of cut. So the heat generated during grinding operation makes the deformation of a workpiece surface as convex farm. Consequently the workpiece surface remains a geometric error as concave form after cooling In this study, the grinding force and the geometric error were examined in surface grinding. Through magnitude and mode of geometric error were evaluated according to grinding conditions, an optimal grinding condition was proposed to minimize the geometric error In addition, the relationship between the geometric error and the grinding force was examined. Due to least square regression, It was possible to predict the geometric error by using the grinding force.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.43-47
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• 2002

In this study, through the experimental results of grinding ratio, grinding force and surface roughness with the obtained wear amount of diamond wheel and ceramic material during the grinding process, the following conclusions could be found. In the case of $Si_3N_4$, the wear of diamond wheel is large while the grinding force is stable and the range of change in surface roughness is small. for the case of $AL_2O_3$ and $ZrO_3$, while the wear of diamond wheel is getting smaller, the grinding force is increasing but the value of surface roughness is decreasing. For grinding with the vitrified bond wheel, it seems that the self-sharpening can be found for $Si_3N_4$ and the glazing effect of the cutting edge for $AL_2O_3$ and $ZrO_3$.

• Journal of Mechanical Science and Technology
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• 제15권3호
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• pp.351-356
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• 2001

In the surface grinding operations, the grinding fluid cannot be supplied sufficiently in the cutting zone. Temperature generated in the cutting zone increases rapidly and causes thermal damage such as burning on the surface of a workpiece. To reduce thermal damage, the intermittent grinding wheels, which have an excellent cooling effect, have been applied. This paper describes machining characteristics by using intermittent grinding wheels. The grinding force of the intermittent wheels has been simulated by the SIMULAB, which is a program for simulating dynamic systems. Using the intermittent grinding wheels, the characteristics of grinding force, temperature, surface roughness, and geometric error have been evaluated experimently.

• The Korean Journal of Ceramics
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• 제2권4호
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• pp.251-256
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• 1996

Effect of mixed grinding with a planetary ball mill of starting materials before heat treatment on the crystal structure and superconduction properties in the YBaCu composite oxide was studied. The size reduction of powders too place in the early stage of grinding, followed by aggregation of the resultant fine particles. The uniformity of the composition in the mixture was improved with grinding, which later decreased in the crystal grain size and well distribution of twin phase in the sintered bodies. The critical current density of the sintered bodies obtained from the mixture ground for 60 minutes showed the maximum value about 150 A/$\textrm{cm}^2$, while critical temperatures were around 90K and were independent of the grinding time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• 한국생산제조학회지
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• 제25권6호
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• pp.440-444
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• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

• 한국생산제조학회지
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• 제4권3호
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• pp.12-24
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• 1995

Various surface grinding experiments using resin bonded diamond abrasive wheels are carried out for tungsten carbide materials in order to minimize the damage on the ground surface and to purse the precise dimension compared to conventional grinding machine. When grinding quality is constant, theoretical grinding effect is changed according to the speed of workpiece. Accordingly, grinding forces, which are Fn, Ft, were analyzed for the machining processes of tungsten-carbide material to obtain optimum grinding conditions. Brief investigation is carried out to decrease the dressing efficiency of resinoid bonded diamond grinding wheel to grind tungsten-carbide. Truing is also carried out to provide a desired shape on a wheel or to correct a dulled profile. High quality in dimensional accuracy and surface are often required as a structural components, therefore 3-points bending test is carried out to check machining damage on the ground surface layer, which in one of sintered brittle material. From this experimental study, some useful machining data and information to determine proper machining condition for grinding of tungsten-carbide materials are obtained.

• 한국생산제조학회지
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• 제9권2호
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• pp.138-143
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• 2000

The establishment of a practical ultra-precision grinding technique using Diamond and CBN wheels is one of the major key technolo-gies to improve production techniques for machine-to-difficult materials without finishing process such as lapping and polishing. But the special efficient dressing technique for ultra-fine grit type grinding wheels to stabilize the grinding ability was not developed. Recently electrolytic in-process dressing technique is proposed to ultra-fine grit type metal bonded diamond wheels to protrude abra-sives continuously from the tool surface. This technology can be widely used to surface grinding and cylindrical grinding but cannot be used efficiently to internal grinding because of the electrode attachment trouble. This paper describes the effect of interval type electrolytic dressing as proposed newly to cast iron bonded diamond wheel for efficient internal grinding with mirror type high quality ground surface.

• 한국정밀공학회지
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• 제16권1호통권94호
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• pp.18-25
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• 1999

Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.