• 한국공작기계학회논문집
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• 제11권4호
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• pp.75-81
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous finding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1101-1104
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• 2001

The special purposed materials, such as ceramics and stainless steel, are widely used in the various industrial area. They have properties of the higher strength of material, the wear-resistance, and the corrosion proof. But ceramics is a difficult-to-grind material which possesses the higher level of a strength and a brittleness. In this study, the theoretical investigation of a grinding force and of a surface roughness was conducted. The evaluations of grinding characteristics on the hardened-brittle and difficult-to-grind materials were experimentally carried out.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1105-1108
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• 2001

In these days, according s the increase of technological development the part demension goes up for ultra-precision. It is grinding behavior that is important processing which directly influences by machining accuracy at product quality with the net shape manufacturing. In this study, by using CBN wheel an analysis carried out for workpiece's profiles and its characteristics by measuring grinding force and surface roughness. Workpiece materials were used STD11, SUS304 and STB2 varing condition of feedrate and depth of cut.

• 한국정밀공학회지
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• 제17권2호
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• pp.43-50
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• 2000

A CBN wheel was used for the highly efficient and precision grinding of the mold material(STD11). The grinding form accuracy by a CBN wheel is very excellent due to its low wheel wear, but grinding fragments resemble fine powders rather chips. A fine powders by this fragmentation can easily get attached to the wheel surface and therefore causing a loading. In order to prevent this fragmentation phenomena, the alumina stick is use to processing. Because the dressing with alumina stick should be interrupted for a processing, the automation of the processing and high productivity was very difficult. The investigation on the effect of Ultrasonic In-Process Dressing(ULID) on the grinding characteristics focuses in this Paper. This ULID method is that ultrasonic vibration in my Position of wheel is used to remove impurities on the wheel surface. Finally, the rate of surface roughness change in grinding by the ULID method was less than grinding without ultrasonic vibration. Loading phenomena by the ULID method were more prevented than grinding without ultrasonic vibration.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.516-519
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• 2004

As the optical communication industry is developed, the demand of optical communication part is increasing. ZrO$_2$ ceramic ferrule is very important part which can determines the transmission efficiency and information quality to connect the optical fibers. In general ZrO$_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. And the co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. This paper deals with the analysis of the process parameters such as grinding wheel speed, grinding feedrate and regulating wheel speed as influential factors, on the concentricity and surface finish developed based on Taguchi's experimental design methods. Taguchi s tools such as orthogonal array, signal-to-noise ratio, factor effect analysis, etc. have been used for this purpose optimal condition has been found out. Thus, if possible be finding highly efficient and quality grinding conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.80-84
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• 1996

This paper aims at reviewing the Possibility application over normal or abnormal, detection used by AE and the wear characteristics of grinding process. In this study, when diamond bur in dentistry with chosen grinding conditions were tuned at grinding. The variation of grinding resistance and hE signal is detected by the use of AE measuring system. The tests are carried out in accordance with diamond burs and workpiece; arcyl and bovine. According to the experiment results, the following can be expected; AE has the possibility to detect the state normality and abnormality. However, the grinding resistance measuring can find it difficult to detect it. It can be accurately excerpted from AE occurrence pattern in contact start point of diamond bur and bovine, grinding condition and derailment point. It is known that AE$\_$rms/ is well compatible with grinding resistance. According to the increase of the material removal rate, the specific energy of the diamond bur is inclined to decrease and the grinding resistance has a tendency to increase.

• 한국정밀공학회지
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• 제16권4호통권97호
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• pp.148-154
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• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• Tribology and Lubricants
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• 제34권6호
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.875-879
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• 2000

In the previous report1), the grinding characteristics of quartz were investigated. In this paper, the grinding mechanisms of brittle materials including ceramics and quartz are modeled and a new parameter SDR(Surface roughness Direction Ratio) is proposed to characterize the grinding mechanisms of such materials. A set of experiments were performed to verify the effectiveness of the suggested parameter. The experimental results indicate that the plastic deformation is the dominant material removal mode at the grinding conditions which show the higher value of SDR. In the case of quartz, the material was removed by brittle fracture in a lower value of SDR and by plastic deformation in a higher value of it. SDR is not affected by wheel mesh size when brittle fracture occured. But in the plastic deformation case, SDR value increases with wheel mesh size.

• 한국기계가공학회지
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• 제16권5호
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• pp.40-46
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• 2017

A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.