Browse > Article

Wear Characteristics of Diamond Wheel according to bond in Ceramic Grinding  

공재향 (서울지방중소기업청 경영지원과)
유봉환 (숭실대 기계공학과)
소의열 (충청대 기계설계과)
이근상 (세인ENG)
유은이 (정우이엔지)
임홍섭 (인천기능대 자동차과)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.11, no.4, 2002 , pp. 75-81 More about this Journal
Abstract
In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous finding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change.
Keywords
Diamond Wheel; Vitrified Bong; Resinoid Bond; Cutting Edge Ratio;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 レジンボンドCBN砥石の形直し特性の-檢討 /
[ 安井平司 ] / 精密工學會誌
2 An Investigation of Grinding Wheel Cutting Edges /
[ Tsuwa H ] / Trans.of ASME
3 グラインデイングセンタによるセラミシクスの正面硏削加工 /
[ 中川平三郞 ] / 機械技術
4 /
[ 서남섭 ] / 정밀공작법
5 초연마재를 이용한 연삭.절삭가공 /
[ 이종찬 ] / 한국공작기계학회   과학기술학회마을
6 A Study on the Surface Integrity of Grinding of Ceramic /
[ J.C.Lee(et al.) ] / Trans.of the Korean Society of Machine Tool Engineers   과학기술학회마을
7 세라믹 재료의 연삭 /
[ 조성재(외) ] / 요업기술