• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.11-18
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• 2003

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.19-24
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• 2015

Gears are produced through a variety of methods. In general, a metal piece is formed into the general shape of a gear through rough cuts. The gear then moves on to a more precise machine that removes more material. Grinders work via abrasion, rubbing a rough surface against a work piece at such high speeds that it literally scrapes unwanted material away from the item. Since the grinder is spinning so fast, the material is removed very quickly. This allows a grinder to remove a very small amount without taking any unwanted material with it. This study investigates the effect of grinding process parameters like grinding spindle speed and table transfer speed on the gear grade and grinding efficiency.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1003-1007
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• 2003

In order to improve the international competitiveness of ferrule industry, the core technology of the second stage for ferrule grinding system is under developing. A high speed (10,000RPM) and high precision spindle system(Radial Runout 0.2 micrometer) bearing more cutting torque and force is designed considering the limitation of cost and size, the effect of heat, and various work-piece materials. A CAE software for machine elements and general machine system is used for preliminary evaluation and selection of design parameters. A dedicated program for the analysis of spindle system is used for final evaluation and selection of design parameter. The process how to evaluate and select using such tools are presented.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.2
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• pp.26-32
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• 2010

This paper reports some experimental result in grinding and polishing of silicon cathodes used in semiconductor manufacturing process. Cup shape diamond core wheels were used in experiments and the radial and tangential grinding forces were measured with surface roughness. In polishing experiments, flat type and donut type wool polishing tools were tested. The experimental results indicate that the grinding forces are proportional to the material removal rates and the surface roughness are inversely proportional to the spindle speed. The surface roughness of polished Si decreases with polishing time and higher spindle speed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.344-348
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness after using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreases. For the case of vitrified bond wheel, cutting edge ratio does not change.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1099-1104
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• 2004

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.498-501
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• 1999

Grinding machine rotating at high speed express the unbalance by the spindle and the weight of grinding wheel. Therefore, the parts requiring a precision processing for grinding machine need acutely to establish of automatic balancer. But the more wheel speed increases the more vibration amplitude increases, surface roughness show the satisfactory according to increase of the wheel speed. Surface roughness of the occasion installing the automatic balancer made better than an occasion no installing the automatic balancer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.75-81
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous finding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.309-314
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• 2001

The balance of high speed spindle system with high precision rotation like grinding machine is very important. Traditionally, we use trial and error method to balance the spindle. It takes much time. So we are developing the automatic balancing equipment being used in the grinding machine. The balancing head we develop is wireless. It will be used high-speed grinding machine. We use influence coefficient method to control the automatic balancer. Experiments are based on automatic and manual balancing. We perform test of the vibration filter. It helps to remove noise. The filter and experiments with automatic balancing controller show that automatic balancing control can be successfully achieved with the quick response and good stability characteristics.