• Title/Summary/Keyword: Green sheet

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Studies on Density Measurement of Green Fe/Ni P/M Sheet Using ${\gamma}-ray$ (감마선을 이용한 소결 전 Fe/Ni 분말야금 판재의 밀도측정에 관한 연구)

  • Cho, K.S.;Lee, J.O.;Lee, S.Y.;Lee, J.S.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.12 no.3
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    • pp.7-11
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    • 1992
  • Accurate measurement of green density of compacted part in the powder metallurgy industry is rather fundamental but extremely important process that decide the quality of the sintered part. In case of green sheet P/M product, the green density as well as the distribution of the density must be examined for the same reasons. Currently in most cases, density measuring process is being performed applying conventional Archimedes principles. However this method is not only time-consuming but also often inaccurate because of the inherent nature of the process, such as part sectioning, closing of surface porosity with wax and weighing in air and in water. Therefore, it is necessary to develop a faster and more accurate method to measure the density of green sheet P/M product. In this work, a nondestructive density measurement device using gamma-ray absorption principles was constructed and the optimum condition for measuring green density of P/M sheet and its distribution was sought. The results showed that this method was very effective in terms of measuring time and accuracy.

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Effect of Binder Content on Physical Properties of LTCC Green Tapes (바인더 함량 변화가 LTCC 그린 테이프의 물리적 특성에 미치는 영향)

  • You, Jung-Hoon;Yeo, Dong-Hun;Lee, Joo-Sung;Shin, Hyo-Soon;Yoon, Ho-Gyu;Kim, Jong-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.12
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    • pp.1112-1117
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    • 2006
  • The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.

Effect of Solvent Mixture Ratio on Rheology Property of Slurry and Thickness Control of Ceramic Green Sheets (유기 용매 혼합비에 따른 슬러리의 유동 특성과 세라믹 그린 쉬트의 두께 제어)

  • Kim, Jun-Young;Kim, Seung-Taek;Park, Jong-Chul;Yoo, Myong-Jae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.236-241
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    • 2008
  • The effect of organic solvent mixture ratio on the rheology property of slurry and thickness control of ceramic green sheet was investigated. For selecting a suitable dispersant multiple light scattering method was used to evaluate the particle migration velocity and variation of clarification layer thickness. Using the selected dispersant the dispersion property of solution according to solvent mixture ratio was investigated. Binder and plasticizers were added to formulate slurries and their viscosity was evaluated according to solvent mixture ratio. Ceramic green sheets with average thickness of 30, 50 urn were fabricated via tape casting and their thickness tolerances measured. As a result according to solvent mixture ratio the solution and slurry properties varied and for the mixture ratio of ethanol/toluene of 80/20 the ceramic green sheet with the lowest thickness tolerance was obtained.

Development of Green-Sheet Measurement Algorithm by Image Processing Technique (영상처리기법을 이용한 그린시트 측정알고리즘 개발)

  • Pyo, C.R.;Yang, S.M.;Kang, S.H.;Yoon, S.M.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.51-54
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    • 2007
  • The purpose of this paper is the development of measurement algorithm for green-sheet based on the digital image processing technique. The Low Temperature Cofired Ceramic (LTCC) technology can be defined as a way to produce multilayer circuits with the help of single tapes, which are used to apply conductive, dielectric and / or resistive pastes on. These single green-sheets have to be laminated together and fired in one step all. Main functionality of the green-sheet film measurement algorithm is to measure the position and size of the punching hole in each single layer. The line scan camera coupled with motorized X-Y stage is used for developing the algorithm. In order to measure the entire film area using several scanning steps, the overlapping method is used. In the process of development of the algorithm based on the image processing and analysis, strong background technology and know-how have been accumulated.

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Compound waterproofing method of green roof using copper barrier sheet and recycled tire melting liquid waterproofing material that reinforced treatments are valve and glass fiber mesh. (알루미늄 판막과 유리섬유를 합지한 구리방근시트와 폐타이어 용융액상 도막방수재를 이용한 옥상녹화 복합방수공법)

  • Kim, Young chan;Cho, Il Kyu;choi, sung min;Oh, Sang Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2008.11a
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    • pp.173-178
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    • 2008
  • This is green roof bottom system which composed by aluminum valve and glass fiber together as major reinforcement, so the cooper sheet can have root proof, and using recycled tire gel-type membrane waterproofing system which dost not contains VOCs. The copper sheet reduce the plants' root growing, so it helpes to maintain the waterproofing layer and stability of root proofing. Gel type membrane waterproofing system can do waterproofing, stress dispersion, and reducing leakage expansion. So those two materials can help each other to make green roof bottom layer would have the stability and durability.

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The Effect of Packing Density on the Warpage Behavior of Ni-Zn-Cu Ferrite Sheets (Ni-Zn-Cu계 페라이트 시트에서 충진 밀도에 따른 시트 휨 현상)

  • Kim, Shi Yeon;Yeo, Dong-Hun;Shin, Hyo-Soon;Song, Woo Chang;Yoon, Ho Gyu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.12
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    • pp.781-786
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    • 2015
  • It is necessary for ferrite sheets to be fabricated with high packing density for excellent electrical properties and high strength. In this study, the relationship between the warpage and the packing density of ferrite green sheet, was investigated with amount variation of organic additives. With 0.4 wt% of dispersant, the packing density was about 48% and warpage appeared 0.5~1.3 mm high. With 1.4 wt% of dispersant, the packing density increased up to 57% and warpage appeared 0.8~2.1 mm high. With high packing density, warpage appeared along the edges of specimen, while with low packing density, deformation appeared over whole specimen inhomogeneously. It is thought that inhomogeneous deformation after sintering came from the inhomogeneity in green sheet prepared with badly dispersed slurry. With good homogeneity in green sheet from well-dispersed slurry, isotropic shrinkage is thought to have occurred along the distance from center to edges of specimen during sintering.

A Study on Tungsten Paste for Metallization and Cofiring of an Alumina Green Sheet (Alumina Green Sheet의 동시소성용 텅스텐 페이스트 제조 및 금속 접합에 관한 연구)

  • 박경리
    • Journal of the Microelectronics and Packaging Society
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    • v.3 no.2
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    • pp.39-50
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    • 1996
  • 본 연구에선 주어진 조성의 알루미나 green sheet에 대하여 텅스텐의 입경 및 산화 물의 조성을 변화시키므로써 수축률을 제어하여 camber를최소화하여 결합강도를 최대로 하 는 텅스텐 페스트조성을 찾아내는 것을 목적으로 하였다. 본 실험에서 사용한 텅스텐 분말 의 입경은 0.35$\mu$m, 0.6$\mu$m, 0.72$\mu$m, $1.5\mu$m, 1.9$\mu$m, 3.2$\mu$m이며 frit는 Al2O3, MgO, SiO2 와 Al2O3, CaO, SiO2를 사용하여 각각의 조성에 따라 함량을 변화시키며 실험하였다. 소성 은 154$0^{\circ}C$로 습윤 수소분위기에서 시행하였으며 사용된 알루미나 green sheet의 알루미나 중심 입경은 2.8$\mu$m이었다. 분석은 주사전자 현미경으로 미세구조를 관찰하였고 EPMA Line Profile로 원소 분석을 하였으며 잔류응력을 측정하기 위하여 XRD분석을 하였다. Frit 을 함유하지 않은 경우 텅스텐 분말의 입경이 1.9$\mu$mdlfEo 최대 접합 강도를 나타내었다. Frit을 함유한 경우 Mgo계 frit조성에서는 MgO/Al2O3/SiO3=1/1/1일 때 CaO계 frot 조성에 서는 CaO/Al2O3/SiO2=1/2/1일 때 최대 접합 강도를 나타내었다. Frit 함량을 변화시킨 경우 MgO계는 10wt%함유하였을 때 CaO 계는 5wt%함유하였을 때 최대 접합강도를 나타내었 다. Frit 함량을 변화시킨 경우 MgO계는 10wt%함유하였을 때, CaOr계는 5wt%함유하였을 때 최대 접합강도를 나타내었다.

Investigations of the Boron Diffusion Process for n-type Mono-Crystalline Silicon Substrates and Ni/Cu Plated Solar Cell Fabrication

  • Lee, Sunyong;Rehman, Atteq ur;Shin, Eun Gu;Lee, Soo Hong
    • Current Photovoltaic Research
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    • v.2 no.4
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    • pp.147-151
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    • 2014
  • A boron doping process using a boron tri-bromide ($BBr_3$) as a boron source was applied to form a $p^+$ emitter layer on an n-type mono-crystalline CZ substrate. Nitrogen ($N_2$) gas as an additive of the diffusion process was varied in order to study the variations in sheet resistance and the uniformity of doped layer. The flow rate of $N_2$ gas flow was changed in the range 3 slm~10 slm. The sheet resistance uniformity however was found to be variable with the variation of the $N_2$ flow rate. The optimal flow rate for $N_2$ gas was found to be 4 slm, resulting in a sheet resistance value of $50{\Omega}/sq$ and having a uniformity of less than 10%. The process temperature was also varied in order to study its influence on the sheet resistance and minority carrier lifetimes. A higher lifetime value of $1727.72{\mu}s$ was achieved for the emitter having $51.74{\Omega}/sq$ sheet resistances. The thickness of the boron rich layer (BRL) was found to increase with the increase in the process temperature and a decrease in the sheet resistance was observed with the increase in the process temperature. Furthermore, a passivated emitter solar cell (PESC) type solar cell structure comprised of a boron doped emitter and phosphorus doped back surface field (BSF) having Ni/Cu contacts yielding 15.32% efficiency is fabricated.

Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process (미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성)

  • 신승용;임성한;주병윤;오수익
    • Transactions of Materials Processing
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    • v.13 no.1
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

Shaping and Sintering of $Pb(Mg_{1/3}Nb_{2/3})O_3-PbTiO_3$ System powders by Slurry Process (Slurr법에 의한 $Pb(Mg_{1/3}Nb_{2/3})O_3-PbTiO_3$계 미분말의 성형과 소결성)

  • 김복희;최석홍
    • Journal of the Korean Ceramic Society
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    • v.33 no.11
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    • pp.1267-1275
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    • 1996
  • Green sheet was prepared by tape casting in the composition of (1-x)Pb(Mg1/3Nb2/3)O3-PbTiO3 system using Pb(Mg1/3Nb2/3)O3 and PbTiO3 synthesized with PbO, Nb2O5 MgO and TiO2 The densest green sheet was obtained in the weight ratio 70:30 of powder to binder. Green sheet wasmultilayered in metal mould and formed into lamination at 7$0^{\circ}C$, 300kg/cm2 The lamination was sintered at 110$0^{\circ}C$ 2hr, Dielectric constant and Curie temperature of disc type sintered body was highered with increasing the amount of PbTiO3 and was in the range of 19000-21000, -7~45$^{\circ}C$ respectively. Green and sintered relative density of lamination was 61% and 95% respectively.

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