• Korean Journal of Materials Research
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• 제9권5호
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• pp.538-543
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• 1999

The theory of the reflow applied to metallization process was studied, and the factors affecting the reflow and the relation between the reflow and the grain growth were investigated. The driving force for the metal reflow is the difference in chemical potentials along the metal surface, and it causes the atom movement. On condition that metal interconnect is fabricated for semiconductor devices, surface diffusion is the primary atom movement mechanism. The metal reflow is influenced by reflow temperature, reflow time, reflow ambient, thin film thickness, thin film material, underlayer material, pattern size, and aspect ratio. It is supposed that the reflow characteristic varies according to the grain growth during the reflow, so the effect of the grain growth on the reflow should be considered.

• The Journal of the Korea institute of electronic communication sciences
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• 제9권3호
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• pp.273-278
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• 2014

On poly and single crystalline Cu substrates, the graphene was synthesized by chemical vapor deposition(CVD). Optical microscopic images which were not possible to show the detailed characterization of graphene growth were adjusted and analyzed using image analyzing software. As a result it was possible to show the detailed growth mechanism of graphene by utilizing the image analysis. Nucleation of graphene on Cu grain boundary and its growth behavior into Cu grain are shown. In addition, the movement of graphene grain boundary interacting with Cu grain boundary and pinholes during growth was illustrated in detail, and the cause and result are discussed as a result of those interactions.

• The Korean Journal of Ceramics
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• 제4권3호
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• pp.207-212
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• 1998

By comparison of the experimental results in two systems of ZnO varistors, it's appear that Sb2O3 is the indispensable element for twining in ZnO varistors and the Zn7Sb2O12 spinel acts as the nucleus to form twins. Al2O3 is not the origin of twining in ZnO varistor, but it was found that Al2O3 could strengthen the twining and form a deformation twining by ZnAl2O4 dragging and pinning effect. The inhibition ratios of grain and nonuniformity of two systems ZnO varistors increase with the increase of Al2O3 content. The twins affect the inhibition of grain growth, the mechanism could be explained follow as: twins increase the mobility viscosity of ZrO grain and grain boundary, and drag ZrO grain and liquid grain boundary during the sintering, then the grain growth is inhibited and the microstructure becomes more uniform.

• Korean Journal of Materials Research
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• 제4권7호
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• pp.750-758
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• 1994

The purpose of present study is to find out the formation mechanism of hemi-spherical grained(HSG) polysilicon film. Silicon film was deposited using LPCVD. Polycrystalline silicon film was deposited at $575^{\circ}C$ contained crystalline HSG in the amorphous matrix phase. The crystalline HSG can be categorized into two grains : lower grains and upper grains. Lower grains are located at interface between silicon dioxide and silicon film, and upper grains are located at surface. The growth orientations of HSG were identified as (311) or (111) directions for lower grains and perferentially (110) direction for upper grains. This difference of growth orientations seems to be caused by the difference of formation mechanisms. That is, lower grain is formed by soild phase crystallization, on the other hand, upper grain is formed by surface diffusion of silicon atoms. It was thus, proposed that the formation of practical HSG polysilicon film is mainly controlled by surface diffusion of silicon atoms.

• Journal of the Korean Society for Heat Treatment
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• 제11권4호
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• pp.324-332
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• 1998

The grain growth characteristics of dual-phase (${\alpha}+{\gamma}$) containing high Cr-steel have investigate using ${\alpha}$-, ${\gamma}$-single phases and (${\alpha}+{\gamma}$)dual-phase of 12%Cr Steel. The heat treatment has performed at $1000-1200^{\circ}C$ for 1-100hr. The results are as follows : 1) The grain growth rate in (${\alpha}+{\gamma}$) dual phase was substantially slower than that of single grain. 2) The relation between mean grain radius $\bar{{\gamma}}$ and annealing time t is, in general, described as following equation : $$(\bar{{\gamma}})^n-(\bar{{\gamma}_o})^n=K_n{\cdot}t{\cdots}{\cdots}(1)$$ i) In the case of single phase of high Cr steel, Eq.(1) is described as $(\bar{{\gamma}})^2-(\bar{{\gamma}_o})^2=K_2{\cdot}t$ and the grain growth is controlled by boundary migration. ii) In dual phase, the grain growth needs diffusion of alloying elements because the chemical composition of ${\alpha}$- and ${\gamma}$- phases differs from each other. When the volume fraction of ${\alpha}$-, ${\gamma}$-phase was almost equal and ${\gamma}$-phase in the case of 80 and $90%{\gamma}$. Eq.(1) is described as $(\bar{{\gamma}})^3-(\bar{{\gamma}_o})^3=K_3{\cdot}t$ because the grain growth is controlled by volume diffusion iii) In the case of ${\gamma}$-rich phase (80 and $90%{\gamma}$), the grain growth of minor phase (10 and $20%{\alpha}$) is described as $(\bar{{\gamma}})^4-(\bar{{\gamma}_o})^4=K_4{\cdot}t$ because the boundary diffusion is predominent rather than volume diffusion.

• Proceedings of the KWS Conference
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.1057-1060
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• 2001

By comparison of the experimental results in two systems of ZnO varistors, its appear that Sb$_2$O$_3$is the indispensable element for twinning in ZnO varistors, and the Zn$_{7}$Sb$_2$O$_{12}$ spinel acts as the nucleus to form twins. A1$_2$O$_3$is not the origin of twinning in ZnO varistor, but it was found that A1$_2$O$_3$could strengthen the twinning and form a deformation twinning by ZnA$_{12}$O$_4$-dragging and pinning effect. The inhibition ratios of grain growth and nonuniformity of two systems ZnO varistors increase with the increase of A1$_2$O$_3$content. The twins affect the inhibition of grain growth, the mechanism could be explained follow as : twins increase the mobility viscosity of ZnO grain and grain boundary, and drag ZnO grain and liquid grain boundary during the sintering, then the grain growth is inhibited, and the microstructure becomes more uniform.orm.m.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 한국분말야금학회 1998년도 춘계학술대회 및 발표대회 강연 및 발표논문 초록집
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• pp.20-21
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• 1998

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.533-538
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• 2000

Ductile fracture of dual phase steel begins with void nucleation, at martensite-ferrite interface of deformed martensite particle. In this study, void nucleation, growth, and coalescence under various strain were studied in dual phase steel. Therefore, by means of the heat treatment of low carbon steel, the study deals with void nucleation and growth for ferrite grain size and martensite volume fraction of dual phase steel using statistical method. Void nucleation and growth with increasing strain are shown depend upon the ferrite grain size. Voids volume fraction generally increase as ferrite grain size decease.

• Journal of Magnetics
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• 제11권3호
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• pp.111-114
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.