• Title/Summary/Keyword: Grain growth

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Grain Shape and Grain Growth Behavior in the Na1/2Bi1/2TiO3-BaTiO3 System (Na1/2Bi1/2TiO3-BaTiO3 계에서 입자모양과 입자성장 거동)

  • Moon Kyoung-Seok;Kang Suk-Joong
    • Journal of Powder Materials
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    • v.13 no.2 s.55
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    • pp.119-123
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    • 2006
  • The grain growth behavior of $0.95Na_{1/2}Bi_{1/2}TiO_{3}-0.05BaTiO_{3}$ (NBT-5BT) has been investigated with respect to the grain shape. The powder compacts of NBT-5BT were sintered at 1200 for various times. The corresponding equilibrium shape was a round-edged cube with flat {100}-faces. Abnormal grains were not observed in the specimens sintered for 1 to 12 h but abnormal grains appeared when sintered for 24 h. Before the formation of abnormal grains, a valley was observed in the measured grain size distribution of NBT-5BT, showing that the grain size distribution was a combination of two unimodal distributions. The present result suggests that the grain growth in NBT-5BT was governed by the growth of facet planes which would occur via 2-dimansional nucleation and growth.

The Effect of Ti/Sr Ratio on Abnormal Grain Growth of Nb-doped $SrTiO_3$ ($Nb_2O_5$를 첨가한 $SrTiO_3$의 비정상 입성장에 미치는 Ti/Sr 비의 영향)

  • 배철휘;전형탁;박재관;김윤호
    • Journal of the Korean Ceramic Society
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    • v.34 no.8
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    • pp.791-796
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    • 1997
  • The influence of Ti/Sr ratio on abnormal grain growth of Nb-doped SrTiO3 was investigated. For specimens which were isothermally sintered at temperatures above 144$0^{\circ}C$, the nucleation and growth rates of abnormal grain growth were decreased with increasing Ti/Sr ratio. But the onset time of abnormal grain growth was increased with increasing Ti/Sr ratio. The cross-section of abnormally grown grains was mostly hexagonal. When the specimens were quenched in air after they reached their setting temperatures at a heating rate of 3$^{\circ}C$/min, the onset temperature of abnormal grain growth was increased with increasing Ti/Sr ratio and the final grain size was independent of Ti/Sr ratio. The cross-section of abnormally grown grains was mostly rectangular.

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Analysis of the effect on the whisker growth as grain size of plating and base metal (Plating 및 Base metal의 Grain size에 따른 Whisker 성장 영향 분석)

  • Kim, Su-Jin;Chang, Mi-Soon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1337-1342
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    • 2008
  • The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

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Effects of Ti Underlayer on Microstructure in Cu(B)/Ti/SiO2 Structure upon Annealing (Cu(B)/Ti/SiO2 구조를 열처리할 때 일어나는 미세구조 변화에 미치는 Ti 하지층 영향)

  • Lee Jaegab
    • Korean Journal of Materials Research
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    • v.14 no.12
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    • pp.829-834
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    • 2004
  • Annealing of $Cu(B)/Ti/SiO_2$ in vacuum has been carried out to investigate the effects of Ti underlayer on microstructure in $Cu(B)/Ti/SiO_2$ structures. For comparison, $Cu(B)/Ti/SiO_2$ structures was also annealed in vacuum. Three different temperature dependence of Cu growth can be seen in $Cu(B)/Ti/SiO_2$; B precipitates- pinned grain growth, abnormal grain growth, normal grain growth. The Ti underlayer having a strong affinity for B atoms reacts with the out-diffused B to the Ti surface and forms titanium boride at the Cu-Ti interface. The formation of titanium boride acts as a sink for the out-diffusion of B atoms. The depletion of boron in grain boundaries of Cu films, as results of the rapid diffusion of B along the grain boundaries and the insufficient segregation of B to the grain boundaries, induces grain boundaries to migrate and causes the abnormal grain growth. The increased bulk diffusion coefficient of B within Cu grains can be responsible for the normal grain growth occurring in the annealed $Cu(B)/Ti/SiO_2\;at\;600^{\circ}C$. In contrast, the $Cu/SiO_2$ structures show only the abnormal growth of grains and their sizes increasing as the temperature increases above $400^{\circ}C$.

The Effect of Pressure on the Abnormal Grain Growth in Alumina (알루미나의 비정상 입자성장에 미치는 압력의 영향)

  • Park, Hoon;Park, Sang-Yeup
    • Journal of the Korean Ceramic Society
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    • v.37 no.7
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    • pp.617-624
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    • 2000
  • Abnormal grain growth in alumina was investigated during sinter-HIP process for better understanding of pressure effect on microstructural development. Abnormal grain growth of monolithic alumina was observed near surface region rather than interior region of specimen. Finite element analysis was used to estimate the pressure distribution developed in the specimen. Pressure distribution analysis was in good agreement with grain size distributjion in the specimen. The results of finite element analysis provided that abnormal grain growth monolithic alumina was resulted from the inhomogeneous pressure distribution in the specimen. MgO addition in alumina was effective for the suppression of abnormal grain growth in alumina under inhomogeneous pressure distribution during sinter-HIP process.

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Abnormal Grain Growth Behavior of $BaTiO_3$ Ceramics with Addition of Seed Grains (Seed 입자 첨가에 따른 $BaTiO_3$ 요업체의 비정상 입성장거동)

  • 이태헌;김정주;김남경;조상희
    • Journal of the Korean Ceramic Society
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    • v.32 no.5
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    • pp.587-593
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    • 1995
  • Abnomal grain growth behavior of BaTiO3 ceramics was investigated with addition of seed grains. It was foudn that the nucleation rate of abnormal grain was constant and growth of abnormal grain was linearly increased with sitnering time, regardless of amount of seed grains. These facts were also confirmed by fitting of the volume fraction of abnormal grain vs. sintering time using Avrami type equation (n=4). It was suggested that seed grains did not change the nucleation rate or growth mechanism of abnormal grain but increase the number of abnormal grains at initial stage of sintering and then it led to fine microstructure of BaTiO3 ceramics.

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Abnormal grain growth of ZnO ceramics (ZnO 세라믹스 거대입성장)

  • Kim, Young Jung
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.6
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    • pp.251-256
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    • 2019
  • In the process of ZnO ceramic sintering at a temperature of 1385℃, higher than the normal sintering temperature, some grains were growth up to mm scale. When sintered at 1400℃ for 8 hours, the size of the grains that are not involved in the abnormal growth is as large as 30~40 ㎛, but the size of the abnormal grown grain reaches 1,000 ㎛, which is more than 10,000 times bigger in volume than the normal one within 8 hr growth. As a cause of rapid and abnormal grain growth, primary particle size distribution, compaction density variation within sample and doping of impurities could be considered. The primary particle size distribution could be considered main reason for abnormal grain growth but no solid evidence was obtained. Through the observation of the microstructure, it is presumed that the giant grains grow absorbing the neighbor grains through a grain rotation process.

Quantitative Investigation of Grain Growth in Carbide Added(Mo$_2$C, ZrC and WC) to TiC-Ni Matrix Cermets

  • Kim, Soon-Ho
    • International Journal of Precision Engineering and Manufacturing
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    • v.5 no.1
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    • pp.19-26
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    • 2004
  • The growth of solid particles in TiC-XC-2vo1.% and TiC-XC-30vo1.% Ni alloys, (where X=Zr, W or Mo) was fitted to the equation of the form $d^3$-${do}^3$=Kt during the liquid phase sintering at 1,673K. Also, the grain growth behavior decreased markedly with the addition of ${MO}_2$C or WC and increased with the addition of zrC. The contiguity was greater in the alloys with a smaller growth rate constant and especially, decreased by increasing the Ni content in the TiC-${MO}_2$C-Ni alloy. In addition, the effect of the addition of carbide on the grain growth of 2 vo1.% Ni alloys was found to be similar to that of 30vo1.% Ni alloys. Consequently, the grain growth mechanism cannot be explained by the usual solution / reprecipitation process, but can be explained in terms of a new growth velocity equation, which includes the effects of contiguous carbide grain boundaries in restricting the overall grain growth, as well as the area of the solid / liquid interface in the alloy.

The Effects of TiN Particles on the HAZ Microstructure and Toughness in High Nitrogen TiN Steel

  • Jeong, H.C.;An, Y.H.;Choo, W.Y.
    • International Journal of Korean Welding Society
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    • v.2 no.1
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    • pp.25-28
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    • 2002
  • In the coarse grain HAZ adjacent to the fusion line, most of the TiN particles in conventional Ti added steel are dissolved and austenite grain growth is easily occurred during welding process. To avoid this difficulty, thermal stability of TiN particle is improved by increasing the nitrogen content in steel. In this study, the effect of hlgh nitrogen TiN particle on preventing austenite grain growth in HAZ was investigated. Increased thermal stability of TiN particle is helpful for preventing the austenite grain growth by pinning effect. High nitrogen TiN particle in simulated HAZ were not dissolved even at high temperature such as 1400'E and prevented the austenite grain growth in simulated HAZ. Owing to small austenite grain size in HAZ the width of coarse grain HAZ in high nitrogen TiN steel was decreased to 1/10 of conventional TiN steel. Even high heat input welding, the microstructure of coarse grain HAZ consisted of fine polygonal ferrite and pearlite and toughness of coarse grain HAZ was significantly improved.

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Behaviors of Grain Growth in Carbide Added TiC Matrix Cermets (탄화물첨가 TiC기지 서멧의 입성장 거동)

  • Shin, Soon-GI;Lee, Jun-Hee;Lee, Hwa-Sang
    • Korean Journal of Materials Research
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    • v.12 no.10
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    • pp.825-830
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    • 2002
  • The growth rate of solid grains in TiC-XC-2vol% and TiC-XC-30vo1% Ni cermets, where X=Zr, W or Mo, was fitted to an equation of the form $d^3$-$do^3$=Kt. The grain growth behavior during liquid phase sintering at 1673K decreased markedly with addition of $Mo_2$C or WC and increased with addition of ZrC. The contiguity ratio was greater in the alloys with smaller growth rate constant and decreased with increasing Ni content in the $TiC-Mo_2$C-Ni cermet. The grain growth mechanism could be explained by the effect of contiguous grain boundaries in restricting the overall grain growth.