• 한국해양공학회지
• /
• 제23권5호
• /
• pp.32-38
• /
• 2009

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between $1850^{\circ}C$ and $2050^{\circ}C$ were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• 마이크로전자및패키징학회지
• /
• 제14권3호
• /
• pp.37-42
• /
• 2007

반도체 소자의 집적도가 높아짐에 따라 3D SiP에 대한 관심이 높아지고 전기도금법을 이용한 구리 via filling이 활발히 연구되어왔다. Via filling시 via 입구와 바닥에 전류밀도 차이로 인해 via 내부에 결함이 발생하기 쉽다. 여러 가지 유기물 첨가제와 전류인가 방식의 변화를 통한 via filling을 하였다. 첨가된 유기물은 PEG, SPS, JGB, PEI를 사용하였다. 유기물이 첨가된 용액을 이용하여 펄스와 역펄스 방법을 이용하여 via filling을 하였다. 유기물의 첨가에 따른 도금된 구리 입자의 크기 및 형상에 관하여 고찰하였으며 도금 후 via 시편의 단면을 FESEM으로 관찰하였다. JGB에 비하여 PEI를 사용한 경우 치밀한 도금층을 얻을 수 있었다. 2 step via filling을 사용한 경우 via filling 시간을 단축시킬 수 있었다.

• Corrosion Science and Technology
• /
• 제10권4호
• /
• pp.143-150
• /
• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• 한국재료학회지
• /
• 제16권12호
• /
• pp.725-730
• /
• 2006

The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.

• 한국분말재료학회지
• /
• 제13권2호
• /
• pp.129-137
• /
• 2006

In this study, high purity fine $BaTiO_3$ powders were prepared by SHS (Self-propagating High-temperature Synthesis). We would examinate the study of sintering properties and characteristics as a function of temperature with various additives (binder, sintering agent). In separately binder addition, the green and sintered density of specimen were increased as binder content increases. The increased porosity resulted in fine grain size due to the inhibition of grain boundary moving. The $Al_{2}O_{3},\;TiO_{2}$ and MgO playa role of increasing dielectric constants at room temperature. These values were decreased at curie temperature. In case of $SiO_2$, the Curie temperature was decreased. In this study, a high dielectric ceramic capacitor material with temperature stability was synthesized by using various additives.

• 한국전기전자재료학회논문지
• /
• 제21권2호
• /
• pp.99-103
• /
• 2008

To improve efficiency of solar cells, it is important to make a light trapping structure to reduce surface reflectance for increasing absorption of sun light within the solar cells. One of the promising methods that can reduce surface reflectance is isotropic texturing with acid solution based on hydrofluoric acid(HF), nitric acid($HNO_3$), and organic additives. Anisotropic texturing with alkali solution is not suitable for multicrystalline silicon wafers because of its different grain orientation. Isotropic texturing with acid solution can uniformly etch multicrystalline silicon wafers unrelated with grain orientation, so we can get low surface reflectance. In this paper, the acid texturing solution is made up of only HF and $HNO_3$ for easy controlling the concentration and low cost compared to acid solution with organic additives. $HNO_3$ concentration and dipping time were varied to find the condition of minimum surface reflectance. Textured surfaces were observed Scanning Electron Microscope(SEM) and surface reflectance were measured. The best result of arithmetic mean(wavelength from 400 nm to 1000 nm) reflectance with acid texturing is 4.64 % less than alkali texturing.

• 한국세라믹학회지
• /
• 제27권6호
• /
• pp.799-807
• /
• 1990

In this study, effects of oxide additives on mechanical properties and microstructure of A1N and A1N polytype ceramics were investigated. Fine A1N powder was synthesized by nitriding alumiuim hydroxide prepared from Al-isopropoxide, at 1350$^{\circ}C$ for 10h in N2 atmosphere. By adding 3w/o Y2O3, 0.56w/o CaO, and 10w/o SiO2 to AlN powder, AlN and AlN polytype ceramics were prepared by hot-pressing under the pressure of 30 MPa at 1800$^{\circ}C$ for 1h. AlN ceramics with no additives formed considerable amount of AlON phase, while AlN ceramics doped with Y2O3 or CaO decreased AlON phase and formed Y-Al or Ca-Al oxide compound. AlN＋10w/o SiO2(＋3w/o Y2O3) composition produced AlON and AlN polytype compound having 21R as a major phase. Room temperature flexural strength of AlN ceramics with no additive was 246MPa, and room temperature flexural strength and critical temperature difference by thermal shock(ΔTc) of AlN ceramics dooped with Y2O3 or CaO were 532MPa/340$^{\circ}C$ and 423MPa/300$^{\circ}C$, respectively. Y2O3 and CaO used as sintering agent played roles of densification and oxygen removal of AlN ceramics, and affected grain growth/grain morphologies of AlN ceramics.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.16-17
• /
• 2007

To improve efficiency of solar cells, it is important to make a light trapping structure to reduce surface reflectance for increasing absorption of sun light within the solar cells. One of the promising methods that can reduce surface reflectance is isotropic texturing with acid solution based on hydrofluoric acid(HF), nitric acid($HNO_3$), and organic additives. Anisotropic texturing with alkali solution is not suitable for multicrystalline silicon wafers because of its different grain orientation. Isotropic texturing with acid solution can uniformly etch multicrystalline silicon wafers unrelated with grain orientation, so we can get low surface reflectance. In this paper, the acid texturing solution is made up of only HF and $HNO_3$ for easy controling the concentration and low cost compared to acid solution with organic additives. $HNO_3$ concentration and dipping time were varied to find the condition of minimum surface reflectance. Textured surfaces were observed Scanning Electron Microscope(SEM) and surface reflectance were measured. The best result of arithmetic mean(wavelength from 400nm to 1000nm) reflectance with acid texturing is 4.64% less than alkali texturing.

• 한국세라믹학회지
• /
• 제47권6호
• /
• pp.485-490
• /
• 2010

In our previous studies, continuous SiC fiber-reinforced SiC-matrix composites ($SiC_f$/SiC) had been fabricated by two different slurry infiltration methods: vacuum infiltration and electrophoretic deposition (EPD). 12 wt% of $Al_2O_3-Y_2O_3$-MgO with respect to SiC powder was used as additives for liquid-phase assisted sintering. After hot pressing at $1750^{\circ}C$ under 20 MPa for 2 h in Ar atmosphere, a high composite density could be achieved for both cases, whereas the problems such as large grain size and non-uniform distribution of liquid phase were observed, which was resulted in the relatively poor mechanical properties of composites. Therefore, efforts have been made to reduce the grain growth during the sintering, including the optimization for hot pressing condition and utilization of spark plasma sintering using a SiC monolith. Based on the results, spark plasma sintering was found to be effective method in decreasing the amount of sintering additive, time and grain growth, which will be explained in comparison to the results of hot pressing in this paper.

• Elastomers and Composites
• /
• 제43권3호
• /
• pp.183-190
• /
• 2008

본 연구에서는 polypropylene 복합재료의 내스크래치성을 향상 시키기 위한 연구를 수행하였다. 내스크래치성 개선을 위하여 PP의 분자량이 다른 두 종류의 PDMS계 M/B를 제조하여 각각의 함량에 따른 기계적 물성과 내스크래치성을 평가 하였다. 더 좋은 물성을 보인 마스터배치를 선택하여 grain pattern에 따른 내스크래치성을 평가 하였다. UTM과 편광현미경을 통하여 기계적 물성과 스크래치성을 평가 하였다. Color 3D laser Scanning microscope로 표면 grain pattern 형상을 관찰하였다. 마스터배치의 분자량과 함량에 따른 기계적 물성의 차이는 비교적 적은것으로 평가 되었으며 내스크래치 평가에서는 고분자량의 M/B를 첨가함에 따라 내스크래치성이 향상 되는 것으로 나타났다. Grain pattern에 따른 스크래치 평가에서는 grain pattern이 깊이가 깊고 불규칙하며 그 형태도 크고, 둥근형일 때 내스크래치성이 우수한 것으로 나타났다.