• Journal of Information Display
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• 제8권4호
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• pp.15-18
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• 2007

In this paper, we investigated the SLS process to control grain boundary(GB) location in TFT channel region, and it has been found to be applicable for locating the GB at the same location in the channel region of each TFT. We fabricated TFT by applying a new alignment SLS process and compared the TFT characteristics with a normal SLS method and the grain boundary location controlled SLS method. Also, we have analysed degradation phenomena under hot carrier stress conditions for n-type LDD MOSFETs.

• 한국전기전자재료학회논문지
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• 제31권5호
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• pp.307-312
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• 2018

Liquid phases in ZnO varistors cause more complex phase development and microstructure, which makes the control of electrical properties and reliability more difficult. Therefore, we have investigated 2 mol% $CaCO_3$ doped $ZnO-Co_3O_4-Cr_2O_3-La_2O_3$ (ZCCLCa) bulk ceramics as one of the compositions without liquid phase sintering additive. The results were as follows: when $CaCO_3$ is added to ZCCLCa ($644{\Omega}cm$) acting as a simple ohmic resistor, CaO does not form a secondary phase with ZnO but is mostly distributed in the grain boundary and has excellent varistor characteristics (high nonlinear coefficient ${\alpha}=78$, low leakage current of $0.06{\mu}A/cm^2$, and high insulation resistance of $1{\times}10^{11}{\Omega}cm$). The main defects $Zn_i^{{\cdot}{\cdot}}$ (AS: 0.16 eV, IS & MS: 0.20 eV) and $V_o^{\bullet}$ (AS: 0.29 eV, IS & MS: 0.37 eV) were found, and the grain boundaries had 1.1 eV with electrically single grain boundary. The resistance of each defect and grain boundary decreases exponentially with increasing the measurement temperature. However, the capacitance (0.2 nF) of the grain boundary was ~1/10 lower than that of the two defects (~3.8 nF, ~2.2 nF) and showed a tendency to decrease as the measurement temperature increased. Therefore, ZCCLCa varistors have high sintering temperature of $1,200^{\circ}C$ due to lack of liquid phase additives, but excellent varistor characteristics are exhibited, which means ZCCLCa is a good candidate for realizing chip type or disc type commercial varistor products with excellent performance.

• 한국자기학회지
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• 제5권5호
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• pp.416-420
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• 1995

An attempt has been made to investigate the mechanism of magnetic alignment in the magnets produced by upset forging the $Pr_{20}Fe_{74}B_{4}Cu_{2}$ cast bulk alloy. Upset forging of the cast alloy was carried out for 20 sec to an 80 % thickness reduction (strain rate : $4{$\times}10^{-2}s^{-1}$) in an open die configuration at varying temperatures in the range $600^{\circ}-900^{\circ}C$. It has been found that the upset forging process at temperatures above $800^{\circ}C$ can achieve a magnetic alignment to a great extent from copper-containing Pr-Fe- B-type cast ingot. The growth manner of the ferromagnetic $Pr_{2}Fe_{14}B$ matrix grain in Pr-Fe-B-type alloys was studied by examining the morphology change of the matrix grain in sintered body, and it was found that the matrix grains grew in anisotropic manner such that the grain grew more rapidly along the a- or b-axis than along the c-axis. This anisotropic grain growth led to the plate-like shape of the matrix grain. The magnetic alignment during the upset forging was attributed to grain boundary gliding of the plate-like grains, and the geometry of the grains in the cast ingot and the presence of a large amount of the praseodymium-rich grain boundary phase were thought to play a key role in the achievement of magnetic alignment.

• 한국표면공학회지
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• 제47권6호
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.1057-1060
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• 2001

By comparison of the experimental results in two systems of ZnO varistors, its appear that Sb$_2$O$_3$is the indispensable element for twinning in ZnO varistors, and the Zn$_{7}$Sb$_2$O$_{12}$ spinel acts as the nucleus to form twins. A1$_2$O$_3$is not the origin of twinning in ZnO varistor, but it was found that A1$_2$O$_3$could strengthen the twinning and form a deformation twinning by ZnA$_{12}$O$_4$-dragging and pinning effect. The inhibition ratios of grain growth and nonuniformity of two systems ZnO varistors increase with the increase of A1$_2$O$_3$content. The twins affect the inhibition of grain growth, the mechanism could be explained follow as : twins increase the mobility viscosity of ZnO grain and grain boundary, and drag ZnO grain and liquid grain boundary during the sintering, then the grain growth is inhibited, and the microstructure becomes more uniform.orm.m.

• 한국재료학회지
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• 제28권8호
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• pp.435-439
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• 2018

MA Al alloys are examined to determine the effects of alloying of Mg and Cu and rolling on tensile deformation behavior at 748 K over a wide strain rate range($10^{-4}-10^3/s$). A powder metallurgy aluminum alloy produced from mechanically alloyed pure Al powder exhibits only a small elongation-to-failure(${\varepsilon}_f$ < ~50%) in high temperature(748 K) tensile deformation at high strain rates(${\acute{\varepsilon}}=1-10^2/s$). ${\varepsilon}_f$ in MA Al-0.5~4.0Mg alloys increases slightly with Mg content(${\varepsilon}_f={\sim}140%$ at 4 mass%). Combined addition of Mg and Cu(MA Al-1.5%Mg-4.0%Cu) is very effective for the occurrence of superplasticity(${\varepsilon}_f$ > 500%). Warm-rolling(at 393-492 K) tends to raise ${\varepsilon}_f$. Lowering the rolling-temperature is effective for increasing the ductility. The effect is rather weak in MA pure Al and MA Al-Mg alloys, but much larger in the MA Al-1.5%Mg-4.0%Cu alloy. Additions of Mg and Cu and warm-rolling of the alloy cause a remarkable reduction in the logarithm of the peak flow stress at low strain rates (${\acute{\varepsilon}}$< ~1/s) and sharpening of microstructure and smoothening of grain boundaries. Additions of Mg and Cu make the strain rate sensitivity(the m value) larger at high strain rates, and the warm-rolling may make the grain boundary sliding easier with less cavitation. Grain boundary facets are observed on the fracture surface when ${\varepsilon}_f$ is large, indicating the operation of grain boundary sliding to a large extent during superplastic deformation.

• 한국전기전자재료학회논문지
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• 제24권12호
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• pp.962-968
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• 2011

In this study, we investigated the effects of Mn dopant (0.1~3.0 at% $Mn_3O_4$ sintered at 1000$^{\circ}C$ for 1 h in air) on the bulk trap (i.e. defect) and grain boundary properties of ZnO, ZM(0.1~3.0) using admittance spectroscopy (AS), and impedance-modulus spectroscopy (IS & MS). As a result, three kinds of defect were found below the conduction band edge of ZnO as 0.09~0.14 eV (attractive coulombic center), 0.22~25 eV ($Zn^{{\cdot}{\cdot}}_i$), and 0.32~0.33 eV ($V^{\cdot}_o$). The oxygen vacancy increased with Mn doping. In ZM, an electrically single grain boundary as double Schottky barrier was formed with 0.82~1.0 eV of activation energies by IS & MS. We also find out that the barriers of grain boundary of Mn-doped ZnO (${\alpha}$-factor=0.13) were more stabilized and homogenized with temperature compared to pure ZnO.

• 한국재료학회지
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• 제5권6호
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• pp.699-705
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• 1995

질화규소 요업체에서 입계상의 변화가 파괴인성에 미치는 영향에 대해 살펴보았다 실험에는 Si$_3$N$_4$-Y$_2$O$_3$-SiO$_2$(YS)계와 Si$_3$N$_4$-Y$_2$O$_3$-A1$_2$O$_3$(YA) 계를 사용하였으며, 175$0^{\circ}C$에서 Can/HIP 처리한 후 1800~200$0^{\circ}C$ 온도구간에서 열처리시키면서 입계상의 변화에 따른 파괴인성의 변화를 조사하였다. 열처리 온도구간에서 입계상이 비정질상만으로 존재하였던 YA계의 경우는 열처리 온도가 증가되어 입성장됨에 따라 파괴인성 값이 증가되었으나, 190$0^{\circ}C$ 이상에서 열처리될 때 입계상이 결정상에서 비정질상으로 변화하였던 YS계의 경우는 오히려 파괴인성 값이 급격히 감소되었다. YS계에서 파괴인성의 급격한 저하는 열처리 온도 증가에 따라 입계상이 결정상과 비정질상의 공존 상태에서 비정질상만의 상태로 전이하며 파괴거동에 영향을 미쳤기 때문이라고 생각된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 춘계학술발표대회 개요집
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• pp.43-45
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• 2003

The empirical model for predicting the prior austenite grain size in low-alloy steel weld HAZ was developed through examining the effect of alloying element. The test alloys were made by vacuum induction melting. Grain growth behaviors were observed and analyzed by isothermal grain growth test and subsequent metallography. As a result, it was found that the grain growth might be controlled by grain boundary diffusion and the empirical model for grain growth was presented.

• ETRI Journal
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• 제21권3호
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• pp.16-21
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• 1999

After etching Al-Cu alloy films using SiCl4/Cl_2/He/CHF3 mixed gas plasma, the corrosion phenomenon at the grain boundary of the etched surface and a passivation layer on the etched surface with an SF6 plasma treatment subsequent to the etching were studied. In Al-Cu alloy system, corrosion occurs rapidly on the etched surface by residual chlorine atoms, and it occurs dominantly at the grain boundaries rather than the crystalline surfaces. To prevent corrosion, the SF6 gas plasma treatment subsequent to etching was carried out. The passivation layer is composed of fluorine-related compounds on the etched Al-Cu surface after the SF6 treatment, and it suppresses effectively corrosion on the surface as the SF6 treatment pressure increases. Corrosion could be suppressed successfully with the SF6 treatment at a total pressure of 300 mTorr. To investigate the reason why corrosion could be suppressed with the SF6 treatment, behaviors of chlorine and fluorine were studied by various analysis techniques. It was also found that the residual chlorine incorporated at the grain boundary of the etched surface accelerated corrosion and could not be removed after the SF6 plasma treatment.