• Title/Summary/Keyword: Glass-to-metal contact

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Design of an Electron Ohmic-Contact to Improve the Balanced Charge Injection in OLEDs

  • Park, Jin-U;Im, Jong-Tae;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.283-283
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    • 2011
  • The n-doping effect by doping metal carbonate into an electron-injecting organic layer can improve the device performance by the balanced carrier injection because an electron ohmic contact between cathode and an electron-transporting layer, for example, a high current density, a high efficiency, a high luminance, and a low power consumption. In the study, first, we investigated an electron-ohmic property of electron-only device, which has a ITO/$Rb_2CO_3$-doped $C_{60}$/Al structure. Second, we examined the I-V-L characteristics of all-ohmic OLEDs, which are glass/ITO/$MoO_x$-doped NPB (25%, 5 nm)/NPB (63 nm)/$Alq_3$ (32 nm)/$Rb_2CO_3$-doped $C_{60}$(y%, 10 nm)/Al. The $MoO_x$doped NPB and $Rb_2CO_3$-doped fullerene layer were used as the hole-ohmic contact and electron-ohmic contact layer in all-ohmic OLEDs, respectively, Third, the electronic structure of the $Rb_2CO_3$-doped $C_{60}$-doped interfaces were investigated by analyzing photoemission properties, such as x-ray photoemission spectroscopy (XPS), Ultraviolet Photoemission spectroscopy (UPS), and Near-edge x-ray absorption fine structure (NEXAFS) spectroscopy, as a doping concentration at the interfaces of $Rb_2CO_3$-doped fullerene are changed. Finally, the correlation between the device performance in all ohmic devices and the interfacial property of the $Rb_2CO_3$-doped $C_{60}$ thin film was discussed with an energy band diagram.

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Dual Nano-Electrospray and Mixing in the Taylor Cone

  • Radionova, Anna;Greenwood, David R.;Willmott, Geoff R.;Derrick, Peter J.
    • Mass Spectrometry Letters
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    • v.7 no.1
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    • pp.21-25
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    • 2016
  • Dual-channel nano-electrospray has recently become an ionization technique of great promise especially in biological mass spectrometry. This unique approach takes advantage of the mixing processes that occurs during electrospray. Understanding in more detail the fundamental principles influencing spray formation further study of the origins of the mixing processes: (1) in a Taylor cone region, (2) in charged droplets or (3) in both environments. The dual-channel emitters were made from borosilicate theta-shape glass tubes (O.D. 1.2 mm) and had a tip diameters of less than 4 μm. Electrical contact was achived by deposition of a thin film of an appropriate metal onto the surface of the emitter. The experimental investigation of the Taylor cone formation in a dual-channel electrospray emitter has been carried out by injection of polystyrene beads (diameter 3 μm) at very low concentrations into one of the channels of the non-tapered theta-glass tubes. High-speed camera experiments were set up to visualize the mixing processes in Taylor cone regions for dual-channel emitters. Mass spectra from dual nano-electrospray are presented.

Fully Cu-based Gate and Source/Drain Interconnections for Ultrahigh-Definition LCDs

  • Kugimiya, Toshihiro;Goto, Hiroshi;Hino, Aya;Nakai, Junichi;Yoneda, Yoichiro;Kusumoto, Eisuke
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1193-1196
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    • 2009
  • Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.

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Failure in the COG Joint Using Non-Conductive Adhesive and Polymer Bumps (감광성 고분자 범프와 NCA (Non-Conductive Adhesive)를 이용한 COG 접합에서의 불량)

  • Ahn, Kyeong-Soo;Kim, Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.33-38
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    • 2007
  • We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

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Analysis of Frequency Characteristics of Writing Instruments Due to Friction (필기구 마찰의 주파수 특성 분석)

  • Shin, JaeUn;Park, JinHwak;Lee, YoungZe
    • Tribology and Lubricants
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    • v.33 no.4
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    • pp.148-152
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    • 2017
  • The feel of writing is important to customers when they buy smart devices with stylus such as smartphones and tablet computers. With an aim to reproduce the tactile sensibility of writing instruments when people write on the glass display using a stylus, this study focuses on the frequency characteristics of writing instruments that can describe the vibrations of writing instruments sliding over counter surfaces. In addition, this study includes the effect of various factors influencing the friction of writing instruments such as lubricant, nib material, and contact type. We perform sliding experiments with six types of writing instruments and a sheet of paper to understand the relation between the friction conditions of the nib and the frequency characteristics. As this research focuses on the tactile perception of human skin when people use a writing instrument, the analysis of frequency characteristics is performed in the perceptible frequency range of mechanoreceptors in the human skin. As a result, three types of frequency characteristics are identified. Low frequency peaks are observed for a metal nib with ink; high frequency peaks are observed for a nib without ink; and, middle frequency peaks with a wide range of distribution occurs for fabric nibs with ink. Therefore, to implement the proper feel of writing, at least three types of vibrations have to be made.

Plasma Polymerized Styrene for Gate Insulator Application to Pentacene-capacitor (유기박막트랜지스터 응용을 위해 플라즈마 중합된 Styrene 게이트 절연박막)

  • Hwang, M.H.;Son, Y.D.;Woo, I.S.;Basana, B.;Lim, J.S.;Shin, P.K.
    • Journal of the Korean Vacuum Society
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    • v.20 no.5
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    • pp.327-332
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    • 2011
  • Plasma polymerized styrene (ppS) thin films were prepared on ITO coated glass substrates for a MIM (metal-insulator-metal) structure with thermally evaporated Au thin film as metal contact. Also the ppS thin films were applied as organic insulator to a MIS (metal-insulatorsemiconductor) device with thermally evaporated pentacene thin film as organic semiconductor layer. After the I-V and C-V measurements with MIM and MIS structures, the ppS revealed relatively higher dielectric constant of k=3.7 than those of the conventional poly styrene and very low leakage current density of $1{\times}10^{-8}Acm^{-2}$ at electric field strength of $1MVcm^{-1}$. The MIS structure with the ppS dielectric layer showed negligible hysteresis in C-V characteristics. It would be therefore expected that the proposed ppS could be applied as a promising dielectric/insulator to organic thin film transistors, organic memory devices, and flexible organic electronic devices.

Development of an Automated Design System of CNG Composite Vessel using Steel Liner Manufactured by D.D.I Process (D.D.I 공정으로 제조된 금속라이너를 이용한 CNG 복합재 압력용기의 설계 자동화 시스템 개발)

  • Kim, Eui-Soo;Kim, Ji-Hoon;Park, Yoon-So;Kim, Chul;Choi, Jae-Chan
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.1
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    • pp.205-213
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    • 2003
  • The fiber reinforced composite material is widely used in the multi-industrial field where the weight reduction of the infrastructure is demanded because of their high specific modulus and specific strength. It has two main merits which are to cut down energy by reducing weight and to prevent explosive damage preceding to the sudden bursting which is generated by the pressure leakage condition. Therefore, Pressure vessels using this composite material in comparison with conventional metal vessels can be applied in the field such as defense industry, aerospace industry and rocket motor case where lightweight and the high pressure are demanded. In this paper, for nonlinear finite element analysis of E-glass/epoxy filament winding composite pressure vessel receiving an internal pressure, the standard interpretation model is developed by using the ANSYS, general commercial software, which is verified as the accuracy and useful characteristic of the solution based on Auto LISP and ANSYS APDL. Both the preprocessor for doing exclusive analysis of filament winding composite pressure vessel and postprocessor that simplifies result of analysis have been developed to help the design engineers.

The Wetting Properties of UBM-coated Si-wafer to the Lead-free Solders in Si-wafer/Bumps/Glass Flip-Chip Bonding System

  • Hong, Soon-Min;Park, Jae-Yong;Park, Chang-Bae;Jung, Jae-Pil;Kang, Choon-Sik
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.74-79
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    • 2000
  • In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

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Fabrication and Characterization of Multi-Channel Electrode Array (MEA) (다중 채널 전극의 제작 및 특성 평가)

  • Seong, Rak-Seon;Gwon, Gwang-Min;Park, Jeong-Ho
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.51 no.9
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    • pp.423-430
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    • 2002
  • The fabrication and experimentation of multi-channel electrodes which enable detecting and recording of multi-site neuronal signals have been investigated. A multi-channel electrode array was fabricated by depositing 2000${\AA}$ thick Au layer on the 1000${\AA}$ thick Ti adhesion layer on a glass wafer. The metal paths were patterned by wet etching and passivated by depositing a PECVD silicon nitride insulation layer to prevent signals from intermixing or cross-talking. After placing a thin slice of rat cerebellar granule cell in the culture ring located in central portion of the multi-channel electrode plate, a neuronal signal from an electrode which is in contact with the cerebellar granule cell has been detected. It was found that the electrode impedance ranges 200㏀∼1㏁ and the impedance is not changed by cleaning with nitric acid. Also, the impedance is inversely proportion to the exposed electrode area and the cross-talk is negligible when the electrode spacing is bigger than 600$\mu\textrm{m}$. The amplitude and frequency of the measured action potential were 38㎷ and 2㎑, which are typical values. From the experimental results, the fabricated multi-channel electrode array proved to be suitable for multi-site neuronal signal detection for the analysis of a complicated cell network.

Development of GMAW Process with Twin Torch for Wide Overlay using Compound Filler Plate (분말 용가재판을 사용한 광폭 오버레이용 트윈토치 GMAW 공정개발)

  • Hwang, Kyu-Min;Kim, Sung-Deok;Jung, Byung-Ho;Cho, Sang-Myung
    • Journal of Welding and Joining
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    • v.26 no.4
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    • pp.44-49
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    • 2008
  • Generally, wear plate is steel plate having improved surface contact strength and impact strength by surface hardening which is welded using materials with good corrosion resistance, wear resistance and thermal resistance property. CFP GMAW(Compound Filler Plate Gas Metal Arc Welding) is the cladding method using GMAW with the CFP, which is bound with waterglass, on the substrate. It has advantages of reducing compound powder loss, uniform penetration, and preventing hardness decrease. To develope mass production technique of CFP GMAW process for production of high quality wear plate, the method for controling shallow penetration and increasing productivity is required. In this study, twin torch method applied to CFP GMAW process for increasing productivity. And the method was developed by controling penetration control, CFP dry time, gas formation flux and water glass concentration. As a result, applying twin torch method to CFP GMAW process was possible and high quality wide bead could be made without overlap joint.