• 대한간호학회지
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• 제36권6호
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• pp.1033-1041
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• 2006

Purpose: Glass particle contamination of the contents of single-dose glass ampules can occur upon opening. Different aspiration techniques, different sizes of needles, different sizes of ampules, and different cutting methods were studied to determine if they had any effect on glass particle contamination. Method: Different aspiration techniques(with filter, without filter), different sizes of needles(18G, 25G), different sizes of ampules(2ml, 20m1), and different cutting methods(with cotton, without cotton) were evaluated. Method: Twenty ampules were randomly assigned in each group. Three slides containing glass particles for each ampule were made and counted under a microscope by 3 study blind persons. Result: The number of glass particle contamination is much less when using a filter rather than without a filter. The number of glass particle contamination is much less when using a 25G needle rather than on 18G needle. The number of glass particle contamination is much less when using 2ml ampules rather than 20m1 ampules. The number of glass particle contamination is much less when using cotton rather than without cotton. Conclusion: It was shown that using a filter, a small size needle, smaller sized ampules and using cotton when cutting the ampule will decrease the risk of parenteral injection of glass particles.

• 기본간호학회지
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• 제14권2호
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• pp.166-172
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• 2007

Purpose: The purpose of this study was to examine the factors influencing glass particle contamination in single dose glass ampules upon opening. Method: The study was single case experimental design. Different methods of opening ampule (hand, wooden stick), different sizes of ampules(1cc, 2cc) and different sizes of needles(17gauge, 23gauge, $5{\mu}m$ filter) were evaluated. Eighteen ampules were randomly assigned in each group. The number of glass ampule particles ${\ge}10{\mu}m$ was counted by microscope. Results: There was no significant difference in the number of particles aspirated by opening methods. But number of glass particles was much lower when using 1cc ampules rather than 2cc ampules and was also much lower when using smaller size needles and needles which include a $5{\mu}m$ filter rather than larger size of needles. Conclusion: We suggest that larger bore or unfiltered needles increase the risk of aspirating more glass particles than smaller bore or filter needles. In addition, these data show that a wooden stick can be used as a method opening glass ampules.

• 한국재료학회지
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• 제6권1호
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• pp.3-11
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• 1996

대면적 정전 접합 장치를 고안 및 제작하여 Si과 glass를 정전 접합시켰다. 여러 온도에서 정전 접합 후 접합 면적을 측정하였으며 접합이 이루어진 경우 그 접합 면적이 90%를 넘었다. 접합시 전류를 측정하여 접합 강도와의 관계를 살펴보였다. 잔류 공공을 생성시키는 원인은 재료의 표면 거칠기 차이나 전극의 모양보다는 불순물 입자에 의한 것임이 밝혀졌고 같은 크기의 불순물 입자에 대한 공공의 크기는 접합 온도가 높을수록 감소하였다. 정전 접합에 미치는 불순물의 영향을 공공의 크기 및 불순물 입자의 크기를 측정하여 살펴보았다.

• 환경영향평가
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• 제8권4호
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• pp.25-35
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• 1999

Fly ash, by-product from coal fired power station, has long been regarded as a potential contamination source for heavy metals and inorganics due to their enriched concentrations and associations with particle surface. Feed coal and fly ash samples were collected from two power stations; Yongdong deliang with domestic anthracite coals and Boryong with imported bituminous coals. The coal and fly ash samples were analyzed for chemical composition and mineral components, using XRF and XRD. Batch leaching experiments were conducted by agitating samples with deionised water for 24 hours. Anthracite coals are generally higher in Al and Si contents than bituminous coals. This is due to the higher ash contents of the anthracite coal than bituminous coal. The chemistry of the two fly ash samples shows broadly similar compositions each other, except for the characteristically high contents of Cr in anthracite coal fly ash. Leaching experiments revealed that concentrations of metals gradually decreased with leachings in general. However, measurable amounts of metals were present in the effluent from weathered ash and the samples subjected to the leaching procedure. These metals are likely to indicate that the metals in fly ash were incorporated into glass fraction as well as associated with particle surface of samples. Dissolution of aluminosilicate glass would control releasing heavy metals from fly ash as weathering progresses during landfill with implication of possible groundwater contamination through fly ash landfill.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.49.1-49.1
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• 2010

The particle generation during the plasma enhanced process is highly considered as serious problem in the semiconductor manufacturing industry. The material for the plasma processing chamber requires the plasma etching characteristics which are homogeneously etched surface and low plasma etching depth for preventing particulate contamination and high durability. We found that the materials without grain boundaries can prevent the particle generation. Therefore, the amorphous material with the low plasma etching rate may be the best candidate for the plasma processing chamber instead of the polycrystalline materials such as yttria and alumina. Three glasses based on $SiO_2$ and $Al_2O_3$ were prepared with various rare-earth elements (Gd, Y and La) which are same content in the glass. The glasses were plasma etched in the same condition and their plasma etching rate was compared including reference materials such as Si-wafer, quartz, yttria and alumina. The mechanical and thermal properties of the glasses were highly related with cationic field strength (CFS) of the rare-earth elements. We assumed that the plasma etching resistance may highly contributed by the thermal properties of the fluorine byproducts generated during the plasma exposure and it is expected that the Gd containing glass may have the highest plasma etching resistance due to the highest sublimation temperature of $GdF_3$ among three rare-earth elements (Gd, Y and La). However, it is found that the plasma etching results is highly related with the mechanical property of the glasses which indicates the cationic field strength. From the result, we conclude that the glass structure should be analyzed and the plasma etching test should be conducted with different condition in the future to understand the plasma etching behavior of the glasses perfectly.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2009년도 학술논문요약집
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• pp.84-85
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• 2009

New approaches for detecting, preventing and remedying environmental damage are important for protection of the environment. Procedures must be developed and implemented to reduce the amount of waste produced in chemical processes, to detect the presence and/or concentration of contaminants and decontaminate fouled environments. Contamination can be classified into three general types: airborne, surface and structural. The most dangerous type is airborne contamination, because of the opportunity for inhalation and ingestion. The second most dangerous type is surface contamination. Surface contamination can be transferred to workers by casual contact and if disturbed can easily be made airborne. The decontamination of the surface in the nuclear facilities has been widely studied with particular emphasis on small and large surfaces. The amount of wastes being produced during decommissioning of nuclear facilities is much higher than the total wastes cumulated during operation. And, the process of decommissioning has a strong possibility of personal's exposure and emission to environment of the radioactive contaminants, requiring through monitoring and estimation of radiation and radioactivity. So, it is important to monitor the radioactive contamination level of the nuclear facilities for the determination of the decontamination method, the establishment of the decommissioning planning, and the worker's safety. But it is very difficult to measure the surface contamination of the floor and wall in the highly contaminated facilities. In this study, the poly(styrene-ethyl acrylate) [poly(St-EA)] core-shell composite polymer for measurement of the radioactive contamination was synthesized by the method of emulsion polymerization. The morphology of the poly(St-EA) composite emulsion particle was core-shell structure, with polystyrene (PS)as the core and poly(ethyl acrylate) (PEA) as the shell. Core-shell polymers of styrene (St)/ethyl acrylate (EA) pair were prepared by sequential emulsion polymerization in the presence of sodium dodecyl sulfate (SOS) as an emulsifier using ammonium persulfate (APS) as an initiator. The polymer was made by impregnating organic scintillators, 2,5-diphenyloxazole (PPO) and 1,4-bis[5-phenyl-2-oxazol]benzene (POPOP). Related tests and analysis confirmed the success in synthesis of composite polymer. The products are characterized by IT-IR spectroscopy, TGA that were used, respectively, to show the structure, the thermal stability of the prepared polymer. Two-phase particles with a core-shell structure were obtained in experiments where the estimated glass transition temperature and the morphologies of emulsion particles. Radiation pollution level the detection about under using examined the beta rays. The morphology of the poly(St-EA) composite polymer synthesized by the method of emulsion polymerization was a core-shell structure, as shown in Fig. 1. Core-shell materials consist of a core structural domain covered by a shell domain. Clearly, the entire surface of PS core was covered by PEA. The inner region was a PS core and the outer region was a PEA shell. The particle size distribution showed similar in the range 350-360 nm.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.44.2-44.2
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• 2009

Polycrystalline materials suchas yttria and alumina have been applied as a plasma resisting material for the plasma processing chamber. However, polycrystal line material may easily generate particles and the particles are sources of contamination during the plasma enhanced process. Amorphous material can be suitable to prevent particle generation due to absence of grain-boundaries. We manufactured nitrogen-containing $SiO_2-Al_2O_3-Y_2O_3$ based glasses with various contents of silicon and fixed nitrogen content. The thermal properties, mechanical properties and plasma etching rate were evaluated and compared for the different composition samples. The plasma etching behavior was estimated using XPS with depth profiling. From the result, the plasma etching rate highly depends on the silicon content and it may results from very low volatile temperature of SiF4 generated during plasma etching. The silicon concentration at the plasma etched surface was very low besides the concentration of yttrium and aluminum was relatively high than that of silicon due to high volatile temperature of fluorine compounds which consisted with aluminum and yttrium. Therefore, we conclude that the samples having low silicon content should be considered to obtain low plasma etching rate for the plasma resisting material.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.23-23
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• 2011

Chemical-Mechanical Planarization (CMP) 공정이란 화학적 반응 및 기계적인 힘이 복합적으로 작용하여 표면을 평탄화하는 공정이다. 이러한 CMP 공정은 반도체 산업에서 회로의 고집적화와 다층구조를 형성하기 위하여 도입되었으며 반도체 제조를 위한 필수공정으로 그 중요성이 강조되고 있다. 특히 최근에는 Inter-Level Dielectric (ILD)의 형성과 Shallow Trench Isolation (STI) 공정에서실리콘 산화막을 평탄화하기 위한 CMP 공정에 대해 연구가 활발히 이루어지고 있다. 그러나 CMP 공정 후 scratch, pitting corrosion, contamination 등의 Defect가 발생하는 문제점이 존재한다. 이 중에서도 scratch는 기계적, 열적 스트레스에 의해 생성된 패드의 잔해, 슬러리의 잔유물, 응집된 입자 등에 의해 표면에 형성된다. 반도체 공정에서는 다양한 종류의 실리콘 산화막이 사용되고 gks이러한 실리콘 산화막들은 종류에 따라 경도가 다르다. 따라서 실리콘 산화막의 경도에 따른 CMP 공정 및 이로 인한 Scratch 발생에 관한 연구가 필요하다고 할 수 있다. 본 연구에서는 scratch 형성의 거동을 알아보기 위하여 boronphoshposilicate glass (BPSG), plasma enhanced chemical vapor deposition (PECVD) tetraethylorthosilicate (TEOS), high density plasma (HDP) oxide의 3가지 실리콘 산화막의 기계적 성질 및 이에 따른 CMP 공정에 대한 평가를 실시하였다. CMP 공정 후 효율적인 scratch 평가를 위해 브러시를 이용하여 1차 세정을 실시하였으며 습식세정방법(SC-1, DHF)으로 마무리 하였다. Scratch 개수는 Particle counter (Surfscan6200, KLA Tencor, USA)로 측정하였고, 광학현미경을 이용하여 형태를 관찰하였다. Scratch 평가를 위한 CMP 공정은 실험에 사용된 3가지 종류의 실리콘 산화막들의 경도가 서로 다르기 때문에 동등한 실험조건 설정을 위해 동일한 연마량이 관찰되는 조건에서 실시하였다. 실험결과 scratch 종류는 그 형태에 따라 chatter/line/rolling type의 3가지로 분류되었다 BPSG가 다른 종류의 실리콘 산화막에 비해 많은 수에 scratch가 관찰되었으며 line type이 많은 비율을 차지한다는 것을 확인하였다. 또한 CMP 공정에서 압력이 증가함에 따라 chatter type scratch의 길이는 짧아지고 폭이 넓어지는 것을 확인하였다. 본 연구를 통해 실리콘 산화막의 경도에 따른 scratch 형성 원리를 파악하였다.

• 반도체디스플레이기술학회지
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• 제22권3호
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• pp.130-135
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• 2023

Plasma-resistant ceramic (PRC) is a material used to prevent internal damage in plasma processing equipment for semiconductors and displays. The challenge is to suppress particles falling off from damaged surfaces and increase retention time in order to improve productivity and introduce the latest miniaturization process. Here, we confirmed the effect of suppressing plasma deterioration and reducing the etch rate through surface treatment of existing PRC with an initial illumination level of 200 nm. In particular, quartz glass showed a decrease in etch rate of up to 10%. Furthermore, it is believed that micro-scale secondary particles formed on the microstructure of each material grow as crystals during the fluoridation process. This is a factor that can act as a killer defect when dropped, and is an essential consideration when analyzing plasma resistance. The plasma etching suppression effect of the initial illumination is thought to be due to partial over etching at the dihedral angle of the material due to the sputtering of re-emission of Ar+-based cations. This means that plasma damage due to densification can also be interpreted in existing PRC studies. The research results are significant in that they present surface treatment conditions that can be directly applied to existing PRC for mass production and a new perspective to analyze plasma resistance in addition to simple etching rates.