• Fisheries and Aquatic Sciences
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• 제5권1호
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• pp.36-42
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• 2002

Microarrayer is used to make DNA chip and microarray that contain hundreds to thousands of immobilized DNA probes on surface of a microscope slide. This paper shows the develop-ment results for a printing type of microarrayer. It realizes a typical, low-cost and efficient microarrayer for generating low density micro array. The microarrayer is developed by using a prependicular type robot with three axes. It is composed of a computer-controlled three-axes robot and a pen tip assembly. The key component of the arrayer is the print-head containing the tips to immobilize cDNA, genomic DNA or similar biological material on glass surface. The robot is designed to automatically collect probes from two 96-well plates with up to 12 pens at the same time. To prove the performance of the developed microarrayer, we use the general water types of inks such as black, blue and red. The inks are distributed at proper positions of 96 well plates and the three color inks are immobilized on the slide glass under the operation procedure. As the result of the test, we can see that it has sufficient performance for the production of low integrated DNA chip consisted of 96 spots within $1cm^2$ area.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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• pp.286-289
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• 2003

We investigated the influence of the properties of substrate material on the separation efficiency in microchip electrophoresis. We fabricated the various microchips and studied separation efficiency in microchannels composed of a single material such as quartz, glass, polydimethylsiloxane (PDMS), and polymethylmetha crylate (PMMA), as well as hybrid micro channels composed of different materials. New fabrication process for glass chip was suggested and some treatment is added to improve fabrication process in other chip. Separation efficiency was compared by measuring migration times and bandwidths of EOF and analytes in each microchip. The efficiency is the function of migration time, which is affected by the electroosmotic flow (EOF), and bandwidth of an analyte. EOF is highly dependent upon the characteristics of a microchannel wall surface. Migration time was more reproducible in silica chips than that of PDMS chip and more band broadening was observed in the microchip composed of hybrid material due to non-uniformity of surface charge density at the walls of the channel.

• International Journal of Precision Engineering and Manufacturing
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• 제8권1호
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• pp.11-15
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• 2007

Composite materials are widely used to make all kinds of machine parts, internal and structural materials of cars, aerospace components, building structures, ship materials, sporting goods and others, It is worth while to use composite space substitute material in various applications when compared with others. But the use of composite material is limited in the field of the mechanical processing because of the difficulties in processing. Thus, it is proved that the surface is rough at the in and out sections of the hole processing when the GFRP is machined with HSS drill in the vertical machining center. And it is observed that the more it is processed, the more the fluid type long chip is changed into the powdered chip.

• 한국기계가공학회지
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• 제11권3호
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• pp.19-23
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• 2012

Glassy carbon is widely used for high temperature melting process such as quartz due to its thermal stability. For utilizing Classy Carbon to glass mold press(GMP) optical lens, brittleness of Glassy Carbon is main obstacle of ultraprecision machining. Thus authors investigated ductile machining of Glassy Carbon adopting turning and grinding process respectively. From the experiments, ultraprecision turning surfaces resulted brittle crack in all machining conditions and ultraprecision grinding surfaces showed semi-ductile mode in small undeformed chip thickness conditions.

• 센서학회지
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• 제20권3호
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• 한국정밀공학회지
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• 제29권3호
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• pp.261-265
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• 2012

In this study, glassy carbon was ground for lens core of glass mold press. Ultraprecision grinding process was applied for machining of core surfaces. During the process, brittle crack occurred because of hard-brittleness of glassy carbon. Author investigated optimized grinding conditions from the viewpoint of ductile mode grinding. Geometrical undeformed chip thickness was adopted for critical chip thickness that enables crack free surface. Machined cores are utilized for biaspheric glass lens fabrication and surfaces of lens were compared for verification of ground surface.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• 대한전자공학회논문지SD
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• 제38권6호
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• pp.412-419
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• 2001

본 논문에서는 유리집적광학을 이용하여 채널 도파로, Y-분리기, CWDM 등의 개별소자와 이들을 하나의 유리기판위에 평면형으로 집적하겨 제작함으로써 1.31/1.55㎛ CWDM(Coarse Wavelength Division Multiplexing) 및 1.55㎛ 대역 DWDM (Dense WDM) 수동 광 망에 적용할 수 있도록 하였다. CWDM에 적용한 결과, 1.55㎛ 파장에서는 30㏈, 1.31㎛ 파장에서는 15㏈ 이상의 교차 비를 얻을 수 있었다.

• 한국세라믹학회지
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• 제36권5호
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

• 한국정밀공학회지
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• 제31권9호
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.