• Title/Summary/Keyword: Glass Ceramic Processing

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Effects of Additives on Dielectric Properties and Microstructure of MLCC X7R Composition (첨가물의 형태가 MLCC X7R 조성의 유전 특성 및 미세구조에 미치는 영향)

  • Moon, Hwan;Kim, Min-Kee;Jeon, Hyun-Pyo;Ahn, Jae-Pyoung;Yoon, Jung-Rag;Chung, Tae-Serk
    • Journal of the Korean Ceramic Society
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    • v.40 no.7
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    • pp.644-651
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    • 2003
  • Effects of additives on electrical properties and microstructure of MLCC X7R dielectrics have been investigated. The additives of glass frit or oxide form were added in the same main composition by the different powder processing conditions. As a result of the dielectric property and microstructure analysis, the composition having the glass layer with dopant concentration gradient showed the excellent dielectric properties. The MLCCs were fabricated with the excellent composition and all dielectric properties satisfied the X7R requirements.

Development of Transparent Dielectric Paste for PDP

  • Kim, Hyung-Jong;Kyoung Joo;Auh, Ken-Ho
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1998.09a
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    • pp.79-83
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    • 1998
  • Plasma display panel is a potential candidate for HDTV, due to the fact hat the expansion of screen size is much easier using thick film technology. In this study, transparent dielectric materials using lead borosilicate glasses is developed, which satisfy the requirements of dielectrics for PDP. Paste is made of this glass composition. The paste has thixotropic behavior suitable for screen printing. The paste shows more thixotropic behavior as the particle size decrease. After firing, cross sectional area was analyzed by SEM. The void of fired thick film was removed using bimodal particle system. The dielectric showed good adhesion characteristics.

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Development of transparent dielectric paste for PDP (플라즈마 디스플레이용 투명 유전체 페이스트의 개발)

  • Kim, Hyung-Jong;Chung, Yong-Sun;Joo, Kyoung;Auh, Keun-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.1
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    • pp.50-54
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    • 1999
  • Plasma display panel is a potential candidate for HDTV, due to the fact that the screen size can easily be increased by a thick film technology. In this study, transparent dielectric materials which satisfied the requirements of dielectrics for PDP was developed using lead alumina borosilicate glasses. The Paste which had thixotropic behavior suitable for screen printing was made of this glass composition. the paste became more thixotropic as the particle size decreased. After firing, the cross sectional area of the thick film was analyzed by SEM. The voids in the thick film were removed using bimodal particle system. The dielectric thick film showed good adhesion characteristics.

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SOL-GEL PROCESSING AND MATERIAL SCIENCE

  • Korobova, N.E.;Soh, Deawha;Chu, Sun-Nam
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.477-480
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    • 1998
  • Sol-gel processing, which started some decades back as a laboratory curiosity, has proved to be a powerful and versatile technique for the synthesis of materials. The utility of the sol-gel method for producing glass and ceramic materials in the form of powders, fibers, thin films and bulk shapes with high purity, functional microstructures and potentially high chemical homogeneity at relatively low temperature (compared to conventional processing) has been discussed.

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Micro-machining of Glass Air Hole using Ultrasonic Machining (초음파 가공에 의한 미세 에어홀 가공 기술)

  • 김병희;전성건;남권선;김헌영;전병희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.04a
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    • pp.48-52
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    • 2004
  • Ultrasonic machining is effective for machining of extreme hard and brittle materials, including glass, ceramic, carbide, graphite. The major machining principle involves the direct hammering as well as the impact of abrasive panicles on the workpiece. Also, it involve cavitation erosion. The general workpiece is flat side. This study attempted micro hole machining of a curved surface of glass tube. Ultrasonic machining is fault of the slow machining speed. An experiment does and got 16 seconds validity machining time as increasing the processing speed. Moreover, entrance crack and surface roughness was similar both machining speed is slow and fast. Several micro hole of glass tube machined using one micro tool, but tool wear is infinitesimal.

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Processing of Silica-Bonded Silicon Carbide Ceramics

  • Chun, Yong-Seong;Kim, Young-Wook
    • Journal of the Korean Ceramic Society
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    • v.43 no.6 s.289
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    • pp.327-332
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    • 2006
  • The effect of the processing parameters on the sintered density and strength of silica-bonded SiC (SBSC) ceramics was investigated for three types of batches with different particle sizes. The SBSC ceramics were fabricated by an oxidation-bonding process. The process involves the sintering of powder compacts in air so that the SiC particles bond to each other by oxidation-derived $SiO_2$ glass or cristobalite. A finding of this study was that a higher flexural strength was obtained when the starting powder was smaller. When a ${\sim}0.3_{-{\mu}m}$ SiC powder was used as a starting powder, a high strength of $257{\pm}42\;MPa$ was achieved at a relative density of ${\sim}80%$.

A Study of High Temperature Filtration Performance Test on Low Density Cylindrical Ceramic Filters (저밀도 원통형 세라믹 필터의 고온 여과 성능시험 연구)

  • 이동섭;홍민선;최종인
    • Journal of Korean Society for Atmospheric Environment
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    • v.17 no.2
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    • pp.213-222
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    • 2001
  • Cylindrical type ceramic filers, that is 60 O.D$\times$10t$\times$600L and 60 O.D$\times$10t$\times$1,000L were manufactured by vacuum forming processes using ceramic ray materials. For cylindrical type ceramic filters, porosity and bulk density were measured for, 80 to 90% and 0.3 to 0.4 g/㎤, respectively at uniform pore size of 41 to 45${\mu}{\textrm}{m}$. Bench scale candle filters (60$\psi$ $\times$10t$\times$600L) were tested using different dusts collected from many industries including chemical processing, glass processing and metal manufacturing pants. Collection efficiencies found out to range from 99.87% to 99.90%, while resistance coefficients from 1.1$\times$10(sup)11/$m^2$ to 1.7$\times$10(sup)11/$m^2$ . Full scale low density ceramic filters (60$\psi$ $\times$10t$\times$1,000L) were also tested at 1 atm, $600^{\circ}C$ to reveal the filtration efficiency, conditioning, and resistance coefficients using two different types of dust as chemical processing and metal refined processing. Darcys law resistance coefficients were measured to range 1.44$\times$10(sup)11/$m^2$ to 2.74$\times$10(sup)11/$m^2$, and collection efficiencies on the range 99.84 to 99.96%, Finally, results of long term performance test showed that filters were conditioned after 170hrs. Experimental conditions for effective filtration were examined under the condition 10 cm/sec face velocity, 3kg/$\textrm{cm}^2$ pulsing pressure, 5 min filtration cycle, and 300msec pulse opening time.

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Low Temperature Processing and Properties of Porous Frit-Bonded SiC Ceramics (프릿을 이용한 다공질 SiC 세라믹스의 저온 제조 공정 및 물성)

  • Chae, Su-Ho;Kim, Young-Wook;Song, In-Hyuck;Kim, Hai-Doo;Bae, Ji-Soo;Na, Sang-Moon;Kim, Seung-Il
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.488-492
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    • 2009
  • Porous frit-bonded SiC ceramics were successfully prepared at a temperature as low as $800^{\circ}C$ from SiC, frit, and microbeads (glass or polymer). The effects of SiC starting particle size and microbead addition on microstructure, porosity, and flexural strength were investigated. The addition of hollow glass microbead improved the strength of frit-bonded SiC ceramics without the loss of porosity by acting additional binder phase between SiC grains. The 65 ${\mu}m$-sized SiC resulted in lower porosity and higher strength than 50 ${\mu}m$-sized SiC because of higher packing density. Typical flexural strengths of frit-bonded SiC were 23 MPa at 46% porosity and 19 MPa at 49% porosity.

Performance Test of Ceramic Filter Collector for the heavy-oil boiler for Concurrent treatment Dust and Nitrogen Oxides (분진 및 질소산화물 동시처리를 위한 1톤 중유 보일러용 세라믹 필터 집진기의 성능실험)

  • Jung, Wan-Bo;Cho, Jung-Sick
    • Journal of the Korean Society of Industry Convergence
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    • v.21 no.6
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    • pp.355-360
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    • 2018
  • The product developed in this study is a ceramic catalyst filter for 1 ton heavy-oil boiler that can simultaneously process dust and nitrogen oxides. This has been developed for simultaneous processing of nitrogen oxides and dust at high efficiency of hot exhaust gas (approximately $300^{\circ}C$) generated after burning 1 ton heavy oil boiler. Ceramic catalytic filters for 1 tonne heavy-duty glass display are technologies that remove 90% of dust and 85% or more of nitrogen oxides. This is an improved new technology to integrate exhaust ventilation and desiccation devices into one, thereby reducing the production process and improving the economy. To this end, the performance test of the catalytic filter for heavy oil boilers was carried out, and the durability of the PLC circuit was constructed.

Electrical Properties of DC Sputtered Titanium Nitride Films with Different Processing Conditions and Substrates

  • Jin, Yen;Kim, Young-Gu;Kim, Jong-Ho;Kim, Do-Kyung
    • Journal of the Korean Ceramic Society
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    • v.42 no.7 s.278
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    • pp.455-460
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    • 2005
  • Deposition of TiN$_{x}$ film was conducted with a DC sputtering technique. The effect of the processing parameters such as substrate temperature, deposition time, working pressure, bias power, and volumetric flowing rate ratio of Ar to N$_{2}$ gas on the resistivity of TiN$_{x}$ film was systematically investigated. Three kinds of substrates, soda-lime glass, (100) Si wafer, and 111m thermally grown (111) SiO$_{2}$ wafer were used to explore the effect of substrate. The phase of TiN$_{x}$ film was analyzed by XRD peak pattern and deposition rate was determined by measuring the thickness of TiNx film through SEM cross-sectional view. Resistance was obtained by 4 point probe method as a function of processing parameters and types of substrates. Finally, optimum condition for synthesizing TiN$_{x}$ film having lowest resistivity was discussed.