• 식품보건융합연구
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• 제10권4호
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• pp.1-8
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• 2024

This study investigates the impact of servicescape elements in franchise fast food restaurants on the attitudes and revisit intentions of Generation MZ. Employing a mixed-methods approach, we surveyed 231 MZ consumers across five major urban centers. Our findings reveal that ambient conditions, spatial layout, and technology integration significantly influence MZ consumers' perceptions and behaviors. Specifically, sustainability-oriented design, customizable spaces, and seamless digital integration emerged as key drivers of positive attitudes and increased revisit intentions. Furthermore, we identify important generational differences, with Gen Z placing higher importance on Instagram-worthy aesthetics and contactless service options compared to Millennials. This research contributes to servicescape theory by proposing a novel framework tailored to MZ consumers in the fast food context. It offers practical implications for franchise operators seeking to attract and retain this crucial demographic. Our study highlights the evolving preferences of younger consumers and underscores the need for adaptable servicescape strategies in the fast food industry. The results suggest that franchises investing in environmentally conscious designs, flexible spaces, and cutting-edge technology are likely to see improved customer satisfaction and loyalty among MZ consumers. Future research could explore the long-term effects of these servicescape elements on brand perception and market share within the competitive fast food landscape.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제16권6호
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• pp.1973-1993
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• 2022

Model-driven engineering (MDE) and aspect-oriented software development (AOSD) contribute to the common goal of development of high-quality code in reduced time. To complement each approach with the benefits of the other, various methods of integration of the two approaches were proposed in the past. Aspect-oriented code generation, which targets obtaining aspect-oriented code directly from aspect models, offers some unique advantages over the other integration approaches. However, the existing aspect-oriented code generation approaches do not comprehensively address all aspects of a model-driven code generation system, such as a textual representation of graphical models, conceptual mapping, and incorporation of behavioral diagrams. These problems limit the worth of generated code, especially in practical use. Here, we propose AJFCode, an approach for aspect-oriented model-driven code generation, which comprehensively addresses the various aspects including the graphical models and their text-based representation, mapping between visual model elements and code, and the behavioral code generation. Experiments are conducted to compare the maintainability and reusability characteristics of the aspect-oriented code generated using the AJFCode with the most comprehensive object-oriented code generation approach. AJFCode performs well in terms of all metrics related to maintainability and reusability of code. However, the most significant improvement is noticed in the separation of concerns, coupling, and cohesion. For instance, AJFCode yields significant improvement in concern diffusion over operations (19 vs 51), coupling between components (0 vs 6), and lack of cohesion in operations (5 vs 9) for one of the experimented concerns.

• 에너지공학
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• 제28권3호
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• pp.42-54
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• 2019

태양광 풍력 발전은 한국의 에너지 전환에 있어서 핵심적인 요소이다. 특히 이산화탄소 감축과 미세먼지 저감을 위해서 태양광 풍력 발전 확대 보급은 정책적으로나, 사회적으로 필수 불가결한 선택이다. 이에 본 논문은 태양광 풍력 확대에 대응하여 한국 전력시스템 내에서 추가적으로 발생하는 비용, 즉 통합 비용에 대해 분석하고자 한다. 2019년~2030년에 걸친 "8차 전력수급기본계획", "재생에너지3020 이행계획"과 2016년 태양광 풍력 발전량을 기반으로 KEPTA를 활용하여 시나리오 분석한 결과, 2030년 13.94Won/kWh~32.55Won/kWh의 통합비용이 필요하며, 백업비용은 8.94Won/kWh, 균형비용은 1.03Won/kWh~4.45Won/kWh, 계통접속비용은 3.97Won/kWh~19.16Won/kWh가 필요한 것으로 나타났다. 이러한 추가 비용이 확보될 때 태양광 풍력 발전의 확대를 위한 전력시스템 내 안정성이 확보될 것으로 예상한다. 향후 태양광 풍력 발전의 기술 개발과 전력저장장치 도입, 그리고 도매시장 가격 변화 등을 고려한 연구가 필요하다.

• 한국멀티미디어학회논문지
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• 제4권5호
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• pp.439-445
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• 2001

본 논문에서는 SMIL 기반 멀티미디어 문서를 웹에서 동적으로 생성하는 방법을 제안한다. 생성되는 멀티미디어 문서는 W3C에서 권장하는 SMIL(Synchronized Multimedia Integration Language)을 사용한다. 제안한 방법은 사용자 프로파일에 따라 자동적으로 XSLT 문서를 생성한 후, 미리 작성된 XML 문서와 결합하여 SMIL 문서를 실시간으로 생성한다. 기존 대부분의 웹 문서가 HTML에 기반함으로써 재사용성 및 문서에 포함되는 객체들의 동기적 관계의 지원이 어렵지만, 제안된 방법은 XML에 기반함으로써 재사용성을 지원하고 SMIL에 기반한 다양한 멀티미디어 문서를 효율적으로 생성한다. 적용한 예로서, 원격 강의에서 학습자에 따라 문서 생성 시스템을 보였으며, 응용 분야로는 전자 상거래, 원격 강의, 웹기반 멀티미디어 문서 편집 등이다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.523-528
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• 2001

There are many difficult problems in analyzing the flow characteristics in a high voltage circuit breaker such as shock wave and complex geometries, which may be either static or in relative motion. Although a variety of mesh generation techniques are now available, the generation of meshes around complicated, multicomponent geometries like a gas circuit breaker is still a tedious and difficult task for the computational fluid dynamics. This paper presents the computational method for analyzing the compressible flow fields in a high voltage gas circuit breaker using the Cartesian cut-cell method based on the CFD-CAD integration, which can achieve the accurate representation of the geometry designed by a CAD tools. The technique is frequently satisfied, and it will be almost universally so in the future, as the CFD-CAD traffic increases.

• 융합경영연구
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• 제12권1호
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• pp.39-51
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• 2024

Purpose: This study aims to derive planning directions of community facilities integrating generations based on local communities to promote sustainable intergenerational exchange by analyzing the spatial configuration and programs of domestic and foreign generation-integrated community facilities based on local communities. Research design, data and methodology: Through theoretical consideration, the concept of intergenerational integration, types of intergenerational exchange, and spatial arrangement types were identified. Then, case study analysis of domestic and foreign community facilities with well-planned intergenerational exchange spaces and programs were conducted to identify intergenerational integration, and to derive community facility planning direction. Results: The results of this research are as follows. First, in terms of humanware, in order to revitalize continuous exchange between the 1st, 2nd, and 3rd generations, a systematic support system is needed to build mutual trust through voluntary participation by each generation. Second, it is important to provide a variety of shared spaces while maintaining the uniqueness of each facility from a hardware perspective, and must be planned in such a way that selective interaction takes place with privacy and interaction in mind. Third, in terms of software, programs that meet the characteristics of each user must be provided. Conclusions: It is expected that the results of this research can be used as basic data for planning community facilities that integrate generations based on local communities, contributing to the search for sustainable ways to revitalize intergenerational exchange in the future.

• 제어로봇시스템학회논문지
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• 제14권10호
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• pp.1081-1087
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• 2008

This paper describes limitations and solutions of the existing processor-monitoring concept for a military supersonics aircraft Flight Control Computer (FLCC) equipped with modern architecture processor to perform the system integration test. Safecritical FLCC integration test, which requires automatic test for thousands of test cases and real-time input/output test condition generation, depends on the processor-monitoring device called Processor Interface (PI). The PI, which relies upon on the FLCC processor's external address and data-bus data, has some limitations due to multi-fetching capability of the modern sophisticated military processors, like C6000's VLIW (Very-Long Instruction Word) architecture and PowerPC's Superscalar architecture. Several techniques for limitations were developed and proper monitoring approach was presented for modem processor-adopted FLCC system integration test.

• 한국유체기계학회 논문집
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• 제12권1호
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• pp.43-50
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• 2009

Waste heat recovery process designs and performance analyses are conducted on the IGCC(Integrated Gasification Combined Cycle) power plants integrated with two different coal gasification and gas cleanup processes by Shell and GE/Texaco. Through the analysis results, the present study provides the steam integration concept between the HRSG and the chemical processes of IGCC power plant, and investigates the effect of steam integration on the power generation of IGCC power plant. The present simulation results show less steam power output and higher overall IGCC efficiency of the Shell-based power plant than the GE/Texaco.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.