• Proceedings of the Korean Society of Applied Pharmacology
• /
• 2002.07a
• /
• pp.73-78
• /
• 2002

Microfluidic lab-on-a-chip (LOC) systems have enabled a new generation ofassay technologies in chemical and biomedical sciences. Caliper's microfluidic LOC systems contain a network of microscopic channels through which fluids and chemical are moved in order to perform experiments. The main advantages of these continuous-flow devices are integration and automation of multiple steps in complex analytical procedures to improve the reproducibility of the results, and eliminated the manual labor, time and pipetting errors involved in analyses. The present talk is devoted to give a brief introduction of microfluidic basics and to present in applying continuous-flow microchips to drug screening with model enzyme assays.

• The Magazine of the IEIE
• /
• v.29 no.9
• /
• pp.1020-1020
• /
• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.65-89
• /
• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.31 no.7
• /
• pp.1-10
• /
• 1982

This paper derives the algorithm to estimate the operating cost, its marginal cost, and the reliability indices for the long term planning of power system. Treating the load duration curve and the system in the stochastic sense takes the place of the inverted load duration curve, effective load duration curve, and the numerical integration in the conventional methods. The time and accuracy of computation are substantially improved due to the fact that all expressions are represented by simple analytic form instead of the existing recursive form.

• Journal of Advanced Marine Engineering and Technology
• /
• v.29 no.3
• /
• pp.319-324
• /
• 2005

This paper reports the performance of Wind-PV(Photovoltaic) hybrid system. The output power of PV is affected by the environmental factors such as solar radiation and cell temperature. Also, the output power of wind system is generated with wind power. Integration of Wind and PV resources, which are generally complementary, usually reduce the capacity of the battery. This paper includes discussion on system reliability, power quality and effects of the randomness of the wind and the solar radiation on system design.

• Proceedings of the Korean Information Science Society Conference
• /
• 2002.10c
• /
• pp.70-72
• /
• 2002

본 논문에서는 분산된 XML 문서를 수집 처리하여 상호 제공하는 과정에서 활용될 통합된 XML 문서의 전역 스키마를 생성하는 시스템을 제안한다. 제안된 시스템에서는 분산 환경에 존재하는 개별적인 XML 문서들에 대한 지역 스키마 정보를 관계형 데이터베이스로 구축하고, 통합된 XML 문서의 데이터를 기반으로 각각의 지역 스키마 데이터베이스를 검색한 후 데이터에 적합한 스키마 정의를 추출하게 된다. 또한 추출과정에서 중복 정의에 의한 충돌 범주를 분석하고, 이를 해결하는 방법도 제시하였다. 시스템 모델링 결과 XML 문서의 구조와 검증을 명확하게 보장하는 통합된 XHL 문서의 전역 스키마 생성과 지역 스키마간 발생되는 충돌문제 해결이 가능함을 알 수 있었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.63-67
• /
• 2008

3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.3
• /
• pp.15-20
• /
• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• Journal of The Korea Institute of Healthcare Architecture
• /
• v.22 no.1
• /
• pp.17-28
• /
• 2016

Purpose: The purpose of this paper is to analyze the spatial configurations of a sample of Korean regional emergency medical centers (REMCs) to explore its underlying genotypes and thus produce a base line data for the analysis and evaluations of future REMCs designs using space syntax theory. Methods: Space syntax analysis was used as a major tool for the analysis and exploration of Genotype. The measures of Integration(overall integration with exterior and without exterior as well as the integration of individual clinical spaces for each center), base difference factor (DF) and Space link ratio were calculated for a sample of seven Korean REMCs. Results: The result shows a strikingly similar pattern of Syntactic measures across the sample, the mean integration of sample ranges from 0.82-0.99 with exterior (while considering the exterior space as a root) and 0.81-1.01 without exterior (considering the connections of interior spaces only with no outside connection). The base difference factor (DF) of the sample varies from 0.60-0.81 with exterior and from 0.59-0.82 without exterior. Case number-1 was identified as non-genotype with differing order of Syntactic values. Although the genotype had different forms, layouts and even sizes, these results cannot be explained by Phenotypical comparisons. Implications: This study will contribute to the configurational analysis and evaluation of existing and future Korean REMCs design and practice of emergency healthcare delivery system in Korea.

• Genomics & Informatics
• /
• v.10 no.2
• /
• pp.69-73
• /
• 2012

The explosive development of genomics technologies including microarrays and next generation sequencing (NGS) has provided comprehensive maps of cancer genomes, including the expression of mRNAs and microRNAs, DNA copy numbers, sequence variations, and epigenetic changes. These genome-wide profiles of the genetic aberrations could reveal the candidates for diagnostic and/or prognostic biomarkers as well as mechanistic insights into tumor development and progression. Recent efforts to establish the huge cancer genome compendium and integrative omics analyses, so-called "integromics", have extended our understanding on the cancer genome, showing its daunting complexity and heterogeneity. However, the challenges of the structured integration, sharing, and interpretation of the big omics data still remain to be resolved. Here, we review several issues raised in cancer omics data analysis, including NGS, focusing particularly on the study design and analysis strategies. This might be helpful to understand the current trends and strategies of the rapidly evolving cancer genomics research.