• 한국초전도ㆍ저온공학회논문지
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• 제23권2호
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• pp.1-5
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• 2021

We have investigated the electrical transport properties of polycrystalline tantalum nitride (TaN_x) films. Various compositions of tantalum (nitride) thin films have been deposited on SiO₂ substrates by reactive DC magnetron sputtering while changing the ratio of nitrogen partial pressure. The substrate temperature was maintained at 283 K during deposition. X-ray diffraction analyses indicated the presence of α-Ta and β-Ta phases in the Ta film deposited in pure argon atmosphere, while fcc-TaN_x phases appeared in the sputtering gas mixture of argon and nitrogen. The N/Ta atomic ratio in the film increased ranging from 0.36 to 1.07 for nitrogen partial pressure from 7 to 20.7%. The superconducting transition temperatures of the TaN_x thin films were measured to be greater than 3.86 K with a maximum of 5.34 K. The electrical resistivity of TaN_x thin film was in the range of 177-577 𝜇Ωcm and increased with an increase in nitrogen content. The upper critical filed at zero temperature for a TaN_0.87 thin film was estimated to exceed 11.3 T, while it showed the lowest T_c = 3.86 K among the measured superconducting TaN_x thin films. We try to explain the behavior of the increase of the residual resistivity and the upper critical field for TaN_x thin films with the nitrogen content by using the combined role of the intergrain Coulomb effect and disorder effect by grain boundaries.

• 대한금속재료학회지
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• 제50권8호
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• pp.613-618
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• 2012

We report on electrical and mechanical properties of silicon nitride ($SiN_x$) films deposited by a plasma enhanced chemical vapor deposition (PECVD) method at $200^{\circ}C$ from $SiH_4$ highly diluted in $N_2$. The films were also prepared from $SiH_4$ diluted in He for comparison. The $N_2$ dilution was also effective in improving adhesion of the $SiN_x$ films, fascilitating construction of thin film transistors (TFTs). Metal-insulator-semiconductor (MIS) and Metal-insulator-Metal (MIM) structures were used for capacitance-voltage (C-V) and current-voltage (I-V) measurements, respectively. The resistivity and breakdown field strength of the $SiN_x$ films from $N_2$-diluted $SiH_4$ were estimated to be $1{\times}10^{13}{\Omega}{\cdot}cm$, 7.4 MV/cm, respectively. The MIS device showed a hysteresis window and a flat band voltage shift of 3 V and 0.5 V, respectively. The TFTs fabricated by using these films showed a field-effect mobility of $0.16cm^2/Vs$, a threshold voltage of 3 V, a subthreshold slope of 1.2 V/dec, and an on/off ratio of > $10^6$.

• 한국자기학회지
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• 제7권5호
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• pp.250-257
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• 1997

Ar+N$_{2}$ 가스분위기에서 반응성 스퍼터링법으로 제조된 Fe-Nb-B-N 박막의 미세구조 및 자기적 특성을 조사하였다. 질소첨가한 적정조성의 Fe-Nb-B-N 박막은 우수한 고주파 연자기 특성을 보였는데, 그 특성은 다음과 같다. 포화자화(4 .pi. M$_{s}$ )는 16.5 kG, 보자력(H$_{c}$)은 0.13 Oe, 1 MHz에서의 실효투자율은 약 5,000의 값을 나타내었다. 특히 실효투자율은 10 MHz까지 겨의 변화가 없었으며, 100 MHz에서도 약 2,000의 값을 보여 매우 우수한 고주파 특성을 가진 재료로 판단된다. 한편, 이러한 우수한 특성을 지닌 Fe-Nb-B-N 박막의 미세구조를 TEM으로 관찰한 결과, 적정 열처리온도인 590 .deg. C에서 열처리한 Fe-Nb-B-N 박막은 약 5 ~ 10 nm의 .alpha. -Fe phase, Nb-nitride의 석출물과 Nb-B rich 비정질상 등으로 이루어져 있음을 알 수 있었다. 반면에 N이 첨가되지 않은 Fe-Nb-B 박막의 경우에는 약 10 nm정도의 .alpha. -Fe결정립과 Nb-B rich 비정질상의 두가지 상으로 이루어져 있다. 따라서 N을 첨가한 경우에 더욱 미세한 .alpha. -Fe 결정립을 얻을 수 있음이 확인되었다. 이는 N 첨가로 인한 결정립의 미세화 효과 와 Nb-nitride 형성으로 인한 결정립 성장의 억제효과에 의한 것으로 생각된다. 따라서 Fe-Nb-B-N 박막의 우수한 연자기 특성은 결정립 미세화에 기인하는 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.74-74
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• 2009

Titanium nitride has been used as hardmask for semiconductor process, capacitor of MIM type and diffusion barrier of DRAM, due to it's low resistivity, thermodynamic stability and diffusion coefficient. Characteristics of the TiN film are high intensity and chemical stability. The TiN film also has compatibility with high-k material. This study is an experimental test for better condition of TiN film etching process. The etch rate of TiN film was investigated about etching in $BCl_3/Ar/O_2$ plasma using the inductively coupled plasma (ICP) etching system. The base condition were 4 sccm $BCl_3$ /16 sccm Ar mixed gas and 500 W the RF power, -50 V the DC bias voltage, 10 mTorr the chamber pressure and $40\;^{\circ}C$ the substrate temperature. We added $O_2$ gas to give affect etch rate because $O_2$ reacts with photoresist easily. We had changed $O_2$ gas flow rate from 2 sccm to 8 sccm, the RF power from 500 W to 800 W, the DC bias voltage from -50 V to -200 V, the chamber pressure from 5 mTorr to 20 mTorr and the substrate temperature from $20\;^{\circ}C$ to $80\;^{\circ}C$.

• 열처리공학회지
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• 제20권6호
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• pp.311-317
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• 2007

This study examined the phase changes, nitride precipitation and variation in mechanical properties of STS 304, STS 321 and STS 316L austenitic stainless steels after high temperature gas nitriding (HTGN) at temperature ranges from $1050^{\circ}C\;to\;1150^{\circ}C$. Fine round type of $Cr_2N$ nitrides were observed in the surface layers of 304 and 316L steels, even more in STS 321. Additionally, square type of TiN was found in STS 321 austenitic matrix too. As a result of many precipitates in the surface layer of the STS 321, it was seen $370{\sim}470Hv$ hardness variation depending on the HTGN treatment conditions, and interior region of austenite represented 150Hv. The surface hardness value of STS 304 and STS 316L showed $255{\sim}320Hv$, respectively. The nitrogen content was shown 0.27, 1.7 and 0.4% respectively at the surface layers of the STS 304, STS 321 and STS 316L. After the HTGN it was shown the improvement of corrosion resistance of the STS 321 and STS 316L compared with solution annealed steels in the solution of 1N $H_2SO_4$ whereas the STS 304 was not.

• Tribology and Lubricants
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• 제13권2호
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• pp.96-104
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• 1997

This paper was focused on the wear characteristics of ion-nitrided metal and with ion-nitride processing, which is basically concerned with the effects of carbon content in workpiece and added carbon content gas atmosphere on the best wear performance. Increased carbon content in workpiece increases compound layer thickness, but decreases diffusion layer thickness. On the other hand, a small optimal amount of carbon content in gas atmosphere increase compound layer thickness as well as diffusion layer thickness and hardness. Wear tests show that the compound layer of ion-nitrided metal reduces wear rate when the applied wear load is small. However, as the load becomes large, the existence of compound layer tends to increase wear rate. Compressive residual stress at the compound layer is the largest at the compound layer, and decreases as the depth from the surface increases. It is found in the analysis that under small applied load, the critical depth where voids and cracks may be created and propagated is located at the compound layer, so that the adhesive wear is created and the existence of compound layer reduces the amount of wear. When the load becomes large, the critical depth is located below the compound layer and delamination, which may explained by surface deformation, crack nucleation and propagation, is created and the existence of compound layer increases wear rate. For the compound layer, at added carbon contents of 0 percent and 0.5 at. percent, the $\varepsilon$ monophase is predominant. But at 0.7 at. percent added carbon, the $\varepsilon$ monophase formation tends to be severely inhibited and r' and $Fe_3C$ polyphase formation becomes dominant. This increased hard $\varepsilon$ phase layer was observed to be more beneficial in reducing friction and wear.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.3-4
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• 2000

Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.211-211
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• 1999

Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.5-18
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• 1996

The solid state cesium ion source os alumino-silicate based zeolite which contains cerium. The material is an ionic conductor. Cesiums are stably stored in the material and one can extract the cesiums by applying electric field across the electrolyte. Cesium ion bombardment has the unique property of producing high negative ion yield. This ion source is used as the primary source for the production of a negative ion without any gas discharge or the need for a carrier gas. The deposition of materials as an ionic species in the energy range of 1.0 to 300eV is recently recognized as a very promising new thin film technique. This energetic non-thermal equilibrium deposition process produces films by “Kinetic Bonding / Energetic Condensation" mechansim not governed by the common place thermo-mechanical reaction. Under these highly non-equilibrium conditions meta-stable materials are realized and the negative ion is considered to be an optimum paeticle or tool for the purpose. This process differs fundamentally from the conventional ion beam assisted deposition (IBAD) technique such that the ion beam energy transfer to the deposition process is directly coupled the process. Since cesium ion beam sputter deposition process is forming materials with high kinetic energy of metal ion beams, the process provider following unique advantages:(1) to synthesize non thermal-equilibrium materials, (2) to form materials at lower processing temperature than used for conventional chemical of physical vapor deposition, (3) to deposit very uniform, dense, and good adhesive films (4) to make higher doposition rate, (5) to control the ion flux and ion energy independently. Solid state cesium ion beam sputter deposition system has been developed. This source is capable of producing variety of metal ion beams such as C, Si, W, Ta, Mo, Al, Au, Ag, Cr etc. Using this deposition system, several researches have been performed. (1) To produce superior quality amorphous diamond films (2) to produce carbon nitirde hard coatings(Carbon nitride is a new material whose hardness is comparable to the diamond and also has a very high thermal stability.) (3) to produce cesiated amorphous diamond thin film coated Si surface exhibiting negative electron affinity characteristics. In this presentation, the principles of solid state cesium ion beam sputter deposition and several applications of negative metal ion source will be introduced.

• 한국세라믹학회지
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• 제34권2호
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• pp.209-215
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• 1997

Reactive Single Ion Beam Sputtering 방법을 이용하여 AIN박막을 증착하고 물성을 분석하였다. 반응성 가스로 질소 가스 또는 암모니아 가스를 이용하였다. 증착된 AIN박막의 구조적, 화학적, 광학적 물성을 분석하기 위해 XRD, GAXRD, TEM, SEM, XPS, UV/VIS spectrophotometer, FT-IR등을 이용하였다. XRD, GAXRD분석결과에 의하면 증착된 모든 AIN박막은 비정질이었으나 TEM분석결과에서는 비정질 속에 육방정의 AIN미세결정들이 분포해 있었다. 그리고 FT-IR과 XPS분석을 통하여 Al-N결합을 확인하였으며, 화학양론적인 조성이 됨에 따라 UV-VIS spectrophotometery 분석에서 투광성이 증가하며 광학적 밴드갭은 6.2eV까지 증가함을 확인하였다. 또한 단면과 표면 형상관찰에서는, 반응성 가스로 질소 가스나 암모니아 가스에 관계없이, 결정입계가 전혀 관찰되지 않는 아주 평활한 현상이었으며 굴절율은 1.6~1.7의 값을 갖는다.