• Title/Summary/Keyword: GaN powder

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Growth Performance, Hematological Parameter and Fatty Acid Composition of Growing Olive Flounder (Paralichthys olivaceus) to Dietary Inclusion of Kelp Meal, Krill Meal, Garlic Powder or Citrus Meal (배합사료에 크릴, 켈프, 마늘 또는 감귤 분말 첨가가 넙치 육성어의 성장, 혈액 성상 및 지방산 조성에 미치는 영향)

  • Seo, Joo-Young;Kim, Kyoung-Duck;Son, Maeng-Hyun;Lee, Sang-Min
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.43 no.5
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    • pp.557-561
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    • 2010
  • This feeding experiment was conducted to investigate the effects of dietary inclusion of some additives on growth performance, hematological parameter and fatty acid composition of growing flounder. Triplicate groups of fish (average weight 120 g) were fed one of five diets containing 5% kelp meal (Ke), 10% krill meal (Kr), 1% garlic powder (Ga), 1% citrus meal (Ci) or control diet (Con) without supplementation for 15 weeks. After the feeding experiment, survival was not significantly different among the groups fed the different diets. Weight gain of fish fed the Ci diet was significantly higher than that of fish fed the Kr diet, but not significantly different from Con, Ke and Ga treatments. Feed efficiency and protein efficiency ratio of fish fed the Ga diet were significantly higher than those of fish fed the other diets. Total protein, glucose, GOT, GPT and total cholesterol contents in the plasma were not affected by the dietary additives. Composition of C20:4n-6 in the dorsal muscle of fish fed the Con diet was significantly higher than that of fish fed the other diets. The results of this study suggest that the dietary inclusion of garlic meal at 1% may improve feed utilization of growing flounder.

Effect of Thermal Annealing for MgGa2Se4 Single Crystal Thin Film Grown by Hot Wall Epitaxy (뜨거운 곁쌓기 법에 의해 성장된 MgGa2Se4 단결정 박막의 열처리 효과)

  • Bang, Jinju;Kim, Hyejeong;Park, Hwangseuk;Kang, Jongwuk;Hong, Kwangjoon
    • Journal of Sensor Science and Technology
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    • v.23 no.1
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    • pp.51-57
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    • 2014
  • The evaporating materials for $MgGa_2Se_4$ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films, $MgGa_2Se_4$ compounded polycrystal powder was deposited on thoroughly etched semi-insulated GaAs(100) substrate by the hot wall epitaxy (HWE) method system. The source and substrate temperatures of optimized growth conditions, were $610^{\circ}C$ and $400^{\circ}C$, respectively.The source and substrate temperatures were $610^{\circ}C$ and $400^{\circ}C$, respectively. The crystalline structure of the single crystal thin films was investigated by double crystal X-ray diffraction (DCXD). The temperature dependence of the energy band gap of the $MgGa_2Se_4$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)=2.34\;eV-(8.81{\times}10^{-4}\;eV/K)T^2/(T+251\;K)$. After the as-grown $MgGa_2Se_4$ single crystal thin films was annealed in Mg-, Se-, and Ga-atmospheres, the origin of point defects of $MgGa_2Se_4$ single crystal thin films has been investigated by the photoluminescence (PL) at 10 K. The native defects of $V_{Mg}$, $V_{Se}$ obtained by PL measurements were classified as a donors or acceptors type. And we concluded that the heat-treatment in the Se-atmosphere converted $MgGa_2Se_4$ single crystal thin films to an optical n-type. Also, we confirmed that Ga in $MgGa_2Se_4$/GaAs did not form the native defects because Ga in $MgGa_2Se_4$ single crystal thin films existed in the form of stable bonds.

Quality characteristics and antioxidant activities of wet noodle added with seunggumcho (Angelica gigas N Leaf) powder (승검초분말을 첨가한 생면의 품질특성 및 항산화 활성)

  • Hwang, Hyun-Ju;Lee Park, Hyo-Nam;Lee, Seung-Joo
    • Korean Journal of Food Science and Technology
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    • v.51 no.2
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    • pp.120-126
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    • 2019
  • In this study, the quality characteristics and antioxidant activities of wet noodles added with seunggumcho (Angelica gigas N Leaf) powder at concentrations of 1, 2, 3, and 4%, respectively, were investigated. The moisture contents and pH of the samples showed a tendency to decrease with increasing amounts of seunggumcho powder. Texture measurement indicated that 'hardness,' 'springiness,' and 'chewiness' of the cooked noodle were the highest in the control group, and these parameters showed a tendency to decrease with increasing amounts of seunggumcho powder. The total polyphenol contents in wet noodles added with seunggumcho powder increased with increasing amounts of seunggumcho powder. 2,2-diphenyl-1-picrylhydrazyl radical scavenging activity was the lowest in the control group (10.85%) and highest in the 4% addition group (44.84%). ${\alpha}-Glucosidase$ inhibitory activity showed the lowest value in control group (1.17%), and increased with increasing amounts of seunggumcho powder. The sensory preference score was the highest for color, flavor, taste, and chewiness in the 2% addition sample. The findings of this study suggest the feasibility of seunggumcho added wet noodles as a health food with physiological benefits and provide evidence for introducing various health foods by adding seunggumcho.

TEM Sample Preparation of Heterogeneous Materials by Tripod Polishing and Their Microstructures (Tripod Polishing을 이용한 불균질 재료의 TEM 시편준비 방법과 미세조직 관찰)

  • Kim, Yeon-Wook;Cho, Myung-Ju
    • Applied Microscopy
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    • v.34 no.2
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    • pp.95-102
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    • 2004
  • The TEM samples prepared by ion milling have the advantage that thin area can be obtained from almost any materials. However, it has the disadvantage that the amount of thin area can often be quite limited. For the cross-sectioned samples and grossly heterogeneous materials, the thickness of less than $0.1{\mu}m$ can be achieved by mechanical grinding and polishing (tripod polisher) and then the TEM samples may be ion-milled for final thinning or cleaning. These approaches were described in this paper. Examples of TEM observations were taken from cross-section samples of thin films on silicon and sapphire, from diffusion layers between $Mo_5Si_3\;and\;Mo_2B$, and from rapidly solidified 304 stainless steel powders embedded in electroplated copper.

Development of Red CaAlSiN3:Eu2+ Phosphor in Glass Ceramic Composite for Automobile LED with High Temperature Stability (고온 안정성이 우수한 자동차 LED용 Red CaAlSiN3:Eu2+ 형광체/Glass 세라믹 복합체 개발)

  • Yoon, Chang-Bun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.5
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    • pp.324-329
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    • 2018
  • Red phosphor in glasses (PiGs) for automotive light-emitting diode (LED) applications were fabricated with 620-nm $CaAlSiN_3:Eu^{2+}$ phosphor and Pb-free silicate glass. PiGs were synthesized and mounted on high-power blue LED to make a monochromatic red LED. PiGs were simple mixtures of red phosphor and transparent glass powder. After being fabricated with uniaxial press and CIP at 300 MPa for 20 min, the green bodies were thermally treated at $550^{\circ}C$ for 30 min to produce high dense PiGs. As the phosphor content increased, the density of the sintered body decreased and PiGs containing 30% phosphor had a full sintered density. Changes in photoluminescence spectra and color coordination were studied by varying the thickness of plates that were mounted after optical polishing. As a result of the optical spectrum and color coordinates, PiG plate with $210{\mu}m$ thickness showed a color purity of 99.7%. In order to evaluate the thermal stability, the thermal quenching characteristics were measured at temperatures of $30{\sim}150^{\circ}C$. The results showed that the red PIG plates were 30% more thermally stable compared to the AlGaInP red chip.

Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging (전력반도체 접합용 천이액상확산접합 기술)

  • Lee, Jeong-Hyun;Jung, Do-hyun;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.9-15
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    • 2018
  • This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.