• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• Journal of the Korean Geotechnical Society
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• v.21 no.2
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• pp.37-46
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• 2005

In the field of earthquake engineering, recent improvements in many areas, such as seismological source modeling, analysis of travel path effects, and characterization of local site effects on strong shaking, have led to significant advances in both code-based and more advanced procedures for evaluating earthquake ground motions. A missing link, however, is empirically verified design procedures fur assessing the effects of soil-structure interaction (SSI). Available Soil-Structure Interaction (SSI) analysis techniques range from simple substructure-type procedures to relatively sophisticated finite element procedures. The most common substructure approach for foundation-soil interaction is to use a frequency-dependent and complex-valued impedance function. This study uniquely evaluates impedance functions for two well-instrumented sites w significant inertial SSI effects using a system Identification technique. The system identification analysis results are then compared to predictions from a simple theoretical model to gain insight into the inertial interaction effect in the subject sites.