• KSII Transactions on Internet and Information Systems (TIIS)
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• 제15권11호
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• pp.3950-3969
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• 2021

Radio Frequency (RF)-based indoor localization technologies play significant roles in various Internet of Things (IoT) services (e.g., location-based service). Most such technologies require that all the devices comply with a specified technology (e.g., WiFi, ZigBee, and Bluetooth). However, this requirement limits its application scenarios in today's IoT context where multiple devices complied with different standards coexist in a shared environment. To bridge the gap, in this paper, we propose a cross-technology localization approach, which is able to localize target nodes using a different type of devices. Specifically, the proposed framework reuses the existing WiFi infrastructure without introducing additional cost to localize Non-WiFi device (i.e., ZigBee). The key idea is to leverage the interference between devices that share the same operating frequency (e.g., 2.4GHz). Such interference exhibits unique patterns that depend on the target device's location, thus it can be leveraged for cross-technology localization. The proposed framework uses Principal Components Analysis (PCA) to extract salient features of the received WiFi signals, and leverages Dynamic Time Warping (DTW), Gradient Boosting Regression Tree (GBRT) to improve the robustness of our system. We conduct experiments in real scenario and investigate the impact of different factors. Experimental results show that the average localization accuracy of our prototype can reach 1.54m, which demonstrates a promising direction of building cross-technology technologies to fulfill the needs of modern IoT context.

• 한국멀티미디어학회논문지
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• 제17권2호
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• pp.124-131
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• 2014

본 논문에서는 4-채널 전위계 센서의 배열을 이용한 비접촉 제스처 인식 알고리즘을 제안한다. 주변의 전기장 변화에 민감한 전위계 센서를 스마트기기의 제스처인식에 활용하기 위해서 실내 환경에서 극저주파 대역 EMI(Electro Magnetic Interference) 및 PLN(Power Line Noise) 영향을 최소화하였다. AC 형태의 입력 데이터 값에 10Hz LPF(Low Pass Filter) 및 H/W 샘플링 속도를 고려한 최대 버퍼 값 추출 알고리즘을 적용하여 선형적인 DC 형태의 데이터로 변형한다. 추가적으로 칼만 필터를 적용함으로써 노이즈를 최소화하며, 센서간의 배열을 고려한 데이터 차분 과정을 통해 목표물의 2차원적 움직임 정보를 추출한다. 추출된 데이터 값과 peak 값의 시차정보를 이용하여 DTW(Dynamic Time Warping) 제스처 인식 및 보정 알고리즘을 구현하였으며, 다섯가지 동작 시나리오 테스트 결과 95% 이상의 높은 인식률을 보였다.

• ETRI Journal
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• 제37권6호
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• pp.1143-1153
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• 2015

In this paper, we propose an efficient architecture for a real-time image stitching engine for vision SoCs found in motor vehicles. To enlarge the obstacle-detection distance and area for safety, we adopt panoramic images from multiple telegraphic cameras. We propose a stitching method based on a fixed homography that is educed from the initial frame of a video sequence and is used to warp all input images without regeneration. Because the fixed homography is generated only once at the initial state, we can calculate it using SW to reduce HW costs. The proposed warping HW engine is based on a linear transform of the pixel positions of warped images and can reduce the computational complexity by 90% or more as compared to a conventional method. A dual-core SW/HW image stitching engine is applied to stitching input frames in parallel to improve the performance by 70% or more as compared to a single-core engine operation. In addition, a dual-core structure is used to detect a failure in state machines using rock-step logic to satisfy the ISO26262 standard. The dual-core SW/HW image stitching engine is fabricated in SoC with 254,968 gate counts using Global Foundry's 65 nm CMOS process. The single-core engine can make panoramic images from three YCbCr 4:2:0 formatted VGA images at 44 frames per second and frequency of 200 MHz without an LCD display.

• 한국지능시스템학회논문지
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• 제20권4호
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• pp.528-533
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• 2010

본 논문에서는 인간의 감정 변화의 영향을 적게 받는 음성 인식 시스템의 학습 방법에 관한 연구를 수행하였다. 이를 위하여 우선 다양한 감정이 포함된 음성 데이터베이스를 사용하여 감정 변화가 음성 신호와 음성 인식 시스템의 성능에 미치는 영향에 관한 연구를 수행하였다. 감정이 포함되지 않은 평상의 음성으로 학습된 음성 인식 시스템에 감정이 포함된 인식 데이터가 입력되는 경우 감정에 따른 음성의 차이가 인식 시스템의 성능을 저하시킨다. 본 연구에서는 감정의 변화에 따라 화자의 성도 길이가 변화한다는 것과 이러한 변화는 음성 인식 시스템의 성능을 저하시키는 원인 중의 하나임을 관찰하였다. 본 연구에서는 이러한 음성의 변화를 포함하는 학습 방법을 제안하여 감정 변화에 강인한 음성 인식 시스템을 개발하였다. HMM을 사용한 단독음 인식 실험에서 제안된 학습 방법을 사용하면 감정 데이터의 오차가 기존 방법보다 28.4% 감소되었다.

• 반도체디스플레이기술학회지
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• 제20권1호
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• pp.32-36
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• 2021

The number of processes in the manufacture of semiconductors, displays and solar cells is increasing. And as the processes is performed, multiple layers of films and various patterns are formed on the wafer. At this time, substrate warpage occurs due to the difference in stress between each film and pattern formed on the wafer. the substrate warping phenomenon occurs due to the difference in stress between each film and pattern formed on the wafer. We developed a new warpage measurement method to measure wafer warpage during real-time processing. We performed an experiment to measure the presence and degree of warpage of the substrate in real time during the process by adding only measurement equipment for applying additional electrical signals to the existing ESC and detecting the change of the additional electric signal. The additional electrical measurement signal applied at this time is very small compared to the direct current (DC) power applied to the electrostatic chuck whit a frequency that is not generally used in the process can be selectively used. It was confirmed that the measurement of substrate warpage can be easily separated from other power sources without affecting.