• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.15 no.11
• /
• pp.3950-3969
• /
• 2021

Radio Frequency (RF)-based indoor localization technologies play significant roles in various Internet of Things (IoT) services (e.g., location-based service). Most such technologies require that all the devices comply with a specified technology (e.g., WiFi, ZigBee, and Bluetooth). However, this requirement limits its application scenarios in today's IoT context where multiple devices complied with different standards coexist in a shared environment. To bridge the gap, in this paper, we propose a cross-technology localization approach, which is able to localize target nodes using a different type of devices. Specifically, the proposed framework reuses the existing WiFi infrastructure without introducing additional cost to localize Non-WiFi device (i.e., ZigBee). The key idea is to leverage the interference between devices that share the same operating frequency (e.g., 2.4GHz). Such interference exhibits unique patterns that depend on the target device's location, thus it can be leveraged for cross-technology localization. The proposed framework uses Principal Components Analysis (PCA) to extract salient features of the received WiFi signals, and leverages Dynamic Time Warping (DTW), Gradient Boosting Regression Tree (GBRT) to improve the robustness of our system. We conduct experiments in real scenario and investigate the impact of different factors. Experimental results show that the average localization accuracy of our prototype can reach 1.54m, which demonstrates a promising direction of building cross-technology technologies to fulfill the needs of modern IoT context.

• Journal of Korea Multimedia Society
• /
• v.17 no.2
• /
• pp.124-131
• /
• 2014

In this paper, we propose the non-contact gesture recognition algorithm using 4- channel electrometer sensor array. ELF(Extremely Low Frequency) EMI and PLN are minimized because ambient electromagnetic noise around sensors has a significant impact on entire data in indoor environments. In this study, we transform AC-type data into DC-type data by applying a 10Hz LPF as well as a maximum buffer value extracting algorithm considering H/W sampling rate. In addition, we minimize the noise with the Kalman filter and extract 2-dimensional movement information by taking difference value between two cross-diagonal deployed sensors. We implemented the DTW gesture recognition algorithm using extracted data and the time delayed information of peak values. Our experiment results show that average correct classification rate is over 95% on five-gesture scenario.

• ETRI Journal
• /
• v.37 no.6
• /
• pp.1143-1153
• /
• 2015

In this paper, we propose an efficient architecture for a real-time image stitching engine for vision SoCs found in motor vehicles. To enlarge the obstacle-detection distance and area for safety, we adopt panoramic images from multiple telegraphic cameras. We propose a stitching method based on a fixed homography that is educed from the initial frame of a video sequence and is used to warp all input images without regeneration. Because the fixed homography is generated only once at the initial state, we can calculate it using SW to reduce HW costs. The proposed warping HW engine is based on a linear transform of the pixel positions of warped images and can reduce the computational complexity by 90% or more as compared to a conventional method. A dual-core SW/HW image stitching engine is applied to stitching input frames in parallel to improve the performance by 70% or more as compared to a single-core engine operation. In addition, a dual-core structure is used to detect a failure in state machines using rock-step logic to satisfy the ISO26262 standard. The dual-core SW/HW image stitching engine is fabricated in SoC with 254,968 gate counts using Global Foundry's 65 nm CMOS process. The single-core engine can make panoramic images from three YCbCr 4:2:0 formatted VGA images at 44 frames per second and frequency of 200 MHz without an LCD display.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.20 no.4
• /
• pp.528-533
• /
• 2010

This paper studied the training methods less affected by the emotional variation for the development of the robust speech recognition system. For this purpose, the effect of emotional variation on the speech signal and the speech recognition system were studied using speech database containing various emotions. The performance of the speech recognition system trained by using the speech signal containing no emotion is deteriorated if the test speech signal contains the emotions because of the emotional difference between the test and training data. In this study, it is observed that vocal tract length of the speaker is affected by the emotional variation and this effect is one of the reasons that makes the performance of the speech recognition system worse. In this paper, a training method that cover the speech variations is proposed to develop the emotionally robust speech recognition system. Experimental results from the isolated word recognition using HMM showed that propose method reduced the error rate of the conventional recognition system by 28.4% when emotional test data was used.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.1
• /
• pp.32-36
• /
• 2021

The number of processes in the manufacture of semiconductors, displays and solar cells is increasing. And as the processes is performed, multiple layers of films and various patterns are formed on the wafer. At this time, substrate warpage occurs due to the difference in stress between each film and pattern formed on the wafer. the substrate warping phenomenon occurs due to the difference in stress between each film and pattern formed on the wafer. We developed a new warpage measurement method to measure wafer warpage during real-time processing. We performed an experiment to measure the presence and degree of warpage of the substrate in real time during the process by adding only measurement equipment for applying additional electrical signals to the existing ESC and detecting the change of the additional electric signal. The additional electrical measurement signal applied at this time is very small compared to the direct current (DC) power applied to the electrostatic chuck whit a frequency that is not generally used in the process can be selectively used. It was confirmed that the measurement of substrate warpage can be easily separated from other power sources without affecting.