• 제어로봇시스템학회:학술대회논문집
• /
• 1993.10a
• /
• pp.1024-1030
• /
• 1993

In manufacturing press die with free surface, grinding operation is an important post process for surface finish and dimensional accuracy. With the advancement of NC technology. surface grinding operation is increasingly replaced by the gantry type manipulator. As the mechanics for grinding operation is different from machining operation, conventional CAM system for machining operation is hard to apply. In this. paper, we develop a five-axis CAM system by which an efficient gantry trajectory can be planned and verified. The developed system consists of four conceptual modules; namely CAD, PROCESS. CAM, and ANALYSIS. In the CAD module, the machined surface is represented by CL-data or surface modeler, and process parameters are specified by the PROCESS module. Then, the CAM module generates a series of grinding paths based on the grinding mechanics together with process databases for tool spaces and grinding conditions. The generated paths are verified via ANALYSIS module. Validation via real experiments is left for further study.

• IEMEK Journal of Embedded Systems and Applications
• /
• v.5 no.4
• /
• pp.175-184
• /
• 2010

This paper designs a virtual USB drive for mobile devices which gives an illusion of a traditional USB flash memory drive and provides capacity-free storage space over IP network. The virtual USB drive operating with a S3C2410 hardware platform and embedded linux consists of USB device driver, an iSCSI-enabled network stack, and a seamless USB/iSCSI tunneling module. For performance enhancement, it additionally provides a kernel-level seamless USB/iSCSI tunneling module and data sharing with symbol references among kernel modules. Experiments reveal that the kernel-level implementation can improve the I/O performance up to 8 percentage, as compared with the user-level implementation.

• Journal of Integrative Natural Science
• /
• v.4 no.4
• /
• pp.278-281
• /
• 2011

We discuss an application of 'restrictions on the entries of the maps in the minimal free resolution' and '$SC_r$-condition of modules', and give an alternative proof of the following result of Foxby: Let M be a finitely generated module of dimension over a Noetherian local ring (A,m). Suppose that $\hat{A}$ has no embedded primes. If A is not Gorenstein, then ${\mu}_i(m,A){\geq}2$ for all i ${\geq}$ dimA.

• Journal of Welding and Joining
• /
• v.32 no.6
• /
• pp.75-81
• /
• 2014

Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

• Journal of the Korean Mathematical Society
• /
• v.47 no.6
• /
• pp.1147-1165
• /
• 2010

In this paper we compare a torsion free sheaf F on $P^N$ and the free vector bundle $\oplus^n_{i=1}O_{P^N}(b_i)$ having same rank and splitting type. We show that the first one has always "less" global sections, while it has a higher second Chern class. In both cases bounds for the difference are found in terms of the maximal free subsheaves of F. As a consequence we obtain a direct, easy and more general proof of the "Horrocks' splitting criterion", also holding for torsion free sheaves, and lower bounds for the Chern classes $c_i$(F(t)) of twists of F, only depending on some numerical invariants of F. Especially, we prove for rank n torsion free sheaves on $P^N$, whose splitting type has no gap (i.e., $b_i{\geq}b_{i+1}{\geq}b_i-1$ 1 for every i = 1,$\ldots$,n-1), the following formula for the discriminant: $$\Delta(F):=2_{nc_2}-(n-1)c^2_1\geq-\frac{1}{12}n^2(n^2-1)$$. Finally in the case of rank n reflexive sheaves we obtain polynomial upper bounds for the absolute value of the higher Chern classes $c_3$(F(t)),$\ldots$,$c_n$(F(t)) for the dimension of the cohomology modules $H^iF(t)$ and for the Castelnuovo-Mumford regularity of F; these polynomial bounds only depend only on $c_1(F)$, $c_2(F)$, the splitting type of F and t.

• Journal of KIBIM
• /
• v.5 no.4
• /
• pp.53-62
• /
• 2015

Korea has been at the forefront of green growth initiatives. In 2008, the government declared the new vision toward 'low-carbon society and green growth'. The government subsidies and Feed-in Tariff (FIT) increased domestic usage of solar power by supplying photovoltaic housing and photovoltaic generation systems. Since 2000, solar power industry has been the world's fastest growing source with the annual growth rate of 52.5%. Especially, BIPV(Building Integrated Photovoltaic) systems are capturing a growing portion of the renewable energy market due to several reasons. BIPV consists of photovoltaic cells and modules integrated into the building envelope such as a roof or facades. By avoiding the cost of conventional materials, the incremental cost of photovoltaics is reduced and its life-cycle cost is improved. When it comes to atypical building, numerous problems occur because PV modules are flat, stationary, and have its orientation determined by building surface. However, previous studies mainly focused on improving installations of solar PV technologies on ground and rooftop photovoltaic array and developing prediction model to estimate the amount of produced electricity. Consequently, this paper discusses the problem during a planning and design stage of BIPV systems and suggests the method to select optimal design of the systems by applying the national strategy and economic policies. Furthermore, the paper aims to develop BIM tool based on the engineering knowledge from experts in order for non-specialists to design photovoltaic generation systems easily.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.21 no.8
• /
• pp.761-767
• /
• 2011

Free and forced vibration analysis of the global ship structure using the 3-dimensional finite element(FE) method requires not only the specialized knowledge such as ship structure interacted with fluid, damping and various excitations due to propulsion system but also time-consuming manual tasks in FE modeling, analysis and response evaluation. As a result, the quality of the vibration analysis highly depends on engineer's expertise and experience. In this study, a framework system to improve the efficiency of global ship vibration analysis is introduced. The system promising the utilization of MSC/Patran and MSC/Nastran consists of various modules to support data management, FE modeling of ship structure and loading, input deck generation for free and forced vibration analysis, data extraction and evaluation of analysis results, and databases for FE models of marine diesel engines and vibration criteria. The system may be useful for pursuing standardization of uncertain analysis factors as well as reducing time, cost and human dependency in ship vibration analysis.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2011.04a
• /
• pp.779-784
• /
• 2011

Free and forced vibration analysis of the global ship structure using the 3-dimensional finite element(FE) method requires not only the specialized knowledge such as ship structure interacted with fluid, damping and various excitations due to propulsion system but also time-consuming manual tasks in FE modeling, analysis and response evaluation. As a result, the quality of the vibration analysis highly depends on engineer's expertise and experience. In this study, a framework system to improve the efficiency of global ship vibration analysis is introduced. The system promising the utilization of MSC/Patran and MSC/Nastran consists of various modules to support data management, FE modeling of ship structure and loading, input deck generation for free and forced vibration analysis, data extraction and evaluation of analysis results, and databases for FE models of marine diesel engines and vibration criteria. The system may be useful for pursuing standardization of uncertain analysis factors as well as reducing time, cost and human dependency in ship vibration analysis.

• Journal of Sensor Science and Technology
• /
• v.24 no.4
• /
• pp.228-231
• /
• 2015

Ultrasonic motors provide high torques and quick responses compared to their magnetic counterparts; therefore, they are widely used in small-scale applications such as mobile phones, microrobots, and auto-focusing modules in digital cameras. To determine the feasibility of lead-free piezoceramics for ultrasonic motor applications, we fabricated a ring-type piezoceramic with a KNN-based lead-free piezoceramic (referred to as CZ5), intended for use in an auto-focusing module of a digital camera. The vibration of the lead-free stator was observed at 45.1 kHz. It is noteworthy that the fully assembled lead-free ultrasonic motor exhibited a revolution speed of 5-7 rpm, even though impedance matching with neighboring components was not considered. This result suggests that the tested KNN-based piezoceramic has great potential for use in ultrasonic motor applications, requiring minimal modifications to existing lead-based systems.

• Journal of Welding and Joining
• /
• v.30 no.6
• /
• pp.113-119
• /
• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.