• Title/Summary/Keyword: Free joint

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Manufacturing 2DOF Inflatable Joint Actuator by Pneumatic Control (공압제어를 통한 2DOF 팽창식 관절 액추에이터 제작)

  • Oh, Namsoo;Lee, Haneol;Rodrigue, Hugo
    • The Journal of Korea Robotics Society
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    • v.13 no.2
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    • pp.92-96
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    • 2018
  • In this paper, a soft robotic arm which can prevent impact injury during human-robot interaction is introduced. Two degrees of freedom joint are required to realize free movement of the robotic arm. A robotic joint concept with a single degree of freedom is presented using simple inflatable elements, and then extended to form a robotic joint with two degrees of freedom joint using similar manufacturing methods. The robotic joint with a single degree of freedom has a joint angle of $0^{\circ}$ bending angle when both chamber are inflated at equal pressures and maximum bending angles of $28.4^{\circ}$ and $27.1^{\circ}$ when a single chamber if inflated. The robotic joint with two degrees of freedom also has a bending angle of $0^{\circ}$ in both direction when all three chambers are inflated at equal pressures. When either one or two chambers were pressurized, the robotic joint performed bending towards the uninflated chambers.

Perceived Discomfort of Females for Static Joint Motions (정적 인체 관절 동작에 대한 여성의 지각 불편도)

  • 기도형
    • Journal of the Korean Society of Safety
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    • v.16 no.1
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    • pp.73-78
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    • 2001
  • It has been proposed that the acceptable level of discomfort was a valid measure of postural loading. Although the number of women employees has increased at a much faster rate than men workers did and female workers are thought to be more vulnerable to musculoskeletal disorders, most previous studies dealt with perceived discomforts for joint motions focused on male subjects. This study aims to measure perceived discomfort ratings of females for static joint motions. Ten female subjects participated in the experiment measuring perceived discomforts, in which almost every possible joint motion was included and the free modulus method of the magnitude estimation was employed. The results showed that discomfort levels were dependent on the joint motions and joints, and subjective discomfort ratings of women were significantly larger than those of men.

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Joint mobilization techniques of the shoulder joint dysfunction (견관절 장애와 관절 가동운동)

  • Kim, Suhn-Yeop;Doo, Jung-Hee
    • Physical Therapy Korea
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    • v.2 no.2
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    • pp.108-118
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    • 1995
  • The techniques of joint mobilization and traction are used to improve joint mobility or to decrease pain by restoring accessory movements to the shoulder joints and thus allowing full, nonrestriced, pain-free range of motion. In the glenohumeral joint, the humeral head would be the convex surface, while the glenoid fossa would be the concave surface. The medial end of the clavicle is concave anterioposteriorly and convex superioinferiorly, the articular surface of the sternum is reciprocally curved. The acromioclavicular joint is a plane synovial joint between a small convex facet on lateral end of the clavicle and a small concave facet on the acromion of the scapula. The relationship between the shape of articulating joint surface and the direction of gliding is defined by the Convex-Concave Rule. If the concave joint surface is moving on a stationary convex surface, gliding occur in the same direction as the rolling motion. If the convex surface is moving on a stationary concave surface, gliding will occur in an opposite direction to rolling. Hypomobile shoulder joints are treated be using a gliding technique.

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Reliability evaluation of Pb-free solder joint with immersion Ag-plated Cu substrate (Immersion Ag가 도금된 Cu기판을 가진 Pb-free solder 접합부의 신뢰성 평가)

  • Yun Jeong-Won;Jeong Seung-Bu
    • Proceedings of the KWS Conference
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    • 2006.05a
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    • pp.30-32
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    • 2006
  • The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

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Shear Strength Comparison of Passive Component Using the Environmental-Friendly Lead-Free Solder (친환경 무연솔더를 적용한 수동부품의 솔더 접합부 전단강도 비교)

  • Song, Byeong-Suk;Cho, Jai-Rip
    • Proceedings of the Korean Society for Quality Management Conference
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    • 2006.04a
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    • pp.375-380
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    • 2006
  • Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. So many kinds of projects is proceeding to ensure the reliability of Pb-free electronics in the worlds. Especially it is necessary to evaluate of Pb-free solder joints in electronics. Therefore, on this paper, we compared with solder joint strength of chip components, respectively SnPb, Pb-free solder as follows reliability test methods. We also measured the shear strength of solder joint and also compared the effects of environmental test methods. In this results, we analyzed and compared the shear strength variation as follows solder materials and reliability test conditions.

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Effect of an 8-week Closed Kinetic Chain Styled Pilates Exercise on Lower Limb Alignment (8주간 닫힌 사슬형 필라테스 운동이 하지 정렬에 미치는 영향)

  • Ga Ram Jeon;Sukhoon Yoon
    • Korean Journal of Applied Biomechanics
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    • v.33 no.4
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    • pp.128-136
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    • 2023
  • Objective: The aim of this study was to investigate the effect of an 8-week closed kinetic chain typed Reformer and Chair Pilates exercise on static and dynamic lower limb alignment for healthy female adults. Method: Ten healthy young female adults without musculoskeletal injury history in last 6 months (Age: 29.3 ± 3.5 yrs., Height: 165 ± 3.4 cm, Body mass: 58.2 ± 5.4 kg) participated in this study. All participants asked to join the 8-week closed kinetic chain typed Reformer and Chair Pilates exercise, and the program was conducted for 60 minutes twice a week. Participants were asked to be measure a static Q-angle and performed free squat one week before and after the program. A 3-D motion analysis with 8 infrared cameras and 5 channels of EMG was executed in this study. The effectiveness of the training was evaluated by paired t-test, and the significance level was set at .05. Results: A significantly decreased in internal rotation angles was found at hip joint during free squat after the training. Also, significantly decreased in lateral rotation angles were found at knee and ankle joint during free squat after training. Finally, significantly decreased in muscle activations were found at adductor longus and peroneus longus during free squat after training. Conclusion: From results of our study, it is concluded that an 8-week closed kinetic chain typed Pilates exercise positively effect on lower limb alignment during dynamic movement.

Use of the Fix and Flap Approach to Complex Open Elbow Injury: The Role of the Free Anterolateral Thigh Flap

  • Chui, Christopher Hoe-Kong;Wong, Chin-Ho;Chew, Winston Y.;Low, Mun-Hon;Tan, Bien-Keem
    • Archives of Plastic Surgery
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    • v.39 no.2
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    • pp.130-136
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    • 2012
  • Background : Complex elbow injuries with associated nerve, muscle, or joint injury commonly develop post-inury stiffness. In order to preserve function, joint congruency, elbow stability and durable wound coverage must be achieved in a timely manner. Methods : A retrospective review of patients who underwent orthopaedic fixation followed by free anterolateral thigh (ALT) flap soft tissue coverage was performed. Five patients were identified and included in this study. Results : We present a series of 5 cases managed with this principle. Soft tissue defects ranged in size from $4{\times}9cm$ ($36cm^2$) to $15{\times}30cm$ ($450cm^2$) and were located either posteriorly (n=4) or anteriorly (n=1). Associated injuries included open fractures (n=3) and motor nerve transection (n=2). Wound coverage was achieved in a mean duration of 18.8 days (range, 11 to 42 day). There were no flap failures and no major complications. The mean postoperative active elbow motion was $102^{\circ}$ (range, $45^{\circ}$ to $140^{\circ}$). Conclusions : In our small series we have highlighted the safety and utility of using the free ALT flap in complex elbow injuries. The ALT flap has many advantages which include abundant skin and subcutaneous tissue; vascularised vastus lateralis muscle that was used in our series to obliterate dead space, provide a vascular bed for nerve grafts and combat infection; and, access to fascia lata grafts for reconstruction of the triceps tendon.

Study on Thermal Stability of the Interface between Electroless Ni-W-P Deposits and BGA Lead-Free Solder (Sn-3.0Ag-0.5Cu) (BGA 무연솔더(Sn-3.0Ag-0.5Cu)와 무전해 Ni-W-P 도금층 계면의 열 안정성에 대한 연구)

  • Shin, Dong-Hee;Cho, Jin-Ki;Kang, Seung-Goon
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.25-31
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    • 2010
  • In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.