• Journal of the Korea Organic Resources Recycling Association
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• v.17 no.4
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• pp.103-111
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• 2009

Moisture is one of the important design factors that affects to the changes of physical properties and air permeability in the composting matrix. This study examines the effects of moisture during the wetting and drying procedure on physical properties like bulk density, particle size, free air space and air permeability in the sawdust used as the bulking agent in composting process. During both procedures of wetting and drying of the water, with increasing moisture content, bulk density and particle size increased, but FAS decreased. In the range of near 40 to 60% moisture content on a wet basis, particle size and FAS in wetting procedure were larger and higher than those in drying procedure. During wetting procedure, pressure drop continuously decreased ranging from near 20 to 60% moisture content, despite of decreasing FAS as a consequence of increasing moisture, and then over the range of 60% moisture content, pressure drop rapidly increased to the saturated moisture condition while the pore space was filled with the water. On the other hand, during drying procedure, pressure drop decreased from the saturated condition to 40% moisture content. In the recommended range of 50 to 60% moisture content for composting operation, pressure drop in wetting procedure were lower than in drying procedure. For the enhancement of the air permeability in the composting matrix, the wetting procedure was proper than the drying procedure, and the optimum moisture content for the efficient composting operation was appeared to be near 60%.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.5
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• pp.54-61
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• 2001

It is reported that during the cold starting, especially in gasoline engine, the engine response and the effect of HC emission can be improved by prompting atomization and reducing the quantity of fuel adhered to the range of injector tip, inlet port, and inlet valve. The purposes of this study are to promote atomization of fuel before air-fuel mixture in the inlet port. In order to achieve its goal, the glow plug is to evaluate the feasibility of for the early fuel evaporator and the spray behavior characteristics of gasoline, injected on the surface of glow plug with room temperature(2$0^{\circ}C$) and high temperature(25$0^{\circ}C$) is to examine. Particle motion analysis system(PMAS) was used to measure the SMD and the dropsize distribution of impinging spray and free spray. The results of this experiment, evaporation rate of impinging spray was higher than that of free spray, and the higher evaporation rate win, the smaller peak dropsize was. Especially, during early spray SMD of impinging spray was still smaller than that of fee spray.

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Journal of the Korean Society of Visualization
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• v.10 no.3
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• pp.21-24
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• 2012

Although the motion of the three-phase contact line on a solid substrate has been extensively studied thus far, the understanding of the dynamics of the contact line of liquid/liquid/gas phases is far from complete. Here we deposit a drop of isopropyl alcohol (IPA) on water and HFE-7100 whose free surfaces are exposed to air to observe the flow field around the contact line. By combining the shadowgraph and high-speed imaging techniques, we find that vortices are spontaneously generated at the contact line, which grow in size with time. The flow is attributed to the Marangoni stress that pulls a liquid of lower-surface tension toward a liquid surface having a higher surface tension. However, it is not still clear why the entrained lower-surface-tension liquid should whirl rapidly beneath the contact line. We also visualize the flow by the particle image velocimetry (PIV) to find out that the rotational velocity reaches the order of 1 mm/s near the free surface.

• Journal of Microbiology and Biotechnology
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• v.14 no.4
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• pp.673-679
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• 2004

A microbial cryoprotectant formulation using a W/O/W multiple emulsion system was developed. The psychrotolerant microorganism, B4, isolated from soil in South Korea, was observed by the drop freezing method, in which the microorganism sample inhibited ice nucleation activity. The antifreeze activity was eliminated when the microorganism sample was treated with protease, indicating that the antifreeze activity was due to the presence of antifreeze protein. The result of the l6S rDNA sequencing indicated the B4 strain was most closely related to a species of the genus Bacillus. Culture broth of B4 strain (Bacillus sp.) and rapeseed oil containing 1 % polyglycerine polyricinolate (PGPR) were used as core and wall material, respectively. The most stable W/O emulsion was prepared at a core/oil ratio of 1:2. The highest W/O/W emulsion stability was achieved when the primary emulsion to external aqueous phase containing 0.5% caster oil polyoxyethylene ether $(COG25^{TM})$ ratio was 1:1. Microcrystalline cellulose showed better W/O/W emulsion stability than other polymer types. The viability of cells in a W/O/W emulsion was higher than free cells during storage at $37^\circ{C}$. An acidic pH and UV exposure decreased the viability of free cells, but cells in W/O/W emulsion were more stable under these conditions.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.1003-1011
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• 2006

Droplets are ejected onto a substrate through a nozzle by pushing liquids in flow channels of drop-on-demand devices. The behavior of ejection and formation of droplets is investigated to enhance the physical understanding of the hydrodynamics involved in inkjet printing. The free surface phenomenon of a droplet is described using $CFD-ACE^{TM}$ which employs the volume-of-fluid (VOF) method with the piecewise linear interface construction (PLIC). Droplet formation characteristics are analyzed in various flow regimes with different Ohnesorge numbers. The computational results show that the droplet formations are strongly dependent on the physical properties of working fluids and the inlet flow conditions. In addition, the wetting characteristics of working fluids on a nozzle influence the volume and velocity of a droplet produced in the device. This study may provide an insight into how a liquid droplet is formed and ejected in a piezoelectric inkjet printing device.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.697-702
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• 2004

LG Electronics developed linear compressors for a household refrigerator which can reduce energy consumption up to $24\%$ by only Drop-ln instead of a conventional reciprocating compressor. The linear compressor is composed of a linear oscillating motor, a piston directly coupled with the linear motor, a cylinder and the specific discharge system of LG. Because of this free-piston structure, the position of the piston can be changeable according to the voltage variation, load variation and so on. By this reason, LG linear compressor has been in need of an additional unit to control the position of the free-piston stably. In this paper we will introduce the innovative technology which is able to operate the linear compressor without controlling the piston position like a conventional reciprocating compressor.

• Journal of the Korean GEO-environmental Society
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• v.20 no.2
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• pp.41-48
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• 2019

Soil compaction is one of the most important activities in the area of civil works, including road construction, airport construction, port construction and backfilling construction of structures. Soil compaction, particularly in road construction, can be categorized into subgrade compaction and roadbed compaction, and is significant work that when done poorly can serve as a factor causing poor construction due to a lack of compaction. Currently, there are many different types of compaction tests, and the plate bearing test and the unit weight of soil test based on the sand cone method are commonly used to measure the degree of compaction, but many other methods are under development as it is difficult to secure economic efficiency. For the purpose of this research, a portable penetration meter called the Free-Fall Penetration Test (FFPT) was developed and manufactured. In this study, a homogeneous sample was obtained from the construction site and soil was classified through a sieve analysis test in order to perform grain size analysis and a specific gravity test for an indoor test. The principle of FFPT is that the penetration needle installed at the tip of an object put into free fall using gravity is used to measure the depth of penetration into the road surface after subgrade or roadbed compaction has been completed; the degree of compaction is obtained through the unit weight of soil test according to the sand cone method and the relationship between the degree of compaction and the depth of the penetration needle is verified. The maximum allowable grain size of soil is 2.36 mm. For $A_1$ compaction, a trend line was developed using the result of the test performed from a drop height of 10 cm, and coefficient of determination of the trend line was $R^2=0.8677$, while for $D_2$ compaction, coefficient of determination of the trend line was $R^2=0.9815$ when testing at a drop height of 20 cm. Free fall test was carried out with the drop height adjusted from 10 cm to 50 cm at increments of 10 cm. This study intends to compare and analyze the correlation between the degree of compaction obtained from the unit weight of soil test based on the sand cone method and the depth of penetration of the penetration needle obtained from the FFPT meter. As such, it is expected that a portable penetration tester will make it easy to test the degree of compaction at many construction sites, and will lead to a reduction in time, equipment, and manpower which are the disadvantages of the current degree of compaction test, ultimately contributing to accurate and simple measurements of the degree of compaction as well as greater economic feasibility.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.