• Title/Summary/Keyword: Free agent

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Secure Execution Assurance Mechanism of Mobile Agent from Truncation Attack in Free-Roaming Environments (Free-Roaming 실행 환경에서 절단공격으로부터 이동에이전트의 안전한 실행 보장 기법)

  • Jung, Chang-Ryul;Lee, Sung-Keun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.1
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    • pp.97-108
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    • 2010
  • The data security of free-roaming mobile agent is a problem which hasn't been resolved to the mobility and inter-host mapping. totally, especially in theaspect of keeping away truncation attacks. Therefore, when the agent is utilized for user oriented applied technique, the secure execution guarantee of agent is essential. In this paper, it guarantees safe execution from security threats generated by malicious host during the agent's execution. And the secure execution guarantee mechanism of agent is proposed from favorable host is maliciously abused by attacker. Thus, the execution trace protocol mechanism proposed as secure mobile agents execution guarantee. As security analysis of the safety analysis.

A Study on Semi Abrasive Free Slurry including Acid Colloidal Silica for Copper Chemical Mechanical Planarization (구리 CMP 적용을 위한 산성 콜로이드 실리카를 포함한 준무연마제 슬러리 연구)

  • 김남훈;김상용;서용진;김태형;장의구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.3
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    • pp.272-277
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    • 2004
  • The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

Study on Iodine Labelling (I) Influence of Reducing Agent and Iodate-$^{131}I$ in Sodium iodide-$^{131}I$ solution on Labelling

  • Kim, Jaerok
    • Nuclear Engineering and Technology
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    • v.3 no.3
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    • pp.141-147
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    • 1971
  • In iodine-131 labelling of iodocompounds such as tetrachloro-P-tetraiodo R-fluorescein, sodium orthoiodohippurate and a non-iodocompound, human serum albumin (HSA), the labelling rates and yields are accurately compared with each other. The reaction systems conducted for each compounds were different conditions: sodium iodide-$^{131}$ I containing reducing agent, sodium iodide-$^{131}$ I free from reducing agent, and sodium iodide-$^{131}$ I free from reducing agent but containing considerable amount of iodide-$^{131}$ I etc. The labelling yields were generally poor; 10% in the case of using sodium iodide-$^{131}$ I containing redoing agent, and 50~60% in the case of using sodium iodide-$^{131}$ I free from reducing agent but containing considerable amount of iodide-$^{131}$ I. However, fair yields were obtained in the case of using sodium iodide-$^{131}$ I free from reducing agent and mostly in the form of iodide-$^{131}$ I. The reaction entities involved in these reactions are also briefly discussed.

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Study on the characteristic of liner and cover material by accelerating agent type (급결제 종류에 따른 광산 차수재의 특성 연구)

  • Cho, Yong-Kwang;Nam, Seong-Young;Lee, Yong-Mu;Kim, Chun-Sik;Seo, Shin-Seok;Jo, Sung-Hyun;Lee, Hyoung-Woo;Ahn, Ji-Whan
    • Journal of Environmental Science International
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    • v.27 no.2
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    • pp.75-81
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    • 2018
  • At present research on mining backfill materials is being carried out to prevent ground subsidence and breaking by underground cavern of exhausted mines. However, backfill materials can cause secondary environmental issues such as ground pollution. To solve these issues, liner and cover materials are constructed before backfill materials constructed, to inhibit toxic substances form moving to the surroundings. Liner and cover materials, however, should have an accelerating performance after construction and when the accelerating performance is degraded, the work efficiency can be lowered, and the construction cost can be increased, by many rebound content. Therefore, this study develops mining liner and cover materials, and evaluates their accelerating performance and physical properties of liner and cover materials by types and content of accelerating agent. In case of aluminate accelerating agent, it is mixed with more than 5% of liner and cover materials(binder/ratio); thus an accelerating performance satisfying Korean Industrial Standards(KS) occurs, and in case of alkali-free accelerating agent, when it is mixed with more than 7%(binder/ratio), accelerating performance satisfying KS occurs. The more the accelerating agent capacity increases, the more compressive strength decreases. In addition, it is confirmed that compressive strength of aluminate accelerating agent is more degraded than compressive strength of the alkali-free accelerating agent. It is also confirmed that drying shrinkage stability of the alkali-free accelerating agent is better than the drying shrinkage stability of the aluminate accelerating agent.

Study on Cu CMP by using Semi-Abrasive Free Slurry (준 무연마제 슬러리를 아용한 Cu CMP 연구)

  • Kim, Nam-Hoon;Lim, Jong-Heun;Eom, Jun-Chul;Kim, Sang-Yong;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.158-161
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    • 2003
  • The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

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A Free Agent Algorithm for Min-Cut Problem (최소절단 문제의 자유계약 알고리즘)

  • Lee, Sang-Un
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.19 no.4
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    • pp.27-33
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    • 2019
  • The min-cut problem that decides the maximum flow in a complex network flows from source(s) to sink(t) is known as a hard problem. The augmenting path algorithm divides into single path and decides the bottleneck point(edge), but the min-cut section to be decide additionally. This paper suggests O(n) time complexity heuristic greedy algorithm for the number of vertices n that applies free agent system in a pro-sports field. The free agent method assumes $N_G(S),N_G(T)$vertices among $v{\in}V{\backslash}\{s,t\}$to free agent players, and this players transfer into the team that suggest more annual income. As a result of various networks, this algorithm can be finds all of min-cut sections and min-cut value for whole cases.

Deposition behavior of cyanide-free electroless Au plating solution using thiomalic acid as complexing agent and aminoethanethiol as reducing agent and characteristics of plated Au film (티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성)

  • Han, Jaeho;Kim, DongHyun
    • Journal of the Korean institute of surface engineering
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    • v.55 no.2
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    • pp.102-119
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    • 2022
  • Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.

Free Toe Tissue Transfer using Infiltration Method of Local Anesthetic Agent (국소 침윤마취법을 이용한 족지조직 유리 피판술)

  • Seo, Dong-Lin;Park, Seung-Ha;Lee, Byung-Ihl
    • Archives of Reconstructive Microsurgery
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    • v.16 no.2
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    • pp.63-67
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    • 2007
  • This study was designed to introduce free toe tissue transfer using infiltration method of local anesthetic agent. Four toe pulp tissues were transferred to reconstruct finger tip defect in four patients who were not suitable for general anesthesia. Two flaps taken from the lateral side of the great toe was used for reconstruction of thumb defect and two flaps from the medial side of the second toe for resurfacing of the index and fifth finger. Flap sizes were various from $2.0{\times}2.0\;cm^2$ to $1.6{\times}4.0\;cm^2$. Anesthesia was induced by infiltration of 2% lidocaine hydrochloride (with 1:100,000 epinephrine) with dilution of normal saline in same volume unit, as like as in ordinary digital block. All vessels were anastomosed within 2 cm of distance from the proximal margin of the defect. Whole operative procedures were carried out by one team. All flaps were successfully taken without complication. The average operation time was 4 hours 10 minutes. The amount of anesthetic agent used in whole operative procedures was roughly 4 mL in the toe, 8 mL in the finger, and 12 mL totally. In conclusion, free toe tissue transfer using infiltration method of local anesthetic agent would be good strategy for finger tip reconstruction in the patient not suitable for general anesthesia.

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Development of Multi-agent Based Deadlock-Free AGV Simulator for Material Handling System (자재 취급 시스템을 위한 다중 에이전트 기반의 교착상태에 자유로운 AGV 시뮬레이터 개발)

  • Lee, Jae-Yong;Seo, Yoon-Ho
    • Journal of the Korea Society for Simulation
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    • v.17 no.2
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    • pp.91-103
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    • 2008
  • In order to simulate the behavior of automated manufacturing systems, the performance of material handling systems should be measured dynamically. Multi-Agent technology could be well adapted for the development of simulator for distributed and intelligent manufacture systems. A multi-agent system is composed of one coordination agent and multiple application agents. Issues in AGVS simulator can be classified by the set-up and operating problems. Decisions on the number of vehicles, bi- or uni-directional guide-path, etc. are fallen into the set-up problem category, while deadlock tree algorithm and conflict resolution are in operating problem. In this paper, a multi-agent based deadlock-free simulator for automated guided vehicle system(AGVS) are proposed through the use of multi-agent technologies and the development of deadlock-free algorithm. In this AGVS simulator proposed, well-known Floyd algorithm is used to create AGVS Guide path, through which AGVS move. Also, AGVs avoid vehicle conflict and deadlock using check path algorithm. And Moving vehicle agents are operated in real-time control by coordination agent. AGV position is dynamically calculated based on the concept of rolling time horizon. Simulator receives and presents operating information of vehicle in AGVS Gaunt chart. The performance of the proposed algorithm and developed simulator based on multi-agent are validated through set of experiments.

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