• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.441-446
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• 2004

Mechanical systems with rubber parts have been used widely in industry fields. The evaluation of the physical characteristics of rubber is important in rubber application. Rubber material is useful to machine component for excellent shock absorbing characteristics. The impact characteristics of rubber were examined by experimental and finite element method. The impact test was conducted with a free-drop type impact tester. The ABAQUS/Explicit was used for finite element analysis. The effects of thickness and diameter of the cylindrical rubber structures were investigated. The impact absorbing ratio of the rubber material was studied order to compare the peak reaction force of the specimen which only contained aluminum against the specimen with the inserted rubber part.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2004년도 춘계학술대회논문집
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• pp.173-176
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• 2004

Nowadays, mobile devices are very common equipments such as mobile phone, PDA, etc. These equipments need information storage devices. Optical storage devices have more advantages than other storage devices, but it is not free from shock situation like dropping by user's mistakes. A complete model of a Small Form Factor Optical(SFFO) disk drive subject to shock loads is developed to investigate the response of the pickup/disk interface. With this model, we can simulate the drop test and consider the matters of shock simulation using commercial software(Ansys/LS-Dyna).

• Elastomers and Composites
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• 제41권1호
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• pp.40-48
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• 2006

고무는 금속 및 플라스틱 재료와 달리 작은 하중에서도 큰 변형이 발생되며, 높은 변형 구간에서 탄성특성을 보이는 특징이 있다. 특히 충격흡수 특성이 금속 및 플라스틱보다 우수하므로 제진 및 충격 완충구조물로 널리 활용되고 있다. 충격하중을 받는 고무 구조물의 특성을 평가하기 위하여 자유 낙하형 충격시험기를 이용하여 충격실험을 실시하였으며, ABAQUS/Explicit를 이용하여 유한요소 해석을 수행하였다. 고무의 동강성은 충격펄스의 최대변형량과 충격지속시간으로부터 얻어진 진폭과 주파수를 적용하여 동특성 시험을 수행하고 WLF모델을 적용하여 높은 주파수 대역의 동강성을 예측하였다. 실험을 실시한 $0.3{\sim}l.5J$의 충격에너지 영역에서는 고무의 경도가 증가되면 충격흡수율이 감소되며, 충격에너지가 커질수록 충격흡수율은 감소하는 경향을 나타내었다.

• Journal of Welding and Joining
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• 제25권3호
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국항공운항학회지
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• 제19권4호
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• pp.51-57
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• 2011

The spin-up and the spring-back are most severe load cases in the aircraft landing gear design. These load cases are caused by reciprocal action of complex physical phenomenon such as the friction between a tire and ground, inertia of the rotation of a tire and the flexibility of a landing gear structure. Generally, the empirical formula or the theoretical formula is used to calculate the spin-up and spring-back load in the early stage of the development program of the aircraft landing gear. After the materialization of the design of a landing gear, spin-up and spring-back load are acquired by the free drop test. In this study, the spin-up and the spring-back load of the rubber shock absorber type KC-100 nose landing gear are calculated by the explicit finite element analysis. Through this analysis, more accurate and realistic spin-up and spring back loads could be applied to the early phase of the development of the aircraft landing gear.

• 대한수의학회지
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• 제58권4호
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• pp.193-199
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• 2018

As animal welfare issue becomes important, the European Union bans conventional cages for laying hens from 2012. So the alternative housing systems like floor pens, aviaries or free range systems have been suggested. From 2011 to 2014, we monitored 20 welfare-oriented laying hen farms in South Korea to figure out serological status of major viral diseases. During this period, total 3,219 blood samples were collected from the randomly selected chickens to test and evaluate the hemagglutination inhibition titers for low pathogenic avian influenza, Newcastle disease and egg drop syndrome '76. A total of 2,926 blood samples were tested through enzyme linked immunosorbent assay (ELISA) to assess the serological status of infectious bronchitis (IB). The distribution of ELISA titers for IB was various from almost 0 to 20,000 through the all weeks of age. Also, the antibody coefficient of variation for most of the diseases in this study was higher than those of typical cage layers. As this study was the first surveillance for major avian viral diseases of the animal welfare-oriented farms in South Korea, the results obtained from this study will help to determine what information and resources are needed to maintain better biosecurity and to improve the health and welfare of laying hen flocks.

• 한국산업융합학회 논문집
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• 제25권2_2호
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• pp.289-297
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• 2022

Deterioration in durability of structures due to the steel corrosion is difficult to determine whether or not corrosion is initiated and how much propagated, and moreover, repair and maintenance are not easy to deal with. Therefore, preventive treatments can be the best option to avoid the deterioration. Various methods for preventing corrosion of steel, such as electrochemical treatments, anti-corrosion agents and steel surface coatings, are being developed, but economic and environmental aspects make it difficult to apply them to in-situ field. Thus, the purpose of this study was to improve corrosion resistance by using CA-based clinker that are relatively simple and expected to be economically profitable Existing CA-based clinkers had problems such as flash setting and low strength development during the initial hydration process, but in order to solve this problem, CA clinker with low initial reactivity were used as binder in this study. The cement paste used in the experiments was replaced with CA₂ clinker for 0%, 10%, 20%, and 30% in OPC. And the mixture used in the chloride binding test for the extraction of water-soluble chloride was intermixed with Cl- 0.5%, 1%, 2%, and 3% by weight of binder content. To evaluate characteristic of hydration heat evolution, calorimetry analysis was performed and simultaneously chloride binding capacity and acid neutralization capacity were carried out. The identification of hydration products with curing ages was verified by X-ray diffraction analysis. The free chloride extraction test showed that the chlorine ion holding ability improved in order OC 10 > OC 30 > OC 20 > OC 0 and the pH drop resistance test showed that the resistance capability in pH 12 was OC 0 > OA 10 > OA 20 > OA 30. The XRD analyses showed that AFm phase, which can affect the ability to hold chlorine ions, tended to increase when CA₂ was mixed, and that in pH12 the content of calcium hydroxide (Ca(OH)₂), which indicates pH-low resistance, decreased as CA₂ was mixed