• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• Polymer(Korea)
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• v.27 no.3
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• pp.176-182
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• 2003

The fluorine-containing epoxy resin, 2-trifluorotoluene diglycidylether (FER) was prepared by reaction of 2-chloro-${\alpha}$,${\alpha}$,${\alpha}$-trifluorotoluene with glycerol diglycidylether in the presence of pyridine catalyst. Curing behavior of FER/DDM system was investigated using dynamic and isothermal DSC. Cure activation energy (Ea) was determined by Flynn-Wall-Ozawa's equation. The rheological properties of FER/DDM system were studied under isothermal condition using a rheometer. Cross-linking activation energy (Ec) was determined from the Arrhenius equation based on gel time and curing temperature. As a result, the chemical structure of FER was confirmed by FT-IR, $\^$13/C NMR, and $\^$19/F NMR spectroscopy. The cure activation energy of FER/DDM system was 55.4 kJ/mol and conversion and conversion rate were increased with the curing temperature. The cross-linking activation energy of FER/DDM system was 41.6 kJ/mol and gel time was decreased with the curing temperature.

• Macromolecular Research
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• v.17 no.11
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• pp.870-873
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• 2009

In this study, 2-diglycidylether of benzotrifluoride (2-DGEBTF) and 4-diglycidylether of benzotrifluoride (4-DGEBTF) epoxy resins, which contained fluorine groups in the main chain, were synthesized. The resins were characterized by FTIR, $^1H$ NMR, $^{13}C$ NMR and $^{19}F$ NMR spectroscopy. The 2-DGEBTF and 4-DGEBTF epoxy resins were cured with triethylene tetramine (TETA), and the effect of the fluorine group on the synthesized epoxy resin on the cure behavior, thermal, and mechanical properties was investigated. The 2-DGEBTF/TETA system was more reactive than the 4-DGEBTF/TETA system, whereas the thermal stability factor i.e., the decomposition activation energy ($E_d$), of 4-DGEBTF/TETA was higher than that of 2-DGEBTF/TETA. These results can be explained by the decrease in cross-linking density and decomposition of the short side chains, resulting in the $CF_3$ group at the para position. However, the $K_{IC}$ value of 4-DGEBTF/TETA was higher than that of 2-DGEBTF/TETA. This was attributed to the increase in flexibility in the epoxy backbone, resulting in a difference in steric hindrance and polarlizability.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.633-636
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• 2008

A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.328-332
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• 2012

Etch rates of Si and high purity SiC have been compared for various fluorocarbon plasmas. The relative plasma resistance of SiC, which is defined as the etch rate ratio of Si to SiC, varied between 1.4 and 4.1, showing generally higher plasma resistance of SiC. High resolution X-ray photoelectron analysis revealed that etched SiC has a surface carbon content higher than that of etched Si, resulting in a thicker fluorocarbon polymer layer on the SiC surface. The plasma resistance of SiC was correlated with this thick fluorocarbon polymer layer, which reduced the reaction probability of fluorine-containing species in the plasma with silicon from the SiC substrate. The remnant carbon after the removal of Si as volatile etch products augments the surface carbon, and seems to be the origin of the higher plasma resistance of SiC.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.4
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• pp.133-137
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• 2001

In this research, we synthesized various photo-crosslinkable polyimide based polymers. The control of pretilt angles for a nematic liquid crystal (NLC) using the photodimerization method on the photopolymers was studied. A good thermal stability of the photopolymers was measured by thermogravimetric analysis (TGA) measurement until 450C. High pretilt angles of the NLC were otained by polarized UV exposure on the photopolymers containing biphenyl (BP), decyl (de), and cholesteryl (chal) groups, respectively. However, low pretilt angles of the NLC were measured by polarized UV exposure on the photopolymers containing fluorine and chalcone groups. The high NLC pretilt angles generated are attributable to the biphenyl and alkyl moieties, and the photodimerized chalocone group of the photopolymers. Additionally, good voltage-transmittance and response time characteristics were observed by UV exposure on the photopolymers.

• Macromolecular Research
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• v.8 no.5
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• pp.215-223
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• 2000

A novel diamine monomer, containing fluorine and phosphine oxide, bis(3-aminophenyl) 3,5-bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO), was prepared via Grignard reaction, and utilized to prepare polyimides with dianhydrides such as PMDA, 6FDA, BTDA or ODPA, by the conventional two-step route; preparation of poly(amic acid), followed by solution imidization. The polyimides were characterized by FT-IR, NMR, and DSC with intrinsic viscosity and refractive index also being evaluated. A phosphine oxide containing monomer, bis(3-aminophenyl)phenyl phosphine oxide (mDAPPO) and a commercial 3,3-diaminodiphenyl sulfone (mDDS) were also used for comparison. The polyimides derived from mDA6FPPO exhibited high T$\sub$g/, excellent solubility and low birefringence.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.595-599
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• 2001

The mechanisms of pretilt angle generation for a nematic liquid cystal (NLC) using a photodimerization method with obliquely polarized UV exposure on the various new photo-crosslinkable polymer were studied. A good thermal stability of all the photo-crosslinkable polymers was obtained by thermogravimetric analysis (TGA) measurement until 450$\^{C}$. High pretilt angle of the NLC was observed by polarized UV exposure on the three kinds of the photo-crosslinkable polymers containing biphenyl(BP), decyl(de), and cholesteryl(chol) group, respectively. However, the low pretilt angle of the NLC was measured by obliquely polarized UV exposure on the two kinds of the photo-crosslinkable polymers containing fluorine and chalcone group. Consequently, the high NLC angle generated is attributable to the biphenyl and alkyl moieties, and photo-dimerized chalcone group of the photopolymer.

• Polymer(Korea)
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• v.33 no.4
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• pp.313-318
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• 2009

Copolyimides were synthesized from bis (3-aminophenyl) sulfone (APS) and 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) containing a fluorine substituent ($-CF_3$) with different mole ratios of 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride (DSDA) containing a sulfone group (-$SO_2$-). The PI films were obtained from poly (amic acid) (PAA) by solution casting through thermal imidization on a glass plate. Wide-angle X-ray diffraction (XRD), scanning electron microscopy (FE-SEM), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), universal tensile machine (UTM) measurements, and UV-Vis spectrometry were used to assess thermo-mechanical properties, morphology, and optical transparency. Thermal properties and optical transparency decreased with increasing DSDA mole fraction. In contrast, mechanical properties increased with increasing DSDA mole fraction. As compared to conventional PI films, however, the PI copolymer films in this work were found to exhibit better optical transparency.

• Proceedings of the Membrane Society of Korea Conference
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• 1994.04a
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• pp.53-54
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• 1994

Polyimide는 열, 화학적으로 안정하고 기계적성질이 우수하고, 기체분리특성이 비교적 좋다. Polyimide의 화학구조와 기체투과도와의 관계는 화학구조를 체계적으로 변화시키면서 많이 검토되어왔다.[1-2] Polyimide는 강직한 직쇄구조, bulky group에 의한 분자쇄운동성을 제어함과 동시, 약한 분자간 상호작용이 polymer chain의 유효층진을 억제하여 기체투과도를 높여준다. 국부분절운동(local segmental mobility)이 감소된 구조는 기체투과선택도를 향상시켜주는 경향을 보여주었다. [3] kim et al. 과 Stern et al은 6FDA나 fluorine-containing diamines으로 만든 polyimde가 매우높은 투과도를 보여준다고 보고했다. 본 연구에서는 6FDA-2, 4TDA hobopolymer에 BAAF를 가하여 copolyimide Membrane을 제막하여 BAAF 조성에 따라 투과선택도를 측정하는 homopolymer와 copolymer에 따른 변화를 관찰하였다.