• 제목/요약/키워드: Fluorine plasma

검색결과 107건 처리시간 0.029초

Influence of Fluorine Doping on Hardness and Compressive Stress of the Diamond-Like Carbon Thin Film

  • Sayed Mohammad Adel Aghili;Raheleh Memarzadeh;Reza Bazargan Lari;Akbar Eshaghi
    • 한국재료학회지
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    • 제33권4호
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    • pp.124-129
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    • 2023
  • This study assessed the influences of fluorine introduced into DLC films on the structural and mechanical properties of the sample. In addition, the effects of the fluorine incorporation on the compressive stress in DLC films were investigated. For this purpose, fluorinated diamond-like carbon (F-DLC) films were deposited on cobalt-chromium-molybdenum substrates using radio-frequency plasma-enhanced chemical vapor. The coatings were examined by Raman scattering (RS), Attenuated total reflectance Fourier transform infrared spectroscopic analysis (ATR-FTIR), and a combination of elastic recoil detection analysis and Rutherford backscattering (ERDA-RBS). Nano-indentation tests were performed to measure hardness. Also, the residual stress of the films was calculated by the Stony equation. The ATR-FTIR analysis revealed that F was present in the amorphous matrix mainly as C-F and C-F2 groups. Based on Raman spectroscopy results, it was determined that F made the DLC films more graphitic. Additionally, it was shown that adding F into the DLC coating resulted in weaker mechanical properties and the F-DLC coating exhibited lower stress than DLC films. These effects were attributed to the replacement of strong C = C by feebler C-F bonds in the F-DLC films. F-doping decreased the hardness of the DLC from 11.5 to 8.8 GPa. In addition, with F addition, the compressive stress of the DLC sample decreased from 1 to 0.7 GPa.

ZnO 박막의 fluorine-계 유도결합 플라즈마 식각 (Fluorine-based inductively coupled plasma etching of ZnO film)

  • 박종천;이병우;김병익;조현
    • 한국결정성장학회지
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    • 제21권6호
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    • pp.230-234
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    • 2011
  • $CF_4$ Ar 및 $SF_6$/Ar 유도결합 플라즈마을 이용하여 ZnO 박막의 고이온밀도 플라즈마 식각을 수행하였다. $10CF_4$/5Ar, $10SF_6$/5Ar 유도결합 플라즈마에서 최고 ~1950 ${\AA}$/min과 ~1400 ${\AA}$/min의 식각 속도를 확보하였다. 대부분의 조건 하에서 식각된 ZnO 표면은 식각 전보다 더 낮은 표면조도 값들을 나타내었다. $10CF_4$/5Ar 유도결합 플라즈마에서 Ni mask는 ZnO에 대해 최고 11의 높은 식각 선택도를 나타낸 반면에 Al은 이보다 낮은 1.6~4.7 범위의 식각선택도를 나타내었다.

$Cl_{2}$/$CF_{4}$/Ar gas chemistry에 의한 $SrBi_2Ta_2O_{9}$ 박막의 식각 특성 (Etching Kinetics Of $SrBi_2Ta_2O_{9}$ Thin Film in $Cl_{2}$/$CF_{4}$/Ar gas Chemistry)

  • 김동표;김창일;이원재;유병곤;김태형;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.62-65
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    • 2001
  • $SrBi_2Ta_2O_{9}$ thin films were etched in inductively coupled $Cl_{2}$/$CF_{4}$/Ar plasma. The maximum etch rate was 1060 $\AA\textrm{m}$/min in $Cl_{2}$/$CF_{4}$/Ar (80). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy. The etching of SBT thin films in $Cl_{2}$/$CF_{4}$/Ar were etched by chemically assisted reactive ion etching. The small addition of $Cl_2$ into $CF_4$(20)/Ar(80) plasma will decrease the fluorine radicals and the increase Cl radical.

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Multi-pole Inductively Coupled Plasma(MICP)를 이용한 Via Contact 및 Deep Contact Etch 특성 연구 (Via Contact and Deep Contact Hole Etch Process Using MICP Etching System)

  • 설여송;김종천
    • 반도체디스플레이기술학회지
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    • 제2권3호
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    • pp.7-11
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    • 2003
  • In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

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반응성 이온 식각후 AlCu막의 부식현상 (The corrosion phenomena of AlCu films after reactive ion etching)

  • 김창일;권광호;김상기;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1996년도 추계학술대회 논문집
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    • pp.252-255
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    • 1996
  • Cl-based gas chemistry is generally used to etching for Al alloy metallization. After the etching of Al alloy with Cl-based gas plasma, residual chlorine on Al alloy reacts with $H_2O$ due to air exposure and results in Al corrosion. In this study, the corrosion Phenomena of Al were examined with XPS(X-ray photoelectron spectroscopy) and SEF(Scanning electron microscopy). It was confirmed that chlorine mainly existed at the grain boundary of Al alloy after plasma etching of Al alloy with Cl-based gas chemistry and Al corrosion was largely generated at the grain boundary of Al a1loy. And residual chlorine was passivated by sulfur and fluorine which were generated by SF$_{6}$ plasma. These effects of passivation reduced the Al corrosion due to air exposure.e.

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Bioinspired Metal Surfaces by Plasma Treatment

  • 유의선;고태준;오규환;문명운
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.97-97
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    • 2013
  • The exterior structures of natural organisms have continuously evolved by controlling wettability, such as the Namib Desert beetle, whose back has hydrophilic/hydrophobic contrast for water harvesting by mist condensation in dry desert environments, and some plant leaves that have hierarchical micro/nanostructures to collect or repel liquid water. In this work, we have provided a method for wettability contrast on metals by both nano-flake or needle patterns and tuning of the surface energy. Metals including steel alloys and aluminum were provided with hierarchical micro/nanostructures of metaloxides induced by fluorination and a subsequent catalytic reaction of fluorine ions on metal surfaces in water with various ranges from room to boiling temperature of water. Then, a hydrophobic material was deposited on the structured surfaces, rendering superhydrophobicity. Plasma oxidization induces the formation of superhydrophilic surfaces on selective regions surrounded by superhydrophobic surfaces. We show that wettability contrast surfaces align liquid water within patterned hydrophilic regions during the condensation process. Furthermore, this method could have a greater potential to align other liquids or living cells.

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Plasma etching behavior of RE-Si-Al-O glass (RE: Y, La, Gd)

  • 이정기;황성진;이성민;김형순
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2010년도 춘계학술발표대회
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    • pp.49.1-49.1
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    • 2010
  • The particle generation during the plasma enhanced process is highly considered as serious problem in the semiconductor manufacturing industry. The material for the plasma processing chamber requires the plasma etching characteristics which are homogeneously etched surface and low plasma etching depth for preventing particulate contamination and high durability. We found that the materials without grain boundaries can prevent the particle generation. Therefore, the amorphous material with the low plasma etching rate may be the best candidate for the plasma processing chamber instead of the polycrystalline materials such as yttria and alumina. Three glasses based on $SiO_2$ and $Al_2O_3$ were prepared with various rare-earth elements (Gd, Y and La) which are same content in the glass. The glasses were plasma etched in the same condition and their plasma etching rate was compared including reference materials such as Si-wafer, quartz, yttria and alumina. The mechanical and thermal properties of the glasses were highly related with cationic field strength (CFS) of the rare-earth elements. We assumed that the plasma etching resistance may highly contributed by the thermal properties of the fluorine byproducts generated during the plasma exposure and it is expected that the Gd containing glass may have the highest plasma etching resistance due to the highest sublimation temperature of $GdF_3$ among three rare-earth elements (Gd, Y and La). However, it is found that the plasma etching results is highly related with the mechanical property of the glasses which indicates the cationic field strength. From the result, we conclude that the glass structure should be analyzed and the plasma etching test should be conducted with different condition in the future to understand the plasma etching behavior of the glasses perfectly.

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Bioinspired superhydrophobic steel surfaces

  • 허은규;오규환;이광렬;문명운
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.509-509
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    • 2011
  • Superhydrophobic surfaces on alloyed steels were fabricated with a non-conventional method of plasma etching and subsequent water immersion procedure. High aspect ratio nanopatterns of nanoflake or nano-needle were created on the steels with various Cr content in its composition. With CF4 plasma treatment in radio-frequence chemical vapor deposition (r.-f. CVD) method, steel surfaces were etched and fluorinated by CF4 plasma, which induced the nanopattern evolution through the water immersion process. It was found that fluorine ion played a role as a catalyst to form nanopatterns in water elucidated with XPS and TEM analysis. The hierarchical patterns in micro- and nano scale leads to superhydrophobic properties on the surfaces by deposition of a hydrophobic coating with a-C:H:Si:O film deposited with a gas precursor of hexamethlydisiloxane (HMDSO) with its lower surface energy of 24.2 mN/m, similar to that of curticular wax covering lotus surfaces. Since this method is based on plasma dry etching & coating, precise patterning of surface texturing would be potential on steel or metal surfaces. Patterned hydrophobic steel surfaces were demonstrated by mimicking the Robinia pseudoacacia or acacia leaf, on which water was collected from the humid air using a patterned hydrophobicity on the steels. It is expected that this facile, non-toxic and fast technique would accelerate the large-scale production of superhydrophobic engineering materials with industrial applications.

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EB-PVD법으로 코팅된 Y2O3의 내플라즈마 특성 (Plasma Resistances of Yttria Deposited by EB-PVD Method)

  • 김대민;윤소영;김경범;김희식;오윤석;이성민
    • 한국세라믹학회지
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    • 제45권11호
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    • pp.707-712
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    • 2008
  • Plasma resistant nanocrystalline $Y_2O_3$ films were deposited on alumina substrates through the electron-beam PVD technique. Increasing substrate temperature to $600^{\circ}C$ resulted in the textured microstructures with significantly enhanced adhesion force of the coating to the substrate. During the exposure to fluorine plasma, erosion rate of the coated specimen was higher than that of a sintered yttria specimen, but significantly lower than that of a single crystalline alumina. Considering the adhesion and erosion behaviors observed in the coated specimen prepared at $600^{\circ}C$, the deposition technique appears effective in reducing contamination particles generated from the ceramic parts in the plasma environment.

Pt 박막의 SF$_6$/Ar과 C1$_2$/Ar 플라즈마 가스와의 표면반응에 관한 연구 (Study on the Surface Reaction of Pt Thin Film with SF$_6$/Ar and Cl$_2$/Ar Plasma Gases)

  • 김상훈;주섭열;안진호
    • 마이크로전자및패키징학회지
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    • 제8권3호
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    • pp.63-67
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    • 2001
  • 최근가지 Pt박막의 식각은 Cl 계열의 가스에 의한 물리적인 스퍼터링 기구에 초점을 맞추어 연구가 진행되어왔으며 F 계열의 가스에 의한 식각 특성은 상당히 미진하였다. 본 연구에서는 ECR(electron cyclotron resonance) 플라즈마 식각 장비를 이용하여 $Cl_2$/Ar 가스와 $SF_{6}$/Ar 가스를 사용하여 Pt 박막의 식각 특성을 연구하였고, $SF_{6}$/Ar 가스의 경우 Pt 박막과 반응하여 휘발성의 식각 부산물을 형성시킬 수 있음을 확인하였다. 그리고 휘발성있는 platinum fluoride 화합물의 형성에 의해 식각률, 식각 측면형상과 표면 거칠기 특성개선도 얻을 수 있었다.

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