Sheet metals are often required to be formed into three dimensional curved shapes for use as skin structures. As a result various sheet metal forming methods, such as press die forming, stretch forming, and line heating have been used over the years in industrial production lines. Although they are extensively used in industry, these methods are not suitable for small quantity batch productions. Studies have been conducted to improve or replace these methods with plausible flexible forming technologies. As a part of these studies, we developed a new and more efficient forming device named flexibly-reconfigurable roll forming (FRRF). The current study presents the process development and experimental verification for the applicability of this device. To improve the efficiency of the FRRF apparatus, several hardware components were invented and a suitable operating program was developed using MFC of visual C++. The ways to make the FRRF apparatus fully functional are also described. Sheet metal was formed into three dimensional shapes using the FRRF apparatus and the final products are presented as evidence for the applicability of the developed device.
Journal of the Korean institute of surface engineering
/
v.40
no.6
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pp.245-249
/
2007
Amorphous IZO films were deposited on PET substrate by DC magnetron sputtering without substrate heating. In order to investigate effect of reactive gas addition on film properties, 0.2-0.4% of $H_2$ or $O_2$ gas was introduced during the deposition. Deposited IZO films were evaluated with mechanical property, electrical property, and water permeability. In the case of $H_2$ gas addition, mechanical property showed clear degradation compared to $O_2$ gas. In the case of $O_2$ gas, water permeability of the IZO film was increased compared to $H_2$ gas which could be attributed to the low adhesion of the film caused by bombardment of high energy negative oxygen ion. As a result, it is confirmed that water permeability of the film could be strongly affected by adhesion of the film.
Park, Mi-Rang;Lee, Sung-Hun;Kim, Do-Geun;Lee, Gun-Hwan;Song, Pung-Keun
Journal of the Korean institute of surface engineering
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v.41
no.5
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pp.214-219
/
2008
Indium tin oxide (ITO) films were deposited on PET substrate by RF superimposed DC magnetron sputtering using ITO (doped with 10 wt% $SnO_2$) target. Substrate temperature was maintained below $750^{\circ}C$ without intentionally substrate heating during the deposition. The discharge voltage of DC power supply was decreased from 280 V to 100 V when superimposed RF power was increased from 0 W to 150 W. The electrical properties of the ITO films were improved with increasing of superimposed RF power. In the result of cyclic bending test, relatively high mechanical property was obtained for the ITO film deposited with RF power of 75 W under DC current of 0.75 A which could be attributed to the decrease of internal stress caused by decrease in both deposition rate and plasma impedance.
Journal of the Microelectronics and Packaging Society
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v.29
no.2
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pp.113-119
/
2022
In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.
Proceedings of the Korean Institute of Surface Engineering Conference
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2001.11a
/
pp.3-3
/
2001
Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.
Iridium oxide films (IROFs) have been extensively studied as a material for electrical stimulation of neurons, as iridium oxide has higher charge storage capacity than other metal films. More recently, sputtered iridium oxide film (SIROF) has been studied, because it can be made more conveniently than activated iridium oxide film (AIROF). Typically, the SIROFs are grown at temperatures from 400 to 600 $^{\circ}C$. However, such high temperatures cannot be used when the iridium oxide (IrOx) film is to be deposited on a flexible polymer material, such as polyimide. In this paper, we show that we can still obtain excellent characteristics in SIROFs grown without heating (cold SIROF), by optimizing the growth conditions. We show that the oxygen flow rate is a critical parameter for controlling the surface properties of a cold SIROF. At an oxygen flow rate of 12 seem, the cold SIROF exhibited a charge storage capacity (CSC) of 60 mC/cm$^2$, which is comparable to or better than other published values for iridium oxide films including heated SIROFs. The film produced under these conditions also had the minimum impedance value of all cold SIROFs deposited for this study. A stability test and biocompatibility test also demonstrated the superiority of the optimized cold SIROF.
This study presents an excellent planar heater based on low-dimensional composites. By optimizing the ratio of 1D carbon nanotubes (CNT) and 2D MXene (Ti3C2TX), it is possible to create a planar heater that has superior electrical conductivity and high heat generation characteristics. Low-dimensional composites were prepared by mixing CNT paste and MXene solution with eco-friendly waterborne polyurethane (WPU). In order to find the optimal mixing ratio for the MXene-CNT-WPU composites, samples with MXene to CNT weight ratios of 3:1, 1:1, 1:3, 1:7, and 1:14 were investigated. In addition to these different weight ratios, 5 wt% WPU was equally applied to each sample. It was confirmed that the higher the weight ratio of CNT, the lower the sheet resistance and the higher the heating temperature. In particular, when the MXene-CNT-WPU planar heater was fabricated by mixing MXene and CNT at a weight ratio of 1:7 and 1:14, the heating temperature was higher than the heating temperature of a CNT-WPU planar heater. These characteristics are due to the optimized mixture of the 1D materials (CNT) and the 2D materials (MXene) causing the formation of a flat surface and a dense network structure. The low-dimensional composites manufactured with the optimized mixing ratios found in this study are expected to be applied in flexible electronic devices.
Polyethylene pipes has useful benefits which are anti-corrosive and flexible material, so it is used to gas pipes but also class 3 water pipes of nuclear power plant, process pipes of petrochemical plant and chemical plant. So the usage of polyethylene pipes is widely increased. But it has been limited for the usage of polyethylene, because it can not be directly detected to fusion joints by using non destructive evaluation. Polyethylene pipes are connected by two methods, one is butt fusion and the other is electrofusion. Butt fusion is widely used to connecting the pipes. It is proposed to method for determining the reliability of joints in this study that is detection of the melt flow zone at fusion joints. In this study, middle density polyethylene is used, outside diameter of the test specimen is 225mm and thickness is 20.5mm. Speed of ultrasonic of this test specimen is 2,200m/s. Test specimens were fabricated by varying the heating time which means from 0% to 130% applying time through heating plate to polyethylene for detecting melt flow zone. Also 4 additional test specimens were made, one was made that not scrapping attached surface of pipes but applying 100% of the proper heating time and the others were made to include of soil, gravel and vinly tape paper at fusion joints, that were also applied 100% of proper heating time. Ultrasonic testing to measure the melt flow zone of 20 test specimens was conducted by using 3.5MHz and 5.0MHz ultrasonic probes and melt flow zone measuring was conducted to three times at different point to one specimen. To differentiate the melt flow zone signal, post image processing was equally conducted to all test results and image levels, contrast, sharpen, threshold were adopted to all teat results and the test results were displayed gray scale. From the results, for the shorter heating times the reflection area of multiple echo have been increased, so the data was obtained from the position where it can be eliminated as much as possible. At 80% of proper heating time(168 sec.), the signal of melt flow zone was obtained clearly, so measuring could be conducted. From 7% of proper heating time(15 sec.) to shorter heating times. we could not obtain the signal because test specimen was not fused. From the result, we can verify that measuring of melt flow zone by using phased array ultrasonic imaging method is possible. And we can verify to complete and incomplete butt fusion by measuring the melt flow zone.
Proceedings of the Korean Vacuum Society Conference
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2012.02a
/
pp.100-101
/
2012
The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.
Flame bending has been extensively used in the shipbuilding industry for hull plate forming In flame bending it is difficult to obtain the desired shape because the residual deformation dependson the complex temperature distribution and the thermal plastic strain. Mechanical bending such as reconfigurable press forming multi-point press forming or die-less forming has been found to improve the automation of hull plateforming because it can more accurately control the desired shape than line heating. Multi-point forming is a process in which external forces are used to form metal work-pieces. Therefore it can be a flexible and efficient forming technique. This paper presents an optimal approach to determining the press-stroke for multi-point press forming of curved shapes. An integrated configuration of Finite element analysis (FEA) and spring-back compensation algorithm is developed to calculate the strokes of the multi-point press. Not only spring-back is modeled by elastic plastic shell elements but also an iterative algorithm to compensate the spring-back is applied to adjust the amount of pressing stroke. An iterative displacement adjustment (IDA) method is applied by integration of the FEA procedure and the spring-back compensation work. Shape deviation between the desired surface and deform£d plate is minimized by the IDA algorithm.
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