• Korean Journal of Optics and Photonics
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• v.23 no.1
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• pp.12-16
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• 2012

In the paper, we fabricated a Ni master with $45^{\circ}$-mirror structures for flexible waveguide fabrication. The flexible waveguide films with embedded $45^{\circ}$-angled mirrors at the waveguide ends were successfully fabricated using a UV-imprint process. Next, in order to enhance the reflectivity of the mirrors, Ni(3 nm)-Au(200 nm) bilayers were evaporated on the $45^{\circ}$-angled facets through a locally opened thin mask using an electron beam evaporator. We measured propagation loss, bending loss, mirror loss and bending reliability of the fabricated waveguide.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.69-76
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• 2014

In this study, we developed an ultra-thin flexible printed circuit board(FPCB) using the sputtered flexible copper clad laminate. In order to enhance the adhesion between copper and polyimide substrate, a NiMoNb addition layer was applied. The mechanical durability and flexibility of the ultra-thin FPCB were characterized by stretching, twisting, bending fatigue test, and peel test. The stretching test reveals that the ultra-thin FPCB can be stretched up to 7% without failure. The twisting test shows that the ultra-thin FPCB can withstand an angle of up to $120^{\circ}$. In addition, the bending fatigue test shows that the FPCB can withstand 10,000 bending cycles. Numerical analysis of the stress and strain during stretching indicates the strain and the maximum von Mises stress of the ultra-thin FPCB are comparable to those of the conventional FPCB. Even though the ultra-thin FPCB shows slightly lower durability than the conventional FPCB, the ultra-thin FPCB has enough durability and robustness to apply in industry.

• Journal of the Korean Society of Marine Environment & Safety
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• v.28 no.spc
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• pp.23-29
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• 2022

To detect harmful chemical substances in seawater, we fabricated a prototype sensor and evaluated its performance. The prototype sensor consisted of a detector, housing, and driving circuit. We built the detector by printing an Indium-Tin-Oxide (ITO) nanoparticle film on a flexible substrate, and it had two detection parts for simultaneous detection of temperature and HNS concentration. The housing connected the detector and the driving circuit and was made of Teflon material to prevent chemical reactions that may affect sensor performance. The driving circuit supplied electric power, and display measured data using a bridge circuit and an Arduino board. We evaluated the sensor performances such as response (ΔR), the limit of detection (LOD), response time, and errors to confirm the specification.

• Applied Chemistry for Engineering
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• v.34 no.4
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• pp.444-449
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• 2023

As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.5
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• pp.231-236
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• 2008

This paper proposes a cost-efficient and flexible FPGA-based logic circuit emulation platform. By improving the performance and adding more features, this new platform is an enhanced version of our LAPG. It consists of an FPGA-based hardware engine and software element to drive the emulation and monitor the results. It also provides an interactive verification environment which uses an efficient communication protocol through a bi-directional serial link between the host and the FPGA board. The experimental results show that this new approach saves $55%{\sim}99%$ of communication overhead compared with other methods. According to the test results, the new LAPG is more area efficient in complex circuits with many I/O ports.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.12
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.6
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• pp.654-660
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• 2011

In this paper, the electromagnetic wave transmission through a ridge-loaded small circular aperture is considered. The transmission problem when a plane wave is normally incident on the aperture in an infinite conducting plane is solved by a method of moments(MoM). From the results for the transmitted power and the patterns of radiation from the aperture, the transmission characteristics of a small sub-wavelength circular aperture, a ridge-loaded circular aperture, and a half wavelength slot are compared. In addition, the theoretical study is verified through the experiments for the apertures fabricated on an Flexible Printed Circuit Board(FPCB), which shows fairly good agreements with the simulated results.

• Coupled systems mechanics
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• v.4 no.4
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• pp.279-295
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• 2015

The article presents a theoretical-experimental approach developed for modeling the coefficient of sliding friction in the dynamic system tool-workpiece in slide diamond burnishing of low-alloy unhardened steels. The experimental setup, implemented on conventional lathe, includes a specially designed device, with a straight cantilever beam as body. The beam is simultaneously loaded by bending (from transverse slide friction force) and compression (from longitudinal burnishing force), which is a reason for geometrical nonlinearity. A method, based on the idea of separation of the variables (time and metric) before establishing the differential equation of motion, has been applied for dynamic modeling of the beam elastic curve. Between the longitudinal (burnishing force) and transverse (slide friction force) forces exists a correlation defined by Coulomb's law of sliding friction. On this basis, an analytical relationship between the beam deflection and the sought friction coefficient has been obtained. In order to measure the deflection of the beam, strain gauges connected in a "full bridge" type of circuit are used. A flexible adhesive is selected, which provides an opportunity for dynamic measurements through the constructed measuring system. The signal is proportional to the beam deflection and is fed to the analog input of USB DAQ board, from where the signal enters in a purposely created virtual instrument which is developed by means of Labview. The basic characteristic of the virtual instrument is the ability to record and visualize in a real time the measured deflection. The signal sampling frequency is chosen in accordance with Nyquist-Shannon sampling theorem. In order to obtain a regression model of the friction coefficient with the participation of the diamond burnishing process parameters, an experimental design with 55 experimental points is synthesized. A regression analysis and analysis of variance have been carried out. The influence of the factors on the friction coefficient is established using sections of the hyper-surface of the friction coefficient model with the hyper-planes.