• Journal of the Korea Institute of Military Science and Technology
• /
• v.17 no.3
• /
• pp.311-317
• /
• 2014

In this paper, the flexible and reconfigurable frequency selective surface for C-band was designed using patch array and grid structure for radome and other curved surface applications. Frequency reconfigurability was obtained by varying the capacitance of varactor diode and flexibility is implemented by using flexible PCB. For the validity of the proposed structure, we fabricated the flexible and reconfigurable frequency selective structure and measured the frequency reconfigurability for different bias voltages and different curvature surfaces from the optimized design parameters. From the measurement results, we know that the proposed structure has the wideband reconfigurable frequency bandwidth of 6.05-7.08GHz. We can apply this proposed structure to the curved surface like as radome of aircraft or warship.

• Journal of Sensor Science and Technology
• /
• v.15 no.4
• /
• pp.277-283
• /
• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

• Journal of Korea Multimedia Society
• /
• v.24 no.3
• /
• pp.382-395
• /
• 2021

In this study, character recognition using deep learning is performed among the various defects in the PCB, the purpose of which is to check whether the printed characters are printed correctly on top of components, or the incorrect parts are attached. Generally, character recognition may be perceived as not a difficult problem when considering MNIST, but the printed letters on the PCB component data are difficult to collect, and have very high redundancy. So if a deep learning model is trained with original data without any preprocessing, it can lead to over fitting problems. Therefore, this study aims to reduce the redundancy to the smallest dataset that can represent large amounts of data collected in limited production sites, and to create datasets through data enhancement to train a flexible deep learning model can be used in various production sites. Moreover, ResNet model verifies to determine which combination of datasets is the most effective. This study discusses how to reduce and augment data that is constantly occurring in real PCB production lines, and discusses how to select coresets to learn and apply deep learning models in real sites.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2011.05a
• /
• pp.202-202
• /
• 2011

최근 대용량 고속송신을 위한 모바일 무선정보통신기기의 신뢰성향상 함께 광 인쇄회로기판(O-PCB)국산화개발이 진행되고 있다. 광 Rigid-MLB개발에 이어 개발추진중인 광 Flexlble PCB는 광 연결 장치는 대용량데이터를 고속 전송하는데 필수적이다. 전원접속코드를 사용하지 않는 광도파로 층으로 구성되며 전기신호를 광신호로 변환시켜 다층의 광도파로 층으로 전송시킨다. 신속한 전송을 위한 균일도금에칭기술이 요구되고 있다.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.47 no.6
• /
• pp.97-104
• /
• 2010

In this paper, ICT (in circuit tester) inspection system and inspection algorithm is proposed and detects whether inferiority exists or not in the mounted device on the flexible PCB in cell phones or mobile display devices. The system is composed of PD (pin-driver) and GGM (ground guarding method). The structural characteristics of these flexible PCB are analyzed, which is needed to input or output the test signal. Test signal to investigate the characteristics of passive components is generated using modified circuit diagram and proposed inspection algorithm. PM (pin-map) is decided on the basis of circuit diagram and has the information about the kind of test signal to be applied and the pad number for the test signal to be connected. PD is designed to load a proper test signal for a specific pad and is adjusted according to PM so that the reconstructed circuit has minimum node and mash. The proposed ICT inspection system is realized using PD and GGM. Using the system, an experiment for each passive component is done to investigate the measurement accuracy of the developed system and an experiment for real flexible PCB model is done to verity the effectiveness of the system.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.132-132
• /
• 2013

본 연구는 R/F-PCB(Rigid/Flexible Printed circuit Board)의 Cu Pattern에 최종 표면처리 방법으로 사용되는 ENIG(Electroless Ni/Immersion Gold) 공정을 대체하여 ECIG(Electroless Co/Immersion Gold)공정을 적용하고자 하는 것으로 무전해 니켈 도금의 장점인 고경도, 내마모성, 납땜성, 내식성을 가지면서 니켈 도금의 취약점인 연성을 개선한 도금액을 개발하고자 하였다. 개발된 도금액을 이용하여 Cu Pattern에 도금할 경우 일반 무전해 니켈 도금에서 나타나는 불량 원인 중 하나인 Space 부분에 도금이 되는 현상이 현저히 감소하였으며, 연성 또한 향상됨을 관찰할 수 있었다.

• IE interfaces
• /
• v.8 no.3
• /
• pp.259-267
• /
• 1995

A printed circuit board auto-insertion line consists of several processes of identical machines and produces several different types of PCBs. Each board must be processed by at most one machine in each process. So, we call it a flexible flow line. The load balancing is the one of the most important issues in the FFL which has many sequential processes. Therefore we have represented the job route selection model to balance the load of inter-process in the PCB auto-insertion line, and validated it by simulation.

• 기계와재료
• /
• v.22 no.1
• /
• pp.30-35
• /
• 2010

전자부품산업이 빠르게 발전하고 있기 때문에 고기능성 PCB의 수요 또한 많이 늘고 있다. 이러한 PCB는 전자제품의 굴곡성(flexibility) 있는 형태로 발전하여 전자제품의 소형화 및 고밀도화가 가능하고, 반복적인 굴곡에 높은 내구성을 갖는 연성(flexible) PCB(FPCB)의 사용이 증가하고 있으며, 이런 시장의 요구에 맞춰 연성 다층 구조의 FPCB에 대한 정밀 고속 가공 기술에 대한 수요도 급격히 확대되고 있다. 따라서 장비 운영의 효율성 극대화 및 설비 투자를 최소화하고 단일 장비로 절단(half cut, full cut), 제거, 트리밍, 리페어 고정 등을 수행할 수 있는 장비 개발을 위한 스캐너/스테이지 고정밀 제어, Z축 스텝가공, 멀티포인트 비전 인식을 통한 왜곡 최소화 등의 요소기술 개발관련 내용을 소개하고자 한다.

• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.109.2-109
• /
• 2001

In the PCB assembly lines, as components become more complex and smaller, the conventional inspection method using traditional ICT and function test show their limitations in application. The automatic optical inspection(AOI) gradually becomes the alternative in the PCB assembly line. In Particular, the PCB inspection machines need more reliable and flexible object recognition algorithms for high inspection accuracy. The conventional AOI machines use the algorithmic approaches such as template matching, Fourier analysis, edge analysis, geometric feature recognition or optical character recognition (OCR), which mostly require much of teaching time and expertise of human operators. To solve this problem, in this paper, a statistical learning based part recognition method is proposed. The performance of the ...

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2009.10a
• /
• pp.421-426
• /
• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.