• Transactions of Materials Processing
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• v.20 no.3
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• pp.206-213
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• 2011

A flexible die, which is composed of a number of punches with adjusted heights to form a three-dimensional curved surface, is a crucial part of a flexible forming technology. In this study, the punch and control system of the flexible die were designed. The flexible die is divided into three modules, namely, punch, control and joint, and the corresponding modules were developed. The punch module materializes a three-dimensional forming surface by the control module, which is composed of an AC servo motor set and a linear guide. The joint module is necessary for the sequential motion between the servo motor set and the punch module. A sequential motion algorithm for the AC servo motor set, that uses the data of the punch relative heights, was also proposed. Finally, a flexible stretch forming test was carried out using the presently designed flexible die.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.2
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• pp.51-58
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• 2014

As WSNs(Wireless Sensor Networks) are being deployed widely in diverse application areas, their management and maintenance become more important. Recent sensor node software takes modular software architectures in pursuit of flexible software management and energy efficient reprogramming. To realize an flexible and efficient modular architecture particularly on resource constrained mote-class sensor nodes that are implemented with MCUs(Micro-Controller Units) of a single address space. an appropriate module linking model is essential to resolve and bind the inter-module global symbols. This paper identifies a design space of module linking model and respectively their implementation frameworks. We then establish a taxonomy for module linking models by exploring the design space of module linking models. Finally, we suggest an implementation framework respectively for each module linking model in the taxonomy. We expect that this work lays the foundations for systematic innovation toward more flexible and efficient modular software architectures for WSNs.

• Smart Structures and Systems
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• v.18 no.4
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• pp.663-682
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• 2016

Continuum manipulators as a kind of mechanical arms are useful tools in special robotic applications. In medical applications, like colonoscopy, a maneuverable thin and flexible manipulator is required. This research is focused on developing a basic module for such an application using shape memory alloys (SMA). In the structure of the module three wires of SMA are uniformly distributed and attached to the circumference of a flexible tube. By activating wires, individually or together, different rotation regimes are provided. SMA model is used based on Brinson work. The SMA model is combined to model of flexible tube to provide a composite model of the module. Simulating the model in Matlab provided a platform to be used to develop controller. Complex and nonlinear behavior of SMA make the control problem hard especially when a few SMA actuators are active simultaneously. In this paper, position control of the two degree of freedom module is under focus. An experimental control strategy is developed to regulate a desired position in the module. The simulation results present a reasonable performance of the controller. Moreover, the results are verified through experiments and show that the continuum module of this paper would be used in real modular manipulators.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.74-78
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• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.119-126
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• 2019

A flexible thermoelectric module, which consisted of 18 pairs of Bi₂Te₃-based hot-pressed p-n thermoelectric legs, were processed by filling the module inside with polydimethylsiloxane (PDMS) and removing the top and bottom substrates. Its power generation properties and bending characteristics were measured. With putting the flexible module on the wrist, an open circuit voltage of 2.23 mV and a maximum output power of 1.69 ㎼ were generated during staying still. On the other hand, an open circuit voltage of 3.32 mV and a maximum output power of 3.41 ㎼ were obtained with walking motion. The resistance variation of the module was kept below 1% even after applying 30,000 bending cycles with a bending curvature radius of 25 mm.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.84.1-84.1
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• 2010

Currently, new and renewable energy come into the spotlight, such as solar energy, wind power, fuel cell, hybrid car etc., due to the energy resource is being depleted. Especially, in order to solve like this problem, the study of solar cell manufacturing systems are being extensively researched such as vacuum process. But the major fault of the vacuum process are its expensive production price. On the order hand, Roll-to-roll printing system, the new technology of solar cell manufacturing, has low production price compare with the vacuum process. Also roll-to-roll printing system can decrease the 95% of waste water and 99.9% of harmful gasses than the vacuum process. So we addressed the roll to roll printing system for the flexible solar cell by using printing technology. This roll-to-roll printing system is comprised of various modules, such as web handling module, fine pattern printing module, dry/curing module, uniform coating module and laminating module etc.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1979-1981
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• 2002

새로운 방식의 일체형 flexible sensor module을 제작하였다. MEMS공정을 이용하여 제작된이 센서 모듈은 배선기판은 물론 strain sensor 역시 임의의 곡면에 실장을 위해 자유로운 굽힘이 가능하도록 제작되었다. 실리콘웨이퍼에 구현된 piezoresistor 스트레인 센서는 release-etch 방법을 통해 웨이퍼로부터 분리되어, 폴리이미드를 기판으로 하는 Flexible Sensor Array Module로 완성되었다. 소자와 기판을 따로 제작한 후 조립하는 기존의 방식에 비해, 웨이퍼 위에서 flexible 기판을 형성하여 수율이 높고 사진공정의 정밀도를 그대로 보전한 기판과 센서 어레이의 패키징이 가능하였으며, 칩을 기판에 실장하기 위한 정밀한 조립공정도 불필요하였다. 폴리이미드 기판은 전기도금을 통해 회로를 구성하여 1단계 패키징 (die to chip carrier)과 2단계 패키징 (chip to substrate)을 웨이퍼 레벨에서 완성하였다. 마지막으로 불산 용액을 통해 희생층을 제거함으로서 웨이퍼로 부터 센서어레이 모듈을 분리 하였다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.2
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• pp.140-150
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• 1995

A symbolic layout generator, called Flexible Module Generator (FMG), has been developed for transgorming a given CMOS circuit netlist into an optimized symbolic layout. Contrary to other conventional module generators which place transistors either in horizontal or in vertical direction, FMG places transittors in any hence can multiples of 90$^{\circ}$. This flexible layout style can maximize the diffusion sharing and hence can reduce the wire-length for both of area minimization and performance improvement. In FMG, transistors are initially randomly placed and then selected transistors are iteratively replaced using an optimization technique based on simulated evolution. Whenever a transistor is replaced, the affected nets are rerouted. Constraints on the shape, aspect ratio, and critical path delays are considered during the optimization process. Routing is performed by using a modified maze router on polysilicon, metal 1, and metal 2 interconnection layers. additional routing grids are added, if necessary, for complete routing. Unused rows or columns are removed after routing for area minimization. Experimental reasults show that FMG synthesizes satisfactory layouts.