• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.996-998
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• 2004

In this study, we tested parylene as the passivation layer for flexible organic light emitting diodes (FOLEDs).Parylene as passivtion layer has several advantages which are good optical transparent and low moisture penetration. For more an effective passivation of FOLEDs, we suggest hybrid passivation layer with parylene and silicon oxide. We compared electrical properties and stability of the device with and without passivation layer. The lifetime of FOLED with hybrid passivation layer was increased over three times than that of non-passivated of FOLED.

• Journal of Information Display
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• v.6 no.1
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• pp.1-7
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• 2005

We propose new fabrication methods of a pixel-isolated liquid crystal (LC) structure for flexible display applications. In the LC structure fabricated through the proposed method, the patterned interpixel walls for sustaining the cell thickness are supported by the solidified polymer layer through anisotropic phase separation of LC/polymer composite, causing the alignment of the LC molecules to have very good mechanical stability against external pressure. In addition, we show that such pixel-isolating walls can be made by the stamping method which can be applied to fabricate large size plastic LCDs by roll-to-roll processing.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.25-28
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• 2000

In this paper, three types of organic electroluminescent devices(OELD) were fabricated on mechanically flexible plastic substrate by using vacuum deposition method. The devices consist of a hole transporting material such as TPD, a light-emitting material such as Alq$\sub$3/ and an electron transporting material, blocking material such as PBD. Electrical and optical properties of these OELDs were measured. This paper shows that organic small molecules based on OELD can be successfully deposited on a flexible plastic substrate. This points open the potential for low cost mass production of flexib]e displays, including roll to roll processing.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.543-548
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• 2011

The inkjet printing technology has undergone remarkable development since the concept of printed electronics was first introduced. The large interest which it has sparkled is due to its many enticing features such as processing simplicity, low cost and scalability as well as its compatibility with flexible electronics. Thanks to constant improvements, inkjet printing has nowadays become a mature technology which is an effective replacement for a number of intricate and expensive conventional laboratory tools and is also on the verge of gaining industrial significance. Technological challenges which still remain open include low temperature processing, high density integration and reproducibility. This paper reviews some recent advances in the inkjet printing technology, addressing those issues. And we also discuss a number of novel approaches to performing inkjet printing.

• ETRI Journal
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• v.44 no.1
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• pp.147-154
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• 2022

We demonstrate a new double-layer structure for stretchable interconnects, where the top surface of a serpentine polyimide support is coated with a thin eutectic gallium-indium liquid metal layer. Because the liquid metal layer is constantly fixed on the solid serpentine body in this liquid-on-solid structure, the overall stretching is accomplished by widening the solid frame itself, with little variation in the total length and cross-sectional area of the current path. Therefore, we can achieve both invariant resistance and infinite fatigue life by combining the stretchable configuration of the underlying body with the freely deformable nature of the top liquid conductor. Further, we fabricated various types of double-layer interconnects as narrow as 10 ㎛ using the roll-painting and lift-off patterning technique based on conventional photolithography and quantitatively validated their beneficial properties. The new interconnecting structure is expected to be widely used in applications requiring high-performance and high-density stretchable circuits owing to its superior reliability and capability to be monolithically integrated with thin-film devices.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.29-34
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• 2009

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.294-299
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• 1987

The concept of FMS (Flexible Manufacturing System) has been widely used in discrete parts manufacturing environment. But, it is very difficult to analyze enotrol FMS due to its complex and dynamic behaviour. This paper describes a Simulation program for performance evaluation of FMS. The program is written in FORTRAN and is capable of simulating different configurations.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.261-264
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• 2007

We developed a non self-aligned poly-silicon TFTs fabrication process at two different temperatures on spin-coated polyimide layer above Si-wafer. After TFTs fabrication, the polyimide layer was mechanically released from the Si-wafer and the devices characteristics were compared. In addition self-heating and hot-carrier induced instabilities were analysed.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.29B no.1
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• pp.58-66
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• 1992

This paper proposes a neuro-controller for position control of one-link flexible robot arm. Basically the controller consists of a multi-layer neural network and a conventional PD controller. Two controller are parallelly connected. Neural network is traind by the conventional error back propagation learning rules. During learning period, the weights of neural network are adjusted to minimize the position error between the desired hub angle and the actual one. Finally the effectiveness of the proposed approach will be demonstrated by computer simulation.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.3-12
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• 2013

Wireless Sensor Network (WSN) is used in the railway field in terms of efficient management and maintenance. Sensor communication technology based on IEEE 802.15.4/ZigBee is used in low speed train. However, it is difficult to apply in the high speed train that exposed to severe wireless channel environments. In this paper, we propose the sensor communication algorithm for high speed train environment. we improve error rate and throughput using Equalizer, Multiple Input Multiple Output (MIMO), Flexible Spreading Factor (SF) and Modulation. Also, we have analyzed the performance of the IEEE 802.15.4/ZigBee based on the standard of physical layer of 2.4GHz band in each algorithms. Simulation results show that proposed algorithms can improve error rate and throughput of conventional system.