• 소성∙가공
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• 제12권2호
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• pp.116-122
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• 2003

In the Prestressed die design for cold working, many constraining conditions should be considered to insure the die safety and to improve the dimension accountancy products. Among the constraining conditions, yielding conditions, diameter ratios and interferences between rings are very important. . In this paper, therefore, flexible tolerance method was used in order to search the optimum values of design variables. The maximum inner pressure is used as objective function in this numerical analysis. In the design Process, it was also involved the safety factor to the yield strength of each ring by considering the allowable tensile or compressive hoop stress in each ring. The proposed technique has been applied to the die design of backward extrusion process, and it's analytical results have been compared with that of the conventional design method.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.79-84
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• 2016

유연전자소자가 외부힘에 의해 변형될 경우 반도체 다이가 기계적 응력 때문에 변형되거나 파괴되고 이러한 변형이나 파괴는 channel의 전자이동도를 변화시키거나 배선의 저항을 증가시켜 집적회로의 동작 오류를 발생시킨다. 따라서 반도체 집적회로는 굽힘 변형이 발생해도 기계적 응력이 발생하지 않는 중립축에 위치하는 것이 바람직하다. 본 연구에서는 굽힘변형을 하는 flip-chip 접합공정이 적용된 face-down flexible packaging system에서 중립축의 위치와 파괴 모드를 조사하였고 반도체 집적회로와 집중응력이 발생한 곳의 응력을 감소시킬 수 있는 방법을 제시하였다. 이를 위해, 설계인자로 유연기판의 두께 및 소재, 반도체 다이의 두께를 고려하였고 설계인자가 중립축의 위치에 미치는 영향을 조사한 결과 유연기판의 두께가 중립축의 위치를 조절하는데 유용한 설계인자임을 알 수 있었다. 3차원 모델을 이용한 유한요소해석 결과 반도체 다이와 유연기판 사이의 Cu bump 접합부에서 항복응력보다 높은 응력이 인가될 수 있음을 확인하였다. 마지막으로 flexible face-down packaging system에서 반도체 다이와 Cu bump 의 응력을 감소시킬 수 있는 설계 방법을 제안하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.19-22
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• 2003

In this study, the design of prestressed die for spur gear forging have been investigated. The stress concentration at notch of the die insert is very important in the design of die for the forging of spur gear such as non-axisymmetric geometry. In the previous study, the flexible tolerance method was used in order to search the optimal value of design variables considering the constrain conditions. In the design process, it was also involved the safety factor to the yield strength of each ring by considering allowable tensile or compressive hoop stress in each ring. Using this technique, the die deign for spur gear forging has been successfully performed without yielding of the die after shrink fitting and during forging.

• 소성∙가공
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• 제19권8호
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• pp.486-493
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• 2010

A shape error of the sheet metal product made by a flexible stretch forming process is occurred by a various forming parameters. A die used in the flexible stretch forming is composed of a punch array to obtain the various objective surfaces using only one die. But gaps between the punches induce the shape error and the defect such as a scratch. Forming parameters of the punch size and the elastic pad to prevent the surface defect must be considered in the flexible die design process. In this study, tendency analysis of shape error according to the forming parameters in the flexible stretch process is conducted using a finite element method. Three forming parameters, which are the punch size, the objective curvature radius and the elastic pad thickness, are considered. Finite element modeling using the punch height calculation algorithm and the evaluation method of the shape error, which is a representative value for the formability of formed surface, are proposed. Consequently, the shape error is in proportion to the punch size and is out of proportion to the objective curvature radius and the elastic pad thickness.

• 한국정밀공학회지
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• 제22권1호
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• pp.167-174
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• 2005

The design for cold extrusion dies is very important, because the die insert is subjected to very high radial and hoop stresses. The design of cold extrusion dies has many constrained conditions. In this paper, the used assumptions are such that the yield strength of each ring is selected according to the allowable tensile or compressive hoop stress in each ring and the maximum allowable inner pressure, when yielding occurs in one ring of the dies, is obtained by the proposed equation. In order to obtain design variables, such as diameter ratios and interferences, using the maximum inner pressure, the flexible tolerance method was used for shrink-fitted thick-walled cylinders. ANSYS APDL was used to perform the repeated analysis of deformation of the dies due to the variation of the design variables. The response surface methodology is utilized to analyze the relationship between the design variables and the maximum radial displacement of the die insert during extrusion. From the results, it is found that outer diameter of the die insert has the largest effect on the minimization of maximum radial displacement at the inner surface of the dies.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.179-179
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• 2009

For the deposition of the semiconductor nanocrystals or quantum dots, it is required to have the substrates with smooth surface roughness. Slot-die coating method wad adopted and optimized varying the processing parameters like coating speed, gap distance, solution concentration, etc to get the smooth coated films on flexible substrates. The coating speed in slot-die method was varied from 1 m/min to 2.5 m/min focusing especially on its industrial usage. The gap distance between the substrate surface and slot-die lip was changed also to control mainly the thickness of coated films.

• 한국기계가공학회지
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• 제12권6호
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• pp.30-36
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• 2013

An FFD(flexible fine die) is an embossed mold that consists of a thin plate ranging from 0.6 to 3 mm in thickness. FFDs are primarily used for cutting LCD films and F-PCB sheets. In the high-speed micro-milling process of flexible fine dies, the lubrication and cooling of the cutting edges is very important from the aspect of eco machining and cutting performance. In this paper, a comparative study of tool wear and surface roughness between cutting fluid and hybrid lubrication for eco-machining of FFD was conducted for processes of high-speed machining of highly hardened material (STC5, HRC52). Especially, the incorporated fluid method for eco machining, in which the cutting performances can be simultaneously measured, was introduced. The machining results show that hybrid lubrication, instead of conventional cutting fluid, leads to excellent tool wear and surface roughness and represents the proper conditions for eco micro-machining of flexible fine dies.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.201.1-201.1
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• 2014

본 연구에서는 Slot die coating 공법으로 코팅된 Poly (3-4 ethylenedioxythiophene): Poly (styrenesulfonate) (PEDOT:PSS) 박막과 비정질 ITO 박막의 전기적, 광학적, 기계적 특성을 비교 평가하여 Slot die coating 공법으로 코팅된 PEDOT:PSS 박막의 유기태양전지의 전극으로서의 적용가능성을 확인하였다. 상업용 PEDOT:PSS 박막은 보통 280 Ohm/sq.의 면저항과 가시광 영역에서 약 80%의 광투과도를 나타내며, 비정질 ITO 박막과 유사한 전기적, 광학적 특성을 나타내었다. Slot die coating 공법을 통해 제작된 PEDOT:PSS 투명 전극과 비정질 ITO 투명 전극의 기판 휘어짐에 따른 전기적 안정성을 비교 평가하기 위해 25 mm에서 1 mm까지 radius 변화에 따른 저항의 변화를 측정하였다. 그 결과, 비정질 ITO 투명 전극 대비 PEDOT:PSS 투명 전극이 더 우수한 전기적 안정성을 나타냄을 확인하였다. 또한, 다양한 Bending test (Inner/Outer bending, Rolling, Stretching, Twisting) 를 통해 비정질 ITO 투명 전극 보다 Slot die coating 공법으로 코팅된 PEDOT:PSS 투명 전극의 우수한 기계적 특성을 확인하였다. 이를 바탕으로 Flexible 유기태양전지에의 적용 가능성을 알아보기 위해 Slot die coating 공법으로 코팅된 PEDOT:PSS 투명 전극과 비정질 ITO 투명 전극을 유기태양전지의 anode 층에 적용하여 각각 제작하고 그 특성을 평가하였다. 비정질 ITO 투명 박막을 적용한 유기태양전지 대비 Slot die coating 공법으로 코팅된 PEDOT:PSS 투명 박막으로 제작한 유기태양전지에서 더 높은 효율이 나타났으며, 이로써 Slot die coating 공법으로 코팅된 PEDOT:PSS 투명 전극의 Flexible 유기태양전지로써의 적용 가능성을 확인하였다.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• 소성∙가공
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• 제20권2호
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• pp.124-131
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• 2011

A flexible stretch forming process is useful for small quantity batch production because various shape changes of the flexible die can be achieved conveniently. In this study, the design variables, namely, the punch size, curvature radius and elastic pad thickness, were quantitatively evaluated to understand their influence on sheet formability using statistical methods such as the correlation and regression analyses. Forming simulations were designed and conducted by a three-way factorial design to obtain numerical values of a shape error. Linear relationships between the design variables and the shape error resulted from the Pearson correlation analysis. Subsequently, a regression analysis was also conducted between the design variables and the shape error. A regression equation was derived and used in the flexible die design stage to estimate the shape error.