• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.11-16
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• 2005

This paper presents fabrication process and experimental results of two different types of flexible MEMS biosensors based on polymer/metal multilayer processing techniques. One type of a biosensor is a microelectrode array (MEA) for nerve signal monitoring through implanting the MEA into a living body, and another is a tactile sensor capable of being mounted on an arbitrary-shaped surface. The microelectrode array was fabricated and its electrical characteristics have been examined through in vivo and in vitro experiment. For sensitive skin, flexible tactile sensor array was fabricated and its sensitivity has been analyzed. Mechanical flexibility of these biosensors has been achieved by using a polymer, and it is verified by implanting a MEA to an animal and mounting the tactile sensor on an arbitrary-shaped surface.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.6
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• pp.569-577
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• 2010

Nonplanar surface geometries of components are frequently encountered in real ultrasonic inspection situations. Use of rigid array transducers can lead to beam defocusing and reduction of defect image quality due to the mismatch between the planar array and the changing surface. When a flexible array is used to fit the complex surface profile, the locations of array elements should be known to compute the delay time necessary for adaptive heam focusing. An alternative method is to employ the time reversal focusing technique that does not require a prior knowledge about the properties and structures of the specimen and the transducer. In this paper, a time reversal method is applied to simulate beam focusing of flexible arrays and imaging of point-like defects contained in specimens with nonplanar surface geometry. Quantitative comparisons are made for the performance of a number of array techniques in terms of the ability to focus and image three point-like reflectors positioned at regular intervals. The sinusoidal profile array studied here exhibits almost the same image quality as the flat, reference case.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.163-164
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1035-1036
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• 2013

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.714-717
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• 2008

In this paper, we propose a three-dimensional (3D) integral imaging system using an elastic lens array instead of conventional rigid lens array. The lens array is made of polydimethylsiloxane (PDMS) that is optically transparent and flexible material. We can stretch the PDMS lens array to be expanded into a certain extent, and control the lens pitch of the system easily. That flexible design enables a fine 3D integral imaging display.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.9
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• pp.837-842
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• 2009

The efficient dynamic modeling of a satellite with flexible solar arrays is established by using the component mode synthesis technique. A flexible satellite model can be defined as the assembly of two sub-structures, central body and solar array. The reduced models of each substructure, which are expressed in each local frame, are coupled with respect to the satellite reference frame. The dynamic modeling method is applied to the numerical example of a satellite with a single solar array, and is verified by investigating the transfer function results with considering the solar array rotation.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.331-334
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• 2008

The replica of highly ordered nano-sphere array patterns were fabricated using hot embossing method. First, silica nano-sphere array on Si substrate was transferred to PVC film at $130^{\circ}C$ and 7 bar using hot embossing process. Then, silica nano-sphere array on PVC template was removed by soaking the PVC film in buffered oxide etcher. In order to form anti-stiction layer, the PVC template was coated with silicon dioxide layer and self-assembled monolayer. Through UV nanoimprint lithography with the fabricated flexible PVC template, highly ordered nano-sphere array pattern was imprinted on curved substrates with high fidelity.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.91-95
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• 2006

High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.