• Title/Summary/Keyword: Fixed Pattern Noise

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Optimal Switching Pattern of Voltage Source Inverter (전압원인버어터의 최적스위칭패턴)

  • 정필선;정동화;이윤종
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.12 no.4
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    • pp.386-398
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    • 1987
  • This paper is proposed the Suboptimal PAWM(Pulse Amplitude Width Modulation) for minimize harmonic effects generated by switching operation of PWM Inverter. This strategy determine one switching pattern at a fixed point(fundamental) voltage u1=1.2) which THD(Total Harmonic Distortion) are minimized in the suboptimal PWM strategy, and controls only frequency in the inverter while voltage control is carried out by DC Chopper in the DC Link. This strategy is applied at VSD(Variable Speed Drive) of Three phase induction moter, and acoustic noise of motor, line to line voltage and current of inverter, current harmonic spectrum was estimated and also compared with other switching strategy. From the results, the validity of this strategy can be verified.

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A Low Power Dual CDS for a Column-Parallel CMOS Image Sensor

  • Cho, Kyuik;Kim, Daeyun;Song, Minkyu
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.4
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    • pp.388-396
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    • 2012
  • In this paper, a $320{\times}240$ pixel, 80 frame/s CMOS image sensor with a low power dual correlated double sampling (CDS) scheme is presented. A novel 8-bit hold-and-go counter in each column is proposed to obtain 10-bit resolution. Furthermore, dual CDS and a configurable counter scheme are also discussed to realize efficient power reduction. With these techniques, the digital counter consumes at least 43% and at most 61% less power compared with the column-counters type, and the frame rate is approximately 40% faster than the double memory type due to a partial pipeline structure without additional memories. The prototype sensor was fabricated in a Samsung $0.13{\mu}m$ 1P4M CMOS process and used a 4T APS with a pixel pitch of $2.25{\mu}m$. The measured column fixed pattern noise (FPN) is 0.10 LSB.

Nonuniformity Correction Algorithm of Infrared Images Considering Readout Circuit Architecture (Readout 회로의 구조를 반영한 적외선 영상의 불균일 보정기법)

  • Choi, Eun-Cheol;Kang, Moon-Gi
    • Proceedings of the KIEE Conference
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    • 2007.10a
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    • pp.429-430
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    • 2007
  • FPA (Focal Plane Arrary)를 이용한 적외선 영상 획득 시스템에서 발생하는 주요 잡음 중 하나는 영상에 존재하는 공간적 고정 패턴 잡음(SFPN, Spatial Fixed Pattern Noise)이다. 이것이 발생하는 주된 요인은 배열을 이루고 있는 각 검출기들과, FPA 출력단에 있는 증폭기의 입출력 응답이 균일하지 않고, 시간이 흐름에 따라 그 응답특성이 변화하기 때문이다. 이 문제를 극복하기 위하여 일반적으로 교정기반 불균일 보정 방법(CBNUC, Calibration Based Nonuniformity Correction)과 장면기반 불균일 보정방법(SBNUC, Scene Based Nonuniformity Correction)이 사용된다. 본 논문은 CBNUC를 사용하는 시스템의 FPA 출력단 회로에 구성된 복수의 증폭기에 존재하는 이득의 차이 및 잡음에 의한 불균일을 보정하기 위한 보간 기법을 제안한다. 실험을 통하여 제안한 기법이 CBNUC 기반 적외선 영상 시스템에서 발생하는 규칙적인 패턴의 SFPN을 효율적으로 제거하는 것을 확인하였다. 또한, 제안한 기법은 CBNUC 기반 적외선 영상 시스템에서 주기적으로 수행해야하는 단일점보정 (OPC, One Point Correction)의 수행횟수를 줄이고, 연산량도 적어 실시간 시스템 구현이 가능하다.

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Pair-Wise Serial ROIC for Uncooled Microbolometer Array

  • Haider, Syed Irtaza;Majzoub, Sohaib;Alturaigi, Mohammed;Abdel-Rahman, Mohamed
    • IEIE Transactions on Smart Processing and Computing
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    • v.4 no.4
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    • pp.251-257
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    • 2015
  • This work presents modelling and simulation of a readout integrated circuit (ROIC) design considering pair-wise serial configuration along with thermal modeling of an uncooled microbolometer array. A fully differential approach is used at the input stage in order to reduce fixed pattern noise due to the process variation and self-heating-related issues. Each pair of microbolometers is pulse-biased such that they both fall under the same self-heating point along the self-heating trend line. A ${\pm}10%$ process variation is considered. The proposed design is simulated with a reference input image consisting of an array of $127{\times}92$ pixels. This configuration uses only one unity gain differential amplifier along with a single 14-bit analog-to-digital converter in order to minimize the dynamic range requirement of the ROIC.

Laser Speckle Imaging Using Adaptive Windowing Method (적응 윈도우 기법을 사용한 레이저 스펙클 영상의 처리)

  • Jin, Ho-Young;Shin, Hyun-Chool
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.47 no.1
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    • pp.97-102
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    • 2010
  • A laser speckle is a random pattern that has a granular appearance produced by reflected light when a coherent laser illuminates an irregular course surface. Most important property of laser speckle is detecting micro-vascular. Speckle image needs image processing to detect micro-vascular. This paper proposes a new image processing method for laser speckle, adaptive window method that adaptively processes laser speckle images in the spatial. Conventional fixed window based LASCA has shortcoming in that it uses the same window size regardless of target areas. Inherently laser speckle contains undesired noise. Thus a large window is helpful for removing the noise but it results in low resolution of image. Otherwise a small window may detect micro vascular but it has limits in noise removal. To overcome this trade-off, we newly introduce the concept of adaptive window method to conventional laser speckle image analysis. We have compared conventional LASCA and its variants with the proposed method in terms of image quality and processing complexity.

Adaptive Cross-Device Gait Recognition Using a Mobile Accelerometer

  • Hoang, Thang;Nguyen, Thuc;Luong, Chuyen;Do, Son;Choi, Deokjai
    • Journal of Information Processing Systems
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    • v.9 no.2
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    • pp.333-348
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    • 2013
  • Mobile authentication/identification has grown into a priority issue nowadays because of its existing outdated mechanisms, such as PINs or passwords. In this paper, we introduce gait recognition by using a mobile accelerometer as not only effective but also as an implicit identification model. Unlike previous works, the gait recognition only performs well with a particular mobile specification (e.g., a fixed sampling rate). Our work focuses on constructing a unique adaptive mechanism that could be independently deployed with the specification of mobile devices. To do this, the impact of the sampling rate on the preprocessing steps, such as noise elimination, data segmentation, and feature extraction, is examined in depth. Moreover, the degrees of agreement between the gait features that were extracted from two different mobiles, including both the Average Error Rate (AER) and Intra-class Correlation Coefficients (ICC), are assessed to evaluate the possibility of constructing a device-independent mechanism. We achieved the classification accuracy approximately $91.33{\pm}0.67%$ for both devices, which showed that it is feasible and reliable to construct adaptive cross-device gait recognition on a mobile phone.

Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

A Study on Color Image Edge detection Using Adaptive Morphological Wavelet-CNN Algorithm (적응 형태학적 WCNN 알고리즘을 이용한 컬러 영상 에지 검출 연구)

  • Baek, Young-Hyun;Shin, Sung;Moon, Sung-Ryong
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 2004.04a
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    • pp.201-205
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    • 2004
  • The digital color image can be distorted by noise for a transmission or other elements of system. It happens to vague of a boundary side in the division of a color image object, especially, boundary side of an input color image is very important because it can be determined to the division and detection element in pattern recognition. Therefore it is boundary part In this paper, it detects the optimal edge with applying this color image to WCNN algorithm, after it does level up a boundary side of a color image by using the adaptive morphology as the threshold of an input color image. Also, it is used not a conventional fixed mask edge detection method but variable mask method which is cal led a variable BBM. It is confirmed by simulation that the proposed algorithm can be got the batter result edge at the place of closing to each edges and having smoothly curved line.

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Scene-based Nonuniformity Correction Algorithm Based on Temporal Median Filter

  • Geng, Lixiang;Chen, Qian;Qian, Weixian;Zhang, Yuzhen
    • Journal of the Optical Society of Korea
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    • v.17 no.3
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    • pp.255-261
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    • 2013
  • Scene-based nonuniformity correction techniques for infrared focal-plane arrays have been widely considered as a key technology, and various algorithms have been proposed to compensate for fixed-pattern noise. However, the existed algorithms' capability is always restricted by the problems of convergence speed and ghosting artifacts. In this paper, an effective scene-based nonuniformity correction method is proposed to solve these problems. The algorithm is an improvement over the constant statistics method and a temporal median is utilized with the Gaussian kernel to estimate the nonuniformity parameters. Also theoretical analysis is conducted to demonstrate that effective ghosting artifacts elimination and superior convergence speed can be obtained with the proposed method. Finally, the performance of the proposed technique is tested with infrared image sequences with simulated nonuniformity and with infrared imagery with real nonuniformity. The results show the proposed method is able to estimate each detector's gain and to offset reliably and that it performs better in increasing convergence speed and reducing ghosting artifacts compared with the conventional techniques.

Bolometer-Type Uncooled Infrared Image Sensor Using Pixel Current Calibration Technique (화소 전류 보상 기법을 이용한 볼로미터 형의 비냉각형 적외선 이미지 센서)

  • Kim, Sang-Hwan;Choi, Byoung-Soo;Lee, Jimin;Oh, Chang-woo;Shin, Jang-Kyoo;Park, Jae-Hyoun;Lee, Kyoung-Il
    • Journal of Sensor Science and Technology
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    • v.25 no.5
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    • pp.349-353
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    • 2016
  • Recently, research on bolometer-type uncooled infrared image sensor which is made for industrial applications has been increasing. In general, it is difficult to calibrate fixed pattern noise (FPN) of bolometer array. In this paper, average-current calibration algorithm is presented for reducing bolometer resistance offset. A resistor which is produced by standard CMOS process, on the average, has a deviation. We compensate for deviation of each resistor using average-current calibration algorithm. The proposed algorithm has been implemented by a chip which is consisted of a bolometer pixel array, average current generators, current-to-voltage converters (IVCs), a digital-to-analog converter (DAC), and analog-to-digital converters (ADCs). These bolometer-resistor array and readout circuit were designed and manufactured by $0.35{\mu}m$ standard CMOS process.