• 대한기계학회논문집A
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• 제30권11호
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• pp.1369-1375
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• 2006

In this work, mechanical characteristics of stainless steel diaphragm have been studied as a potential robust substrate and a diaphragm material for micromachined devices. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on a stainless steel diaphragm have been designed, fabricated and characterized. The fabrication process for stainless steel micromachined devices keeps the membrane and substrate being at the environment of 8.65MPa pressure and $175^{\circ}C$ for a half hour and then subsequently cooled to $25^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated stainless steel film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the device fabricated using these technologies is 9.03 ppm $kPa^{-1}$ with a net capacitance change of 0.14 pF over a range 0$\sim$180 kPa.

• 마이크로전자및패키징학회지
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• 제20권1호
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• pp.21-26
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• 2013

본 연구는 유한 요소 시뮬레이션을 이용하여 계산한 시편의 곡률과 3D 스캐너로 측정한 곡률을 비교하여 패키지 기판 구조의 휨 거동을 예측하는 새로운 분석 방법을 제안한다. 패키지 기판은 프리프레그 경화나 구리 패턴 도금과 같은 다양한 공정을 거치면서 쉽게 휘게 된다. 기판의 휨이 어떤 공정에서 어느 정도 생기는지를 알아보기 위하여 다양한 종류의 시편을 제작하고 각 시편의 형상을 3D스캐너를 이용하여 측정하였다. 그 후 시편의 형상으로부터 film에 걸리는 잔류 응력을 휨을 이용한 수식으로부터 계산하였다. 패키지 기판에 들어가는 절연체는 수지와 서로 직교 존재하는 섬유의 다발로 구성되어 있는 복합재료로서 이방성을 띄게 되는데 이는 패키지 기판의 독특한 굽힘 거동을 일으킨다. 우리는 유한 요소 법에 의한 휨 변형을 시뮬레이션하고 측정 데이터를 이용하여 시뮬레이션 휨을 비교하였다. 측정된 휨으로부터 계산한 전해 구리 도금 응력은 약 58 MPa이다. 솔더 레지스트와 프리프레그의 경화 응력은 각각 실온에서 13 MPa 및 6.4 MPa 정도이다.

• Journal of the Optical Society of Korea
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• 제17권3호
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• pp.269-274
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• 2013

The effect of diffusing substrate and pillow lenses on the outcoupling efficiency of organic light-emitting diodes (OLEDs) was studied by optical simulation based on the point-dipole model. The diffusing substrate included Mie scatterers by which the condition of total internal reflection could be broken. The finite-difference time-domain method was used to obtain the intensity distribution on the transparent electrode of an OLED, which was used as a light source to carry out a ray-tracing simulation of the OLED and the diffusing substrate. It was found that the outcoupling efficiency of the OLED was sensitive to the thickness of organic layers and could be increased by 21.0% by adopting a diffusing substrate in which Mie scatterers whose radius was $2.0{\mu}m$ were included at the density of $10^7mm^{-3}$ and by 65.5% by forming one pillow lens with the radius of 2 mm on the front surface of the glass substrate. This study revealed that the outcoupling efficiency could be improved by adopting diffusing substrate and pillow lenses along with the optimization of the thickness of each layer in the OLED.

• 한국전자파학회논문지
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• 제11권7호
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• pp.1240-1246
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• 2000

본 논문에서는 유한차분 시간영역 방법을 적용하여 단일 계단형 마이크로스트립 기판 불연속 구조를 해석하였으며, 이 결과를 사용하여 LC 등가회로를 구성하였다. 본 논문에서 제안된 구조는 마이크로스트립 선로의 길이 방향으로 계단형 기판 불연속을 가지며, 패치 안테나의 급전선, 회로 모듈간 연결 등에 적용될 수 있다. FDTD 해석결과는 HFSS를 이용하여 얻어진 결과와 비교하여 잘 일치함을 보였다. 개발된 등가회로는 S11과 S21 모두 2.4% 이내의 정확도를 가지며, 마이크로파 회로의 CAD 설계에 응용될 수 있다.

• Transactions on Electrical and Electronic Materials
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• 제14권5호
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• pp.225-230
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• 2013

This paper presents a novel shunt radio frequency microelectromechanical system switch on a quartz substrate with stiff ribs around the membrane. The buckling effects in the switch membrane and stiction problem are the primary concerns with RF MEMS switches. These effects can be reduced by the proposed design approach due to the stiffness of the ribs around the membrane. A lower mass of the beam and a reduction in the squeeze film damping is achieved due to the slots and holes in the membrane, which further aid in attaining high switching speeds. The proposed switch is optimized to operate in the k-band, which results in a high isolation of -40 dB and low insertion loss of -0.047 dB at 21 GHz, with a low actuation voltage of only 14.6 V needed for the operation the switch. The membrane does not bend with this membrane design approach. Finite element modeling is used to analyze the stress and pull-in voltage.

• 대한전자공학회논문지TC
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• 제48권4호
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• pp.92-99
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• 2011

Inductor loaded 패치안테나를 이용한 2 소자 배열 안테나의 기판 크기에 따른 상호결합 특성에 대하여 연구하였다. Inductor loaded 패치안테나를 각각 E-평면과 H-평면상에 배열하여 상호결합 특성을 비교하였다. Inductor loaded 패치안테나를 이용한 배열 안테나는 배열 방향에 상관없이 두 안테나 소자 간의 상호결합 크기가 매우 작았고 상호결합이 작게 발생하는 패치안테나의 중심과 E-평면방향의 기판 가장자리까지의 거리가 유사한 값을 가짐을 알 수 있었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권5호
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• pp.243-248
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• 2001

In this paper, we present theoretical and experimental study on the viscous damping of the on-substrate torsional micromirrors, oscillating near the silicon substrates. In this theoretical study, we develop theoretical models and test structures for the viscous damping of the on-substrate torsional micromirrors. From a finite element analysis, we estimate the theoretical damping coefficients of the torsional micromirrors. From a finite element analysis, we estimate the theoretical damping coefficients of the torsional micromirrors, fabricated by the surface-micromaching process. From the electrostatic test of the fabricated devices, frequency-dependent rotationalvelocity of the micromirrors has been measured at the atmospheric pressure using devices, frequency-dependent rotational velocity of the micromirrors has been measured at the atmospheric pressure using the Mach-Zehnder interferometer system. Experimental damping coefficients have been extracted from the least square fit of the measured rotational velocity within the filter bandwidth of 150 kHz. We have compared the theoretical values and the experimental results on the dynamic performance of the micromirrors. The theoretical analysis overstimates the resonant frequency in the amount of 15%, while underestimating the viscous damping in the factors of 10%.

• 제어로봇시스템학회논문지
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• 제17권2호
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• pp.131-134
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• 2011

In this study, we propose an optimal design and new fabrication method for a slim tactile sensor. Slim tactile sensor can detect 3-axial forces and has suitable flexibility for intelligent robot fingers. To amplify the contact signal, a unique table-shaped structure was attempted. A new layer-by-layer fabrication process for polymer micromachining that can make a 3D structure by using a sacrificial layer was proposed. A table-shaped epoxy sensing plate with four legs was built on top of a flexible polymer substrate. The plate can convert an applied force to a concentrated stress. Normal and shear forces can be detected by combining responses from metal strain gauges embedded in the polymer substrate. The optimal positions of the strain gauges are determined using the strain distribution obtained from finite element analysis.

• Journal of Welding and Joining
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• 제8권4호
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• pp.58-68
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• 1990

The formation of thermal stresses by plasma spraying is generally considered as adverse. Therefore, the knowledge of stress distribution in the deposited layer during and after plasma spraying will be of special interest. In this study finite difference heat transfer analysis and finite element stress analysis were carried out to predict the change of stress distribution in the plasma coated layer with the variations of preheat temperature, number of scan, particle size, and bond coat. The results of the numerical analysis were as follows: 1) Transient stresses developed in the coated layer were up to the level of yiedl strength at the temperature. 2) The tensile stresses were developed in the deposited layer and the surface of the substrate, but the compressive stresses were developed in the rest of the substrate. 3) Transient and residual stresses were significantly affected by the preheat temperature. 4) The variations of temperature of powder particle and number of torch scan changed tensile stress distribution, but made no difference on the magnitude of the stresses. 5) Bond coated layer reduced the stree level of deposited layer.

• Transactions on Electrical and Electronic Materials
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• 제18권1호
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• pp.16-20
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• 2017

A RF-MEMS (radio-frequency microelectromechanical-system) based DPDT (double pole double throw) switch for the Ku band has been designed and analyzed for this article. The switch topology is based on the FG-CPW (finite ground-coplanar waveguide) configuration of a microstrip-transmission line. An FEM-based multiphysics solver is used for the evaluation of the spring constant, stress distribution, and pull-in voltage regarding the requirements of the switch-beam unit. The electromagnetic performance of the switch is investigated for a $675{\mu}m$ thick silicon substrate. For the operational frequency of 14.5 GHz, an insertion loss better than -0.3 dB, a return loss better than -40 dB, and input/output- and output-port isolations better than -35 dB are achieved for the switching unit.