• Title/Summary/Keyword: Finished materials

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Generalized Single Manufacturer and Multiple Retailers Supply Chain Model in JIT Purchasing (JIT구매를 고려한 단일 제조업자-다소매업자의 공급사슬에서 통합재고모형)

  • Kim, Dae-Hong
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.34 no.4
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    • pp.25-34
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    • 2011
  • In this paper, we investigate an inventory system where a single manufacturer purchases and processes raw materials in order to deliver finished goods to multiple retailers. Earlier study in this type of supply chain only consider a single raw material in order to produce finished goods, but we consider multi-raw materials in order to produce finished goods. Also, we develop an iterative solution procedure to find the order quantity for the finished goods and raw materials, and the number of shipments between manufacturer and retailers that minimizes the total cost per unit time of the raw materials ordering and holding, manufacture's setup and finished goods holding, the retailer's ordering and inventory holding. Numerical examples are presented to illustrate that jointly considering the total cost results in less total cost than that of considering them separately.

An integrated manufacturing and distribution model for a multi-echelon structure

  • Hwang, Heung-Suk
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1990.04a
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    • pp.222-244
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    • 1990
  • A multi-echelon structure of manufacturing and distribution system in considered, where the raw materials are transformed into a finished good through a number to manufacturing echelons and it is distributed to the lower echelons(retailers, or customers). The raw material, work-in-process, finished good inventory and the distribution costs are unified into one model. The objective is to determine the ordering policy of raw materials, manufacturing lot size, the number of sub-batch and the distribution policy of the finished good which minimize the annual total system cost. A computer program for a heuristic search technique is developed, by which a numerical example is examined.

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A Study on the Detergency and Functionality of Laminating Finished Fabrics for Outdoor Wear by Repeated Washing (아웃도어용 라미네이팅 가공 직물의 반복세척에 의한 세척성 및 기능성 연구)

  • Hyun, Su Jung;Lee, Jeong Sook
    • Journal of the Korean Society of Clothing and Textiles
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    • v.41 no.3
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    • pp.527-536
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    • 2017
  • This study investigated the detergency and functionality of laminating finished fabrics for outdoor wear based on repeated washing. Laminating finished fabrics were selected as the main fabrics for outdoor wear and used as test fabrics. The effects of outdoor exclusive detergent and normal neutral detergent were examined according to washing time, temperature, rpm and detergent concentration based on the use of a Terg-O-Tometer. Re-soiling of the test fabrics was measured by Florio-Mersereau. Permeability, water repellency, water resistance and absorbency were estimated to measure improvements and effects in regards to outdoor exclusive detergent in optimal washing conditions. The detergent effect of outdoor exclusive detergent was superior compared to normal neutral detergent. Re-soiling was lower with exclusive outdoor detergent than with normal neutral detergent. The measurement of functionality for laminating finished fabrics before and after washing indicated that functionality was decreased with repeated washing.

Evaluation Method of Deterioration Grade for Remodeling Old Educational Facilities(III) - Synthetic Judgment Method of Deterioration Grade of Finished Materials - (교육시설(敎育施設)의 리모델링을 위한 구성재료(構成材料)의 노후화(老朽化) 판정기준(判定基準) 작성(作成)(III) - 주요(主要) 마감재료(材料)의 노후도(老朽度) 종합판정방법(綜合判定方法) 제시(提示) -)

  • Seo, Chee-Ho;Choi, Min-Kwon;Choi, Soo-Kyung;Oh, Se-Chul;Kwon, Yong-Kyun
    • Journal of the Korean Institute of Educational Facilities
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    • v.11 no.1
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    • pp.15-23
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    • 2004
  • Deterioration of the educational facilities built before 1985 is a serious situation. The purpose of this study is to present the efficient remodeling method of old educational facilities. This paper, part III, presents the systemic and synthetic judgment method of deterioration grade of finished materials. Evaluation of the deterioration is carried out in every eight classrooms or building elements divided by the use. And classrooms are divided by several parts for example floor, wall and ceiling etc.. The whole deterioration of the building judges the result of every part collectively.

An Integrated Inventory Model for a Vendor-Buyer Supply Chain in a JIT Purchasing (다원자재를 고려한 구매업자와 공급업자간 공급사슬에서의 통합재고모형에 관한 연구)

  • Kim, Dae-Hong
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.32 no.3
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    • pp.159-167
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    • 2009
  • In this paper, we consider a single-vendor single-buyer supply chain problem where a single vendor orders raw materials from its supplier, then using its manufacturing processes converts the raw materials to finished goods in order to deliver finished goods to a single buyer for effective implementation of Just-In-Time Purchasing. An integrated lot-splitting model of facilitating multiple shipments in small lots between buyer and supplier is developed in a JIT Purchasing environment. Also, an iterative heuristic solution procedure is developed to find the order quantity for finished goods and raw materials, and number of shipments between buyer and supplier. We show by numerical example that when the integrated policy is adopted by both vendor and buyer in a cooperative manner, both parties can benefit.

An Integrated Inventory Model for Multi-Product and its Raw Materials in Just-In-Time Purchasing (JIT구매 하에서 원자재를 고려한 다품목의 통합재고모형에 관한 연구)

  • Kim, Dae-Hong
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.31 no.1
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    • pp.49-58
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    • 2008
  • In this paper, we consider an inventory system where a single supplier purchases and processes raw materials into finished goods in order to deliver finished goods to a single buyer for effective implementation of Just-In-Time Purchasing. An integrated multi-item lot-splitting model of facilitating multiple shipments in small lots between buyer and supplier is developed in a JIT Purchasing environment. Also, an iterative solution procedure is developed to find the order quantity for finished goods and raw materials, and number of shipments between buyer and supplier. We show by numerical example that when the integrated policy is adopted by both buyer and supplier in a cooperative manner, both parties can benefit.

A study on a single production inventory model with decaying items (진부화 제품의 단일 생산 재고 모델에 관한 연구)

  • 소재영;윤덕균
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1995.04a
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    • pp.476-486
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    • 1995
  • In this paper, an attempt has been made to revise Raafat' s(1985) results on an inventory model for decaying raw materials and the finished product at a constant rate which was based on Goyal's integrated inventory model for a single product system. This paper is concerned with scheduling the frequencies of order quantity of several different raw materials on a production inventory model. The purpose of this paper is to present a simple method of deciding the frequencies of order quantity of raw materials, in the sense of minimizing the average total cost of the system. We describe on iterative procedure for directly determining near optimal frequencies of order quantity for the raw materials and the associated fundamental cycle time which can be used for constructing the production duration of the finished product. In cases where feasible schedules cannot be constructed using the values from the iterative procedure, the procedure provides a basis for changing the order quantity frequencies and the fundamental cycle time to obtain feasible schedules. An example is given to illustrate the derived results.

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Reviews About food Safety on Packaging Materials and Printing Ink Solvent (식품용 포장제와 인쇄 용제의 안정성에 관한 연구)

  • An, Duek-Jun;Kim, Youn-Uck;Park, Hoon
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.12 no.2
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    • pp.91-96
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    • 2006
  • The widespread use of packaging materials on food packages sometimes causes off-flavor and deterioration in the food by migration of packaging materials which consist of mainly plastic materials and printing ink solvents. Even though migration of the residual packaging materials does not generally cause safety problems in the contained food, it certainly can generate off-flavor and finally deteriorate quality of the finished product. In highly consumer-oriented markets, quality of the finished product is gaining more importance economically, so profound and thorough study about migration into food to maintain the fine quality of the end product becomes an importance issue. Studies have been conducted about migration of various packaging materials and the chemical reactions between the food components and the materials used for food packaging (Brody, 1989; Mcneal and Breder, 1987; Lawson, G and Lawson, C, 1996). Several of these studies have measured partition coefficient values (Kp) between packaging materials and various food samples and involved finding factors that affected the partitioning behavior of packaging materials into the contained food. However, to enable prediction of partitioning, data are still needed on the relation of packaging material chemical structure and properties to partitioning behavior, and on the partitioning behavior of various food ingredients and the total food compositions.

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Impact-Response of Floor Construction Materials (바닥건축재료의 충결하중에 대한 반응)

  • Jang, Sang-Sik
    • Journal of the Korean Wood Science and Technology
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    • v.23 no.2
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    • pp.83-87
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    • 1995
  • Impact-bouncing height of steel balls dropped from 1m height on various floor materials were measured to evaluate impact-bouncing characteristics depending on floor materials and the effect of these properties on walkability and fatigue of humanbody. Stone and tile finished concrete floor showed the highest bouncing height of around 70%, and soil showed the lowest bouncing height of around 3%. The second highest bouncing height was about 40% which corresponded to terazo finished concrete floor and about twice as high as the bouncing height on concrete floor without finishing. The impact-bouncing height could be lowered to 15~20% by using gum tile on concrete floor. Steel showed similar bouncing height to concrete floor, and wood-based materials showed the second lowest bouncing height next to soil. Among wood-based materials, hardwood species having higher specific gravities showed relatively high bouncing height of 8~24%, softwood species having low specific gravities showed relatively lower bouncing height of 5~18%, and wood composites showed bouncing height of 8~18%. Among all the materials used in this study, wood-based floor materials corresponded to the bouncing height of 10~15% which is considered to be best for humanbody. Surface painting on wood-based materials increased the bouncing height, and the number of bouncing of steel balls after dropping from 1m height increased as the bouncing height increased.

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Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb, Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB (Ni/Au 및 OSP로 Finish 처리한 PCB 위에 스크린 프린트 방법으로 형성한 Sn-37Pb, Sn-3.5Ag 및 Sn-3.8Ag-0.7Cu 솔더 범프 계면 반응에 관한 연구)

  • Nah, Hae-Woong;Son, Ho-Young;Paik, Kyung-Wook;Kim, Won-Hoe;Hur, Ki-Rok
    • Korean Journal of Materials Research
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    • v.12 no.9
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    • pp.750-760
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    • 2002
  • In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.