• 한국정밀공학회지
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• 제34권2호
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• pp.77-81
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• 2017

CP (Commercially Pure) titanium has been widely used in various industries such as in energy plants and bio-materials because of an excellent corrosion resistance and its non-toxicity to the human body. But there are limitations for usage as structural materials due to low strength. The tensile properties of CP titanium could be improved by microstructure refinement such as in a SPD (Severe Plastic Deformation) process. However, high strengthening of CP titanium wire is impossible by SPD processes like ECAP (Equal Channel Angular Pressing), HPT (High-Pressure Torsion), and the ARB (Accumulative Roll Bonding) process. The study purposes are to increase the strength of CP titanium wire by optimization of the cold drawing process and the harmonization with mechanical properties by heat treatments for the next forming process. The optimization process was investigated with regard to the design of drawing dies and the reduction ratio of cross sections. The elongations of high strength CP titanium were controlled by heat treatment.

• Progress in Superconductivity
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• 제13권2호
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• pp.111-116
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• 2011

Since superconducting wires have no resistance, electromagnets based on the superconducting wires produce no resistive heating with DC current as long as the current does not exceed the critical current of the wire. However, unlike resistive wires, superconducting wires exhibit AC heat loss. Embedding fine superconducting filaments inside copper matrix can reduce this AC loss to an acceptable level and opens the way to AC-capable superconducting coils. Here, we introduce an easy and accurate method to measure AC heat loss from sample superconducting coils by measuring changes in the rate of gas helium outflow from the liquid helium dewar in which the sample coil is placed. This method provides accurate information on total heat loss of a superconducting coil without any size limit, as long as the coil can fit inside the liquid helium dewar. With this method, we have evaluated AC heat loss of two superconducting solenoids, a 180-turn solid NbTi wire with 0.127 mm diameter (NbTi coil) and a 100-turn filamented wire with 1.4 mm diameter where 7 NbTi filaments were embedded in a copper matrix with copper to NbTi ratio of 6.7:1 (NbTi-Cu coil). Both coils were wound on 15 mm-diameter G-10 epoxy tubes. The AC heat losses of the NbTi and NbTi-Cu coils were evaluated as $53{\pm}4.7\;{\mu}W/A^2Hzcm^3$ and $0.67{\pm}0.16\;{\mu}W/A^2Hzcm^3$, respectively.

• 한국대기환경학회지
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• 제31권2호
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• pp.118-130
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• 2015

Fine dust containing iron compounds is of current interests in metro subway as well as large scale industries including iron manufacturing and smelting works. This work attempts to find a new design of magnetic filter module for iron dust capture. It simulated the vertical rectangular duct with metal mesh which might promote electric fields in the duct space. A lab test using coal fly ash composed of 8.66% Fe with the most form of $Fe_3O_4$ and $Fe_2O_3$ showed capability of magnetic collection. It showed the capture efficiency with 80~93% for $PM_{2.5}$ depending on magnetic intensity. Ferromagnetic wire mesh contributed up to 50% of collection increment.

• International Journal of Aeronautical and Space Sciences
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• 제8권1호
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• pp.32-45
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• 2007

The T-50 advanced supersonic jet trainer employs the Relaxed Static Stability (RSS) concept to improve the aerodynamic performance while the flight control system stabilizes the unstable aircraft and provides adequate handling qualities. The T-50 flight control laws employ a proportional-plus-integral type controller based on a dynamic inversion method in longitudinal axis and a proportional type controller based on a blended roll system with simple roll rate feedback and beta-betadot feedback system. These control laws are verified by flight tests with various maneuver set flight envelopes and the control laws are updated to resolve flight test issues. This paper describes several concepts of flight control laws used in T-50 to resolve those flight test issues. Control laws for solving the roll-off problem during pitch maneuver in asymmetric loading configurations, improving the departure resistance in negative angle of attack conditions and enhancing the fine tracking performance in air-to-air tracking maneuvers are described with flight test data.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• 한국재료학회지
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• 제6권1호
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• pp.12-21
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• 1996

AI-1wt%Si합금을 대상으로하여 가열주형을 이용한 수평식연속주조법에 의해 경면에면서 일방향고조직을 가진 주괴를 얻기위한 주조조건을 조사하였으며, 일방향응고된 주괴를 이용하여 신선가공하였을 경우의 다이스배열과 작업조건, 연속주조조건과 신선가공시의 단선율과의 관계를 검토하였다. 그 결과, 직경 8mm 및 4mm 주괴 모두 공정 Si상이 비교적 균일하게 분포되어 있음을 확인할 수 있었고, 이들 주괴를 중간소둔없이 20$\mu\textrm{m}$까지의 초극세선가공이 가능했다. 본 연구에서 실시한 극세선의 신선가공중에 발생한 단선은 신선가공중의 작업조건의 불충분에 기인하는 것으로 사료되었다. 따라서, 본 연구에서 얻어진 일방향응고주괴는 극세선제조에 매우 우수한 원소재임을 보여주었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.93-93
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• 2003

Tungsten and tungsten heavy alloys have widespread application as radiation shielding devices and heavy duty electrical contacts. High density and good room temperature mechanical properties have generated interest in evaluating tungsten and tungsten alloys as kinetic energy penetrators against armor. Nowdays ultra fine-grained tungsten powders are in great interest because higly dense structures can be obtained at low temperature, pressure and lower sintering time. Several physical md chemical methods are available for the synthesis of nanometric metal Powders: ball milling, laser abalation, vapor condensation, chemical precipitation, metallic wire explosion i.e. However production rates of the above mentioned methods are low and further efforts are needed to find out large-scale synthesis methods. From this point of view solid state combustion method ( known as SHS) represents undoubted interest.

• 펄프종이기술
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• 제35권3호
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• pp.1-12
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• 2003

The complexity of the papermaking system accelerates interactions between a large number of variables involved. The process operation, therefore, is subject to frequent perturbations by disturbance. Dynamic modelling is a useful tool for characterizing the transient behavior and selecting the best control strategies to reject disturbances. In this study we developed a dynamic simulation model of a fine paper production process, which consists of stock preparation, wire sections, white water circulations, and broke system. It focused on dynamic simulation in its role for developing control strategies and studying control loop dynamics related to filler loading for ash control. The results emphasized the importance of filler-loading position and length of control loop for rapid ash control and process stabilization.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.189-192
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• 2003

The Electro-thermal Explosion Coating (EEC) technique is a new surface treatment technology emerged in recent years. It uses an electrical discharge (with very high voltage from 5 to 30 kV or more) to produce a pulse current with large density inside the material to be deposited, the metal wire undergo the heating, melting, vaporization, ionization and explosion processes in a very short time (from tens ns to several hundreds ${\mu}s$), and the melted droplets shoot at the substrate with a very high velocity (3000 - 4500 m/s), so that the coating materials can be deposited on the surface of the substrate. Coatings with nano-size grains or ultra- fine grains can be formed because of rapid solidification (cooling rate up to $10^6-10^9\;k/s$). Surface of the substrate (about $1-5{\mu}m$ in depth) can be melted rapidly and coatings with very high bonding strength can be obtained.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.21-26
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• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.