• Macromolecular Research
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• v.12 no.4
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• pp.391-398
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• 2004

Thick-film photolithography is a new technology that combines lithography processes, such as exposure and development, with the conventional thick-film process applied to screen-printing. In this study, we developed a low-temperature cofireable silver paste applicable for thick-film processing to form fine lines using photolitho-graphic technologies. The optimum paste composition for forming fine lines was investigated. The effect of processing parameters, such as the exposing dose, had on the fine-line resolution was also investigated. As the result, we found that the type of polymer and monomer, the silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of the fine lines. The developed photoimageable silver paste was printed on a low-temperature cofireable green sheet, dried, exposed, developed in an aqueous process, laminated, and then fired. Our results demonstrate that thick-film fine lines having widths < 20 $\mu\textrm{m}$ can be obtained after cofiring.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.9-13
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• 2006

The copper lines in COF are usually fabricated by subtractive method. As the width of lines are smaller, the subtractive method has a lateral etching problems. In semi-additive method, copper lines are fabricated by lithographic technique followed by electroplating method. Fine line patterns of $10-40{\mu}m$ were used for this study. Two different types of thick photoresist, AZ4620 and PMER900, were employed for PR mold. Copper lines were fabricated by electroplating method. The crack were found in fine copper lines due to high residual stress when normal copper electroplating bath were used. The via filling copper electroplating bath were replaced the normal electroplating bath and then cracks were not found in the fine copper lines. During substrate etching, the lateral etching of copper lines were not occurred.

• Korean Journal of Computational Design and Engineering
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• v.4 no.1
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• pp.19-31
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• 1999

One of the non-photorealistic rendering method, a drawing technique which uses only fine curves and dashed line, is widely employed in an knots and post stamps printing. Engraving of the curves and lines are traditionally performed by human engravers which leads to low productivity in printing preparation. As an effort to improve productivity and quality, a drawing automation method which can easily produce a portrait composed of vector data for laser or chemical engraving is proposed. The method shows that it is possible to draw a portrait by controling the width and length of predefined fine lines according to the gray scales a the end points of each fine lines. A gradually controled weighting factor method is proposed in addition to the author previous works to prevent undesirable boundaries in an identical texture region. User interface functions of a commercial CAD system are heavily employed to exploit the presented method.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 연구논문집
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• s.23
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• pp.155-164
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• 1993

A drawing technique which use only fine curves and dashed lines is widely adopted in banknotes and post stamps printing. Engraving of the curves and lines are traditionally performed by hand skill which provides low productivity in printing. As an effort for higher productivity and quality, a drawing automation method which can easily produce NC codes and drawings for a mechanical or chemical engraving is proposed. An initial work shows that it is possible to draw a portrait by contolling the width and length of predetermined fine lines according to the gray scale at the end points of each line. User interface functions of a commercial CAD system are heavily employed to exploit the presented method.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.54 no.2
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• pp.159-164
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• 2009

The difference of ginsenosides content according to placement of ginseng planting (line) under shading net in 5-year-old ginseng roots were examined. The total saponin ($Rb_1$, $Rb_2$, Rc, Rd, Re, and $Rg_1$) contents were 15.01 mg/g and 21.79 mg/g in the main roots, 35.93 mg/g and 43.32 mg/g in the lateral roots, 87.85 mg/g and 105.51 mg/g in the fine roots for the front $1st{\sim}2nd$ lines in Yunpoong and Landrace variety (purple-stem variant), respectively. In the middle $3rd{\sim}5th$ lines the total saponin contents were 18.73 mg/g and 23.19 mg/g in the main roots, 44.92 mg/g and 43.50 mg/g in the lateral roots, 92.97 mg/g and 110.70 mg/g in the fine roots in Yunpoong and Landrace variety, respectively. In the rear $6th{\sim}7th$ lines the total saponin contents were 21.88 mg/g and 26.68 mg/g in the main roots, 38.41 mg/g and 44.89 mg/g in the lateral roots, 101.03 mg/g and 107.06 mg/g in the fine roots in Yunpoong and Landrace variety, respectively. The differences in total and individual ginsenosides content in the main, lateral and fine roots among the lines were not significant but total ginsenosides contents in the main roots were different in case of Yunpoong variety. The ratios of protopanaxadiol (PD) type saponin to protopanaxatriol (PT) type saponin in roots were lower in the front lines compared to the middle and rear lines and the ratios were significantly different among the parts of roots.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• The Bulletin of The Korean Astronomical Society
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• v.23
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• pp.60-60
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• 1998

• Publications of The Korean Astronomical Society
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• v.32 no.1
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• pp.147-149
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• 2017

Since the launch of the Herschel Space Observatory, our understanding about the photo-dissociation regions (PDR) has taken a step forward. In the bandwidth of the Fourier Transform Spectrometer (FTS) of the Spectral and Photometric Imaging REceiver (SPIRE) on board Herschel, ten CO rotational transitions, including J = 4 - 3 to J = 13 - 12, and three fine structure lines, including [$C{\small{I}}$] 609, [$C{\small{I}}$] 370, and [$N{\small{II}}$] $205{\mu}m$, are covered. I present our findings from the FTS observations at the nuclear region of M83, based on the spatially resolved physical parameters derived from the CO spectral line energy distribution (SLED) map and the comparisons with the dust properties and star-formation tracers. This article discusses (1) the potential of using [$N{\small{II}$] 205 and [$C{\small{I}}$] $370{\mu}m$ as star-formation tracers; (2) the excitation mechanisms of warm CO in the nuclear region of M83.

• Asian Journal of Turfgrass Science
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• v.13 no.3
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• pp.147-151
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• 1999

"Konhee" zoysiagrass[Zoysia matrella (L) Merr.](Patent registration no. 2000-723), a vegetative cultivar, was developed by the Dept. of Horticultural Science, Konkuk University, Seoul. "Konhee" was selected from the cross, ZKV6$\times$ZKV10, in 1997 and F1 seed were produced in the greenhouse in 1996. "Konhee" is superior to the other fine leaf zoysiagrass lines in many traits such as erect type, plant height($8.5\pm$2.0cm), short 3rd stolon length($3.4\pm$0.5cm), dark green, fine leaf($2.3\pm$0.2mm), low first sheath height($0.9\pm$0.2cm), rapid establishment and recoverage, many stolon number, and high shoot density. When "Konhee" was compared to the five other zoysisagrass lines at the DNA level using 35 PCR primers, it had the specific bands with primer No. 740, 544, 765, 772 by RAPD analysis.No. 740, 544, 765, 772 by RAPD analysis.