• 제목/요약/키워드: Fin Array

검색결과 52건 처리시간 0.029초

휜-히트파이프로 구성된 채널에서 히트파이프의 엇갈림배열에 따른 유동 및 열전달 특성 (Flow and Heat Transfer Characteristics due to Staggered Arrangement of Heat Pipes in Channels with Heat Pipes and Fins)

  • 김성훈;진윤근;김철주
    • 설비공학논문집
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    • 제14권11호
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    • pp.871-879
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    • 2002
  • The characteristics of flow and heat transfer in the heat exchanger of heat pipes with fins have been studied numerically for cooling enhancement of electronic components of KTX (Korea Train eXpress). Numerical analysis and methodology have been conformed by comparing the experimental results for inlined array of heat pipes. The staggered arrangement of heat pipes has been proposed in order to achieve heat transfer enhancement. As results, the geometry change to the staggered array is conformed to increase the heat transfer of the system accompanied by an increase of pressure drop. The current results of friction factor and Colburn j factor are presented in terms of Reynolds number and staggered distance, and are expected to use for design and manufacture of such a system.

자동차용 리시버/건조기 일체형 응축기의 성능해석 (Performance Analysis of Integral Receiver/Dryer Condenser for Automobile)

  • 원성필
    • 설비공학논문집
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    • 제19권3호
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    • pp.245-252
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    • 2007
  • The important problems from the point of view of preventing global warming are to save the power consumption of automotive air-conditioning systems and reduce the refrigerant amount filled. To achieve such requirements, integral receiver/dryer (R/D) condensers were developed recently. Typical integral R/D condensers have extra headers that play the role of R/D. Except an extra header and somewhat complex tube array resulting from the extra header, the most integral R/D condensers have almost the same specification that tube has multi channels, fin has louvers, flow in tube is parallel, etc. When integral condensers are applied, it is known that the refrigerating effect increases, resulting from the increase of subcooling degree in condenser, and the refrigerant amount used saves. In spite of several merits, integral condensers have not been applied a lot. That is why there is an uncertainty in performance, using integral condensers. The objective of this study is to theoretically optimize the tube array in an integral R/D condenser that is really being applied to some vehicles. The tube array has a great effect on the performance of the integral condenser as well as common ones. Through computer simulation, we could see that the tube array, 14-6-3-5-3-4, in the same condenser was the best, comparing heat release rate, pressure drop, etc. to the real array, 17-5-3-3-2-5. It should be noted that the optimization is based on the condenser performance only.

상변환물질을 활용한 태양광 패널 표면온도 제어효과 및 최적화 시스템 (Temperature Control for PV Panel Absorbing Heat by Phase Change Material and its Estimation)

  • 이효진;전종한
    • 한국태양에너지학회 논문집
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    • 제30권2호
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    • pp.10-15
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    • 2010
  • The experimental study was conducted to optimize the system dissipating properly heat from the in-situ solar panel installed on the roof. For this purpose, six 12-Watt panels, which were consisted of the different design conditions such as containing phase change material(PCM), changing the array of the aluminum fin and honeycomb at the back of the panel, were tested. PCM, which had $44^{\circ}C$ melting point, was chosen in this study. In order to enhance absorbing and expelling heatin PCM, profiled aluminum fin was placed either inward oroutward from the panel. Furthermore, Aluminum honeycomb is imbedded in the back container to find if it would improve the thermal conductivity of PCM. During the experiment, there were ranged to $26^{\circ}C\sim32^{\circ}C$ for outdoor temperature and $700W/m^2\sim1000W/m^2$ for irradiance. As a result, the solar panel, combined with honeycomb and outward fins with PCM instead of placing the fins inward, is showing the best performance in terms of controling panel temperature and its efficiency.

자연대류 냉각되는 경량고성능 할로우 하이브리드 휜 히트싱크의 열성능에 대한 방향 영향의 전산연구 (Computational study of orientation effects on thermal performance of natural convection cooled lightweight high performance hollow hybrid fin heat sinks)

  • 니코 스띠아완 에벤디;김경준
    • Journal of Advanced Marine Engineering and Technology
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    • 제40권9호
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    • pp.786-790
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    • 2016
  • 본 연구는 자연대류상의 할로우 하이브리드 휜 히트싱크 (HHFHS) 의 열성능에 대한 방향 영향의 전산연구결과에 대해 논한다. HHFHS 는 휜 베이스 근처에 천공을 포함하는 중공 핀 휜과 판 휜의 결합형 휜들의 배열로 구성된다. HHFHS의 베이스면적기반, 질량기반 열성능에 대한 방향영향이 0 ~ 180도의 방향각에 대해서 수치적으로 연구되었고, 유사구조의 핀 휜 히트싱크 (PFHS) 와 비교되었다. PFHS 와 달리 HHFHS 의 열저항은 직립상태에서 45도까지 변화가 미미하며, 이후 증가하여 90도에서 최대이며, 이후로는 180도까지 감소함을 보인다. 이러한 열저항 특성의 차이는 HHFHS의 중공 휜의 내부유동에 의한 열펌핑 효과의 영향으로 사료된다. 다양한 방향각에도 HHFHS 의 질량기반 열저항은 약 30% 정도 PFHS 보다 작음을 보여주는데 이 결과는 자연대류 상의 전자장치에 대한 HHFHS 의 경량열관리 적용 가능성을 보여준다.

CPU 히트싱크에서 핀의 배열이 냉각성능에 미치는 영향에 대한 수치해석 (A Numerical Study on the Effect of Fin-array of Heat-sink on the Cooling Performance of CPU)

  • 김성찬;김건국;전병진;최형권
    • 반도체디스플레이기술학회지
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    • 제15권3호
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    • pp.12-17
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    • 2016
  • In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

마이크로 휜 배열 주위의 자연대류 열전달에 관한 실험 관계식 (Empirical Correlation for Natural Convective Heat Transfer around Microfin Arrays)

  • 김진섭;이준식
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2055-2060
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    • 2007
  • Microfin arrays with fin heights of 100 ${\mu}$m and 200 ${\mu}$m and six different spacings from 30 ${\mu}m$to 360 ${\mu}m$ are fabricated using the DRIE process. Natural convective heat transfer around the microfin arrays on both vertical and horizontal surfaces is experimentally examined. It turns out that the orientation effect of microfin arrays is negligible compared with macrofin arrays. The obtained heat transfer coefficients are compared with the existing heat transfer correlation for the macrofin arrays. It is concluded that the existing macrocorrelation is no longer valid for the microfin arrays. Relevant empirical correlations for microfin arrays on the vertical and horizontal surfaces are presented based on the present experimental data.

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양식산 강도다리(Platichthys stellatus)에서의 비정형 Aeromonas salmonicida 분리 (Isolation of atypical Aeromonas salmonicida in cultured starry flounder (Platichthys stellatus))

  • 김위식;권민수;김휘진;오명주;공경희
    • 한국어병학회지
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    • 제35권2호
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    • pp.247-250
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    • 2022
  • About 6.7% mortality was reported in a starry flounder (Platichthys stellatus) aquaculture farm in 2022. Most of the diseased fish showed a loss of pectoral fin, hemorrhages on muscle and gills, pale gills, enlarged spleen, and nodules on kidney. Parasites, fungi or viruses (viral hemorrhagic septicemia virus and hirame novirhabdovirus) were not detected from diseased fish. However, numerous bacteria were isolated from liver, spleen and kidney. Nucleotide sequences of the A-protein-encoding virulence array protein gene (vapA) of the bacteria showed 99.93% identity with Aeromonas salmonicida subsp. masoucida. This study is the first report of isolation of atypical A. salmonicida in cultured starry flounder in Korea.

원형 핀이 부착된 실린더 주위의 유동 및 열전달에 관한 수치적 연구 (Numerical Study on the Fluid Flow and Heat Transfer Past a Cylinder with a Periodic Array of Circular Fins)

  • 윤현식;전호환;이동혁
    • 대한조선학회논문집
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    • 제43권3호
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    • pp.285-293
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    • 2006
  • Three-dimensional and time-dependent solution for the fluid flow and heat transfer past a circular cylinder with fins is obtained using accurate and efficient spectral methods. A Fourier expansion with a corresponding uniform grid is used along the circumferential direction. A spectral multi-domain method with a corresponding Chebyshev collocation is used along r-z plane to handle fins attached to the surface of a circular cylinder. At the Reynolds number of 300 based on a cylinder diameter, results with fins are compared with those without fins in order to see the effects of the presence of fins on three-dimensional and unsteady fluid flow and heat transfer past a bluff body. The detail structures of fluid flow and temperature field are obtained as a function of time to investigate how the presence of fins changes heat transfer mechanism related to the vortical structure in the wake region.

태양광패널 온도제어를 위한 PCM시스템 최적화에 관한 실험적 연구 (Experimental study for optimizing the thermal regulating system with phase change material on the photovoltaic panel)

  • 이효진;전종한
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2009년도 추계학술발표대회 논문집
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    • pp.273-278
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    • 2009
  • The experimental study is performed to investigate the optimum design of the system dissipating properly heat from the in-situ solar panel installed on site. For this purpose, six 12-Watts panels, which are set at the different conditions of the solar panels contained phase change material, changing the array of the aluminum fin and honeycomb at the back of the panel, are tested. PCM, which has $44^{\circ}C$ melting point, is chosen in this study. In order to enhance the thermal heat from the absorbed heat in PCM, finned aluminum plate is placed. Furthermore, Aluminum honeycomb is imbedded in the back container to find if it would improve the thermal conductivity of PCM. As a result, the solar panel, which is combined with honeycomb and outward fins with PCM instead of placing the fine inward, is showing the best performance in terms of controling panel temperature and efficiency.

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알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 화학적 기계적 연마 특성 평가

  • 김혁민;권태영;조병준;;박진구
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.24.1-24.1
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    • 2011
  • CMP (Chemical Mechanical Planarization)는 고직접도의 다층구조의 소자를 형성하기 위한 표면연마 공정으로 사용되며, pattern 크기의 감소에 따른 공정 중요도는 증가하고 있다. 반도체 소자 제조 공정에서는 낮은 비용으로 초기재료를 만들 수 있고 우수한 성능의 전기 절연성질을 가지는 산화막을 만들 수 있는 단결정 실리콘 웨이퍼가 주 재료로 사용되고 있으며, 반도체 공정에서 실리콘 웨이퍼 표면의 거칠기는 후속공정에 매우 큰 영향을 미치므로 CMP 공정을 이용한 평탄화 공정이 필수적이다. 다결정 실리콘 박막은 현재 IC, RCAT (Recess Channel Array Transistor), 3차원 FinFET 제조 공정에서 사용되며 CMP공정을 이용한 표면 거칠기의 최소화에 대한 연구의 필요성이 요구되고 있다. 본 연구에서는 알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 식각 및 연마거동에 대한 특성평가를 실시하였다. 화학적 기계적 연마공정에서 슬러리의 pH는 슬러리의 분산성, removal rate 등 결과에 큰 영향을 미치고 연마대상에 따라 pH의 최적조건이 달라지게 된다. 따라서 단결정 및 다결정 실리콘 연마공정의 최적 조건을 확립하기 위해 static etch rate, dynamic etch rate을 측정하였으며 연마공정상의 friction force 및 pad의 온도변화를 관찰한 후 removal rate을 계산하였다. 실험 결과, 단결정 실리콘은 다결정 실리콘보다 static/dynamic etch rate과 removal rate이 높은 것으로 나타났으며 슬러리의 pH에 따른 removal rate의 증가율은 다결정 실리콘이 더 높은 것으로 관찰되었다. 또한 다결정 실리콘 연마공정에서는 friction force 및 pad의 온도가 단결정 실리콘 연마공정에 비해 상대적으로 더 높은 것으로 나타났다. 결과적으로 단결정 실리콘의 연마 공정에서는 화학적 기계적인 거동이 복합적으로 작용하지만 다결정 실리콘의 경우 슬러리를 통한 화학적인 영향보다는 공정변수에 따른 기계적인 영향이 재료 연마율에 큰 영향을 미치는 것으로 확인되었으며, 이를 통한 최적화된 공정개발이 가능할 것으로 예상된다.

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